JP2004524703A5 - - Google Patents

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Publication number
JP2004524703A5
JP2004524703A5 JP2002578545A JP2002578545A JP2004524703A5 JP 2004524703 A5 JP2004524703 A5 JP 2004524703A5 JP 2002578545 A JP2002578545 A JP 2002578545A JP 2002578545 A JP2002578545 A JP 2002578545A JP 2004524703 A5 JP2004524703 A5 JP 2004524703A5
Authority
JP
Japan
Prior art keywords
die
substrate
precursor material
forming
bond pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002578545A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004524703A (ja
JP4422411B2 (ja
Filing date
Publication date
Priority claimed from US09/819,393 external-priority patent/US6562663B2/en
Application filed filed Critical
Publication of JP2004524703A publication Critical patent/JP2004524703A/ja
Publication of JP2004524703A5 publication Critical patent/JP2004524703A5/ja
Application granted granted Critical
Publication of JP4422411B2 publication Critical patent/JP4422411B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002578545A 2001-03-28 2002-02-22 ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法 Expired - Fee Related JP4422411B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/819,393 US6562663B2 (en) 2001-03-28 2001-03-28 Microelectronic assembly with die support and method
PCT/US2002/005431 WO2002080229A2 (en) 2001-03-28 2002-02-22 Microelectronic assembly with die support and method

Publications (3)

Publication Number Publication Date
JP2004524703A JP2004524703A (ja) 2004-08-12
JP2004524703A5 true JP2004524703A5 (enExample) 2005-12-22
JP4422411B2 JP4422411B2 (ja) 2010-02-24

Family

ID=25228026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002578545A Expired - Fee Related JP4422411B2 (ja) 2001-03-28 2002-02-22 ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法

Country Status (4)

Country Link
US (2) US6562663B2 (enExample)
EP (1) EP1504468A4 (enExample)
JP (1) JP4422411B2 (enExample)
WO (1) WO2002080229A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352881B1 (en) * 1999-07-22 2002-03-05 National Semiconductor Corporation Method and apparatus for forming an underfill adhesive layer
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
US7423337B1 (en) 2002-08-19 2008-09-09 National Semiconductor Corporation Integrated circuit device package having a support coating for improved reliability during temperature cycling
US7115998B2 (en) * 2002-08-29 2006-10-03 Micron Technology, Inc. Multi-component integrated circuit contacts
US7301222B1 (en) 2003-02-12 2007-11-27 National Semiconductor Corporation Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
TW594955B (en) * 2003-06-30 2004-06-21 Advanced Semiconductor Eng Flip chip package process
US7282375B1 (en) 2004-04-14 2007-10-16 National Semiconductor Corporation Wafer level package design that facilitates trimming and testing
JP5197175B2 (ja) * 2008-06-16 2013-05-15 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
WO2010122757A1 (ja) * 2009-04-24 2010-10-28 パナソニック株式会社 半導体パッケージ部品の実装方法と実装構造体
US9691734B1 (en) * 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9620430B2 (en) * 2012-01-23 2017-04-11 Taiwan Semiconductor Manufacturing Company, Ltd. Sawing underfill in packaging processes
US9622356B2 (en) 2013-03-14 2017-04-11 Lockheed Martin Corporation Electronic package mounting

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JPH0312942A (ja) * 1989-06-12 1991-01-21 Sharp Corp 半導体装置の封止方法および半導体チップ
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5289346A (en) * 1991-02-26 1994-02-22 Microelectronics And Computer Technology Corporation Peripheral to area adapter with protective bumper for an integrated circuit chip
US5496775A (en) * 1992-07-15 1996-03-05 Micron Semiconductor, Inc. Semiconductor device having ball-bonded pads
US5824569A (en) * 1992-07-15 1998-10-20 Micron Technology, Inc. Semiconductor device having ball-bonded pads
DE4405710A1 (de) * 1994-02-23 1995-08-24 Bosch Gmbh Robert Vorrichtung mit einer Trägerplatte und Verfahren zum Aufbringen eines Passivierungsgels
JPH0888464A (ja) * 1994-09-20 1996-04-02 Sony Corp フリップチップ実装方法
US5659203A (en) * 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant
US5804881A (en) * 1995-11-27 1998-09-08 Motorola, Inc. Method and assembly for providing improved underchip encapsulation
US5720100A (en) * 1995-12-29 1998-02-24 Motorola, Inc. Assembly having a frame embedded in a polymeric encapsulant and method for forming same
US5844315A (en) * 1996-03-26 1998-12-01 Motorola Corporation Low-profile microelectronic package
US5821456A (en) * 1996-05-01 1998-10-13 Motorola, Inc. Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US5760337A (en) * 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US6228688B1 (en) * 1997-02-03 2001-05-08 Kabushiki Kaisha Toshiba Flip-chip resin-encapsulated semiconductor device
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
US5895229A (en) * 1997-05-19 1999-04-20 Motorola, Inc. Microelectronic package including a polymer encapsulated die, and method for forming same
US5942798A (en) * 1997-11-24 1999-08-24 Stmicroelectronics, Inc. Apparatus and method for automating the underfill of flip-chip devices
JP3367886B2 (ja) * 1998-01-20 2003-01-20 株式会社村田製作所 電子回路装置
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
US6011301A (en) * 1998-06-09 2000-01-04 Stmicroelectronics, Inc. Stress reduction for flip chip package
US6391762B1 (en) * 1999-11-12 2002-05-21 Motorola, Inc. Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same
US6294840B1 (en) * 1999-11-18 2001-09-25 Lsi Logic Corporation Dual-thickness solder mask in integrated circuit package
US6214650B1 (en) * 2000-02-01 2001-04-10 Lockheed Martin Corporation Method and apparatus for sealing a ball grid array package and circuit card interconnection
US6483196B1 (en) * 2000-04-03 2002-11-19 General Electric Company Flip chip led apparatus
US6372544B1 (en) * 2000-06-23 2002-04-16 Advanced Micro Devices, Inc. Method to reduce occurrences of fillet cracking in flip-chip underfill
KR100443504B1 (ko) * 2001-06-12 2004-08-09 주식회사 하이닉스반도체 볼 그리드 어레이 패키지 구조 및 그 제조방법

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