JP2002538626A5 - - Google Patents

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Publication number
JP2002538626A5
JP2002538626A5 JP2000603092A JP2000603092A JP2002538626A5 JP 2002538626 A5 JP2002538626 A5 JP 2002538626A5 JP 2000603092 A JP2000603092 A JP 2000603092A JP 2000603092 A JP2000603092 A JP 2000603092A JP 2002538626 A5 JP2002538626 A5 JP 2002538626A5
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JP
Japan
Prior art keywords
organic substrate
integrated circuit
adhesive strength
attached
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000603092A
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English (en)
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JP2002538626A (ja
Filing date
Publication date
Priority claimed from US09/261,849 external-priority patent/US20020014688A1/en
Application filed filed Critical
Publication of JP2002538626A publication Critical patent/JP2002538626A/ja
Publication of JP2002538626A5 publication Critical patent/JP2002538626A5/ja
Pending legal-status Critical Current

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Description

【特許請求の範囲】
【請求項１】 有機基板と、
前記有機基板に装着された集積回路（ＩＣ）と、
前記有機基板の上面と前記集積回路の下面に取り付けられ、第１の接着強度を有する第１の材料と、
前記第１の材料の塗布及び加熱後に前記集積回路の側面と前記有機基板の上面に取り付けられた、塗布時には前記第１の材料とは異なる第２の材料であって、前記第１の接着強度より小さい第２の接着強度を有する第２の材料と
を備える集積回路パッケージ。
【請求項２】 有機基板と、
前記有機基板に装着された集積回路（ＩＣ）と、
前記集積回路を前記有機基板に取り付けるために、前記有機基板上に置かれ、前記集積回路と前記有機基板の間でウィッキング及び流動するために部分的ゲル状態に加熱された第１の接着強度を有する第１の材料と、
引き続いて前記第１の材料の加熱時及びその後に塗布される第２の材料であって、前記有機基板上に置かれて前記第１の材料を封入及び封止して概ね前記集積回路の下でかつ前記集積回路と前記有機基板の間に留まり、第１の材料とは異なっており第１の接着強度より低い第２の接着強度を有する第２の材料と
を備える集積回路パッケージ。
【請求項３】 有機基板と、
前記有機基板に装着された集積回路（ＩＣ）と、
前記有機基板の上面と前記集積回路の下面に取り付けられた第１の材料と、
前記第１の材料の塗布及び加熱後に前記集積回路の側面と前記有機基板の上面にのみ取り付けられ、前記第１の材料と同時に硬化された、前記第１の材料より低い接着性を与える第２の材料であって、前記第１の材料とは別個に塗布されかつそれとは異なる第２の材料と
を備える集積回路パッケージ。
JP2000603092A 1999-03-03 2000-02-08 ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ Pending JP2002538626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,849 1999-03-03
US09/261,849 US20020014688A1 (en) 1999-03-03 1999-03-03 Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
PCT/US2000/003242 WO2000052756A1 (en) 1999-03-03 2000-02-08 A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials

Publications (2)

Publication Number Publication Date
JP2002538626A JP2002538626A (ja) 2002-11-12
JP2002538626A5 true JP2002538626A5 (ja) 2007-03-29

Family

ID=22995146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000603092A Pending JP2002538626A (ja) 1999-03-03 2000-02-08 ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ

Country Status (7)

Country Link
US (2) US20020014688A1 (ja)
JP (1) JP2002538626A (ja)
KR (1) KR100522383B1 (ja)
CN (1) CN1191627C (ja)
AU (1) AU2986000A (ja)
MX (1) MXPA01008580A (ja)
WO (1) WO2000052756A1 (ja)

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