JP2007510306A - 平坦な上面を有するパッドの製造方法 - Google Patents

平坦な上面を有するパッドの製造方法 Download PDF

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Publication number
JP2007510306A
JP2007510306A JP2006537969A JP2006537969A JP2007510306A JP 2007510306 A JP2007510306 A JP 2007510306A JP 2006537969 A JP2006537969 A JP 2006537969A JP 2006537969 A JP2006537969 A JP 2006537969A JP 2007510306 A JP2007510306 A JP 2007510306A
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Japan
Prior art keywords
top surface
composition
stencil
flat top
substrate
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JP2006537969A
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English (en)
Japanese (ja)
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JP2007510306A5 (enExample
Inventor
ソリズ、デブラ
リー、ヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
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Dow Corning Corp
Dow Silicones Corp
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Publication of JP2007510306A publication Critical patent/JP2007510306A/ja
Publication of JP2007510306A5 publication Critical patent/JP2007510306A5/ja
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
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JP2012144616A (ja) * 2011-01-11 2012-08-02 Shin-Etsu Chemical Co Ltd 仮接着材組成物、及び薄型ウエハの製造方法
JP2014517440A (ja) * 2011-03-22 2014-07-17 ダウ コーニング コーポレーション Ｌｅｄアセンブリ内の熱管理方法
JP2018027997A (ja) * 2016-08-16 2018-02-22 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物及びその硬化方法

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JP2007258317A (ja) * 2006-03-22 2007-10-04 Shin Etsu Chem Co Ltd 半導体装置の製造方法
EP1954114A1 (en) * 2006-09-30 2008-08-06 Umicore AG & Co. KG Use of an adhesive composition for die-attaching high power semiconductors
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
DE102008024704A1 (de) * 2008-04-17 2009-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
JP2012104790A (ja) * 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
KR101381119B1 (ko) * 2012-12-28 2014-04-04 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
US9269647B2 (en) * 2014-05-29 2016-02-23 Samsung Electronics Co., Ltd. Semiconductor package having heat dissipating member
WO2019130956A1 (ja) 2017-12-29 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 発光モジュール、表示装置、および、それらの製造方法
EP4369393A1 (de) * 2022-11-10 2024-05-15 Siemens Aktiengesellschaft Halbleiteranordnung mit einem schaltbaren halbleiterelement und verfahren zur herstellung derselben

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