KR101246638B1 - 플랫-탑 패드의 제조방법 - Google Patents
플랫-탑 패드의 제조방법 Download PDFInfo
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- KR101246638B1 KR101246638B1 KR1020067008154A KR20067008154A KR101246638B1 KR 101246638 B1 KR101246638 B1 KR 101246638B1 KR 1020067008154 A KR1020067008154 A KR 1020067008154A KR 20067008154 A KR20067008154 A KR 20067008154A KR 101246638 B1 KR101246638 B1 KR 101246638B1
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51510903P | 2003-10-28 | 2003-10-28 | |
| US60/515,109 | 2003-10-28 | ||
| PCT/US2004/025044 WO2005045903A2 (en) | 2003-10-28 | 2004-08-03 | Method for making a flat-top pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060110871A KR20060110871A (ko) | 2006-10-25 |
| KR101246638B1 true KR101246638B1 (ko) | 2013-03-25 |
Family
ID=34572805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067008154A Expired - Fee Related KR101246638B1 (ko) | 2003-10-28 | 2004-08-03 | 플랫-탑 패드의 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7485202B2 (enExample) |
| EP (1) | EP1680811A2 (enExample) |
| JP (2) | JP2007510306A (enExample) |
| KR (1) | KR101246638B1 (enExample) |
| TW (1) | TW200523115A (enExample) |
| WO (1) | WO2005045903A2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7544539B2 (en) * | 2005-12-29 | 2009-06-09 | Asm Technology Singapore Pte Ltd. | Forced heat transfer apparatus for heating stacked dice |
| JP2007258317A (ja) * | 2006-03-22 | 2007-10-04 | Shin Etsu Chem Co Ltd | 半導体装置の製造方法 |
| EP1954114A1 (en) * | 2006-09-30 | 2008-08-06 | Umicore AG & Co. KG | Use of an adhesive composition for die-attaching high power semiconductors |
| US7834083B2 (en) * | 2006-10-11 | 2010-11-16 | Samsung Electro-Mechanics Co., Ltd. | Nanocomposite composition comprising transparent nanoparticles |
| TWI456707B (zh) * | 2008-01-28 | 2014-10-11 | 瑞薩電子股份有限公司 | 半導體裝置及其製造方法 |
| DE102008024704A1 (de) * | 2008-04-17 | 2009-10-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
| JP2012104790A (ja) * | 2010-10-12 | 2012-05-31 | Elpida Memory Inc | 半導体装置 |
| JP5348147B2 (ja) * | 2011-01-11 | 2013-11-20 | 信越化学工業株式会社 | 仮接着材組成物、及び薄型ウエハの製造方法 |
| EP2689643A1 (en) * | 2011-03-22 | 2014-01-29 | Dow Corning Corporation | Thermal management within an led assembly |
| KR101381119B1 (ko) * | 2012-12-28 | 2014-04-04 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| US9269647B2 (en) * | 2014-05-29 | 2016-02-23 | Samsung Electronics Co., Ltd. | Semiconductor package having heat dissipating member |
| JP6620703B2 (ja) * | 2016-08-16 | 2019-12-18 | 信越化学工業株式会社 | 熱伝導性シリコーン樹脂組成物及びその硬化方法 |
| JP7204677B2 (ja) | 2017-12-29 | 2023-01-16 | ソニーセミコンダクタソリューションズ株式会社 | 発光モジュール、表示装置、および、それらの製造方法 |
| EP4369393A1 (de) * | 2022-11-10 | 2024-05-15 | Siemens Aktiengesellschaft | Halbleiteranordnung mit einem schaltbaren halbleiterelement und verfahren zur herstellung derselben |
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| US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
| US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
| US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3296291A (en) | 1962-07-02 | 1967-01-03 | Gen Electric | Reaction of silanes with unsaturated olefinic compounds |
| NL131800C (enExample) | 1965-05-17 | |||
| NL129346C (enExample) | 1966-06-23 | |||
| US3516946A (en) | 1967-09-29 | 1970-06-23 | Gen Electric | Platinum catalyst composition for hydrosilation reactions |
| US3814730A (en) | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| US3989667A (en) | 1974-12-02 | 1976-11-02 | Dow Corning Corporation | Olefinic siloxanes as platinum inhibitors |
| US3989668A (en) | 1975-07-14 | 1976-11-02 | Dow Corning Corporation | Method of making a silicone elastomer and the elastomer prepared thereby |
| JPS591241B2 (ja) | 1978-06-30 | 1984-01-11 | 而至歯科工業株式会社 | 歯科用シリコ−ン組成物およびその使用法 |
| JPS58222531A (ja) * | 1982-06-18 | 1983-12-24 | Hitachi Ltd | ペレツトボンデイング方法 |
| US4585836A (en) | 1984-10-29 | 1986-04-29 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-II |
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| US4784879A (en) | 1987-07-20 | 1988-11-15 | Dow Corning Corporation | Method for preparing a microencapsulated compound of a platinum group metal |
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| JPH0214244A (ja) | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| JPH0312940A (ja) * | 1989-06-12 | 1991-01-21 | Nec Corp | ペレットのマウント方法 |
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| JPH04222871A (ja) | 1990-12-25 | 1992-08-12 | Toray Dow Corning Silicone Co Ltd | 硬化性オルガノポリシロキサン組成物 |
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| GB9103191D0 (en) | 1991-02-14 | 1991-04-03 | Dow Corning | Platinum complexes and use thereof |
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| JP2816084B2 (ja) * | 1992-10-26 | 1998-10-27 | 三洋電機株式会社 | 半田塗布方法、半導体装置の製造方法およびスキージ |
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| JP2925074B2 (ja) * | 1996-11-08 | 1999-07-26 | 三星電子株式会社 | Loc型半導体チップパッケージ及びその製造方法 |
| EP0850997A3 (en) | 1996-12-24 | 2001-03-14 | Dow Corning Corporation | Filled addition curable compositions having reduced gassing and increased shelf stability |
| JP3339808B2 (ja) * | 1997-08-29 | 2002-10-28 | 株式会社三井ハイテック | 半導体装置の製造方法及び半導体装置製造用マスク |
| JPH1178274A (ja) * | 1997-09-10 | 1999-03-23 | Mitsui High Tec Inc | エラストマー塗布用マスク |
| US6034441A (en) * | 1997-11-26 | 2000-03-07 | Lucent Technologies, Inc. | Overcast semiconductor package |
| ATE323305T1 (de) | 1998-07-24 | 2006-04-15 | Sun Microsystems Inc | Verfahren und vorrichtung zur durchführung einer deterministischen speicherzuordnungsantwort in einem computer-system |
| US6369185B1 (en) * | 1999-03-31 | 2002-04-09 | Dow Corning Toray Silicone Co., Ltd. | Curable organopolysiloxane composition, cured products formed therefrom and unified articles |
| SG122743A1 (en) * | 2001-08-21 | 2006-06-29 | Micron Technology Inc | Microelectronic devices and methods of manufacture |
| JP2003115501A (ja) * | 2001-10-09 | 2003-04-18 | Dow Corning Toray Silicone Co Ltd | 架橋シリコーン系接着性シートおよび半導体装置 |
| US6793759B2 (en) * | 2001-10-09 | 2004-09-21 | Dow Corning Corporation | Method for creating adhesion during fabrication of electronic devices |
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2004
- 2004-08-03 JP JP2006537969A patent/JP2007510306A/ja active Pending
- 2004-08-03 WO PCT/US2004/025044 patent/WO2005045903A2/en not_active Ceased
- 2004-08-03 KR KR1020067008154A patent/KR101246638B1/ko not_active Expired - Fee Related
- 2004-08-03 US US10/571,435 patent/US7485202B2/en not_active Expired - Fee Related
- 2004-08-03 EP EP04779962A patent/EP1680811A2/en not_active Withdrawn
- 2004-08-19 TW TW093125001A patent/TW200523115A/zh unknown
-
2012
- 2012-10-19 JP JP2012231885A patent/JP2013051428A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0049379A1 (de) * | 1980-10-04 | 1982-04-14 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren zur Herstellung eines die Proliferationsrate von Leberzellen stimulierenden Faktors |
| US6336974B1 (en) * | 1997-08-05 | 2002-01-08 | Micron Technology, Inc. | Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid |
| US6089151A (en) * | 1998-02-24 | 2000-07-18 | Micron Technology, Inc. | Method and stencil for extruding material on a substrate |
| US6212767B1 (en) * | 1999-08-31 | 2001-04-10 | Micron Technology, Inc. | Assembling a stacked die package |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005045903A3 (en) | 2005-07-21 |
| US7485202B2 (en) | 2009-02-03 |
| JP2007510306A (ja) | 2007-04-19 |
| EP1680811A2 (en) | 2006-07-19 |
| US20060254712A1 (en) | 2006-11-16 |
| WO2005045903A2 (en) | 2005-05-19 |
| KR20060110871A (ko) | 2006-10-25 |
| WO2005045903B1 (en) | 2005-10-06 |
| TW200523115A (en) | 2005-07-16 |
| JP2013051428A (ja) | 2013-03-14 |
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