TW200523115A - Method for making a flat-top pad - Google Patents

Method for making a flat-top pad Download PDF

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Publication number
TW200523115A
TW200523115A TW093125001A TW93125001A TW200523115A TW 200523115 A TW200523115 A TW 200523115A TW 093125001 A TW093125001 A TW 093125001A TW 93125001 A TW93125001 A TW 93125001A TW 200523115 A TW200523115 A TW 200523115A
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TW
Taiwan
Prior art keywords
composition
substrate
flat
necessary
component
Prior art date
Application number
TW093125001A
Other languages
English (en)
Chinese (zh)
Inventor
Debra Charilla Soliz
Yeong-Joo Lee
Original Assignee
Dow Corning
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Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Publication of TW200523115A publication Critical patent/TW200523115A/zh

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW093125001A 2003-10-28 2004-08-19 Method for making a flat-top pad TW200523115A (en)

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JP2013051428A (ja) 2013-03-14
US7485202B2 (en) 2009-02-03
KR20060110871A (ko) 2006-10-25
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WO2005045903A3 (en) 2005-07-21
WO2005045903A2 (en) 2005-05-19

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