JP2007234133A5 - - Google Patents
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- JP2007234133A5 JP2007234133A5 JP2006055110A JP2006055110A JP2007234133A5 JP 2007234133 A5 JP2007234133 A5 JP 2007234133A5 JP 2006055110 A JP2006055110 A JP 2006055110A JP 2006055110 A JP2006055110 A JP 2006055110A JP 2007234133 A5 JP2007234133 A5 JP 2007234133A5
- Authority
- JP
- Japan
- Prior art keywords
- data
- resistance change
- potential
- memory device
- memory element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015654 memory Effects 0.000 claims description 182
- 230000008859 change Effects 0.000 claims description 147
- 239000004065 semiconductor Substances 0.000 claims description 93
- 230000003321 amplification Effects 0.000 claims description 8
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 8
- 230000007704 transition Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 238000005513 bias potential Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006055110A JP2007234133A (ja) | 2006-03-01 | 2006-03-01 | 半導体記憶装置及び半導体集積回路システム |
| CN2007100861195A CN101030448B (zh) | 2006-03-01 | 2007-03-01 | 半导体存储器件及半导体集成电路系统 |
| CN201110219399.9A CN102354529B (zh) | 2006-03-01 | 2007-03-01 | 半导体存储器件 |
| US11/712,480 US7518903B2 (en) | 2006-03-01 | 2007-03-01 | Semiconductor memory device and semiconductor integrated circuit system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006055110A JP2007234133A (ja) | 2006-03-01 | 2006-03-01 | 半導体記憶装置及び半導体集積回路システム |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011159682A Division JP2011204358A (ja) | 2011-07-21 | 2011-07-21 | 半導体記憶装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007234133A JP2007234133A (ja) | 2007-09-13 |
| JP2007234133A5 true JP2007234133A5 (enExample) | 2009-01-08 |
Family
ID=38471291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006055110A Pending JP2007234133A (ja) | 2006-03-01 | 2006-03-01 | 半導体記憶装置及び半導体集積回路システム |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7518903B2 (enExample) |
| JP (1) | JP2007234133A (enExample) |
| CN (2) | CN102354529B (enExample) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234133A (ja) * | 2006-03-01 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 半導体記憶装置及び半導体集積回路システム |
| JP5159224B2 (ja) * | 2007-09-21 | 2013-03-06 | 株式会社東芝 | 抵抗変化メモリ装置 |
| KR100895387B1 (ko) * | 2007-10-16 | 2009-04-30 | 주식회사 하이닉스반도체 | 상 변화 메모리 장치 |
| WO2009084514A1 (ja) * | 2007-12-27 | 2009-07-09 | Nec Corporation | 記憶素子、半導体記憶装置、および情報読み出し方法 |
| EP2107571B1 (en) | 2008-04-03 | 2012-04-25 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
| KR101453969B1 (ko) * | 2008-07-31 | 2014-10-22 | 삼성전자주식회사 | 저항성 메모리 장치 및 그것의 쓰기 방법 |
| JP5354391B2 (ja) * | 2008-09-30 | 2013-11-27 | 日本電気株式会社 | 磁気ランダムアクセスメモリ及び磁気ランダムアクセスメモリの動作方法 |
| JP5287197B2 (ja) * | 2008-12-09 | 2013-09-11 | ソニー株式会社 | 半導体装置 |
| JP2010157567A (ja) * | 2008-12-26 | 2010-07-15 | Funai Electric Advanced Applied Technology Research Institute Inc | メモリセルアレイ |
| JP5549105B2 (ja) * | 2009-04-15 | 2014-07-16 | ソニー株式会社 | 抵抗変化型メモリデバイスおよびその動作方法 |
| KR101057724B1 (ko) * | 2009-05-13 | 2011-08-18 | 주식회사 하이닉스반도체 | 반도체 메모리 장치와 그의 구동 방법 |
| CN102117644B (zh) * | 2009-12-30 | 2013-09-11 | 中国科学院微电子研究所 | 一种存储器读出电路 |
| JP5521850B2 (ja) * | 2010-07-21 | 2014-06-18 | ソニー株式会社 | 抵抗変化型メモリデバイスおよびその駆動方法 |
| KR101736383B1 (ko) | 2010-08-03 | 2017-05-30 | 삼성전자주식회사 | 메모리 장치, 이의 프리차지 제어 방법, 및 이를 포함하는 장치들 |
| CN101916590B (zh) * | 2010-08-19 | 2013-01-09 | 中国科学院上海微系统与信息技术研究所 | 相变存储器的数据读出方法及读出电路 |
| CN101976578B (zh) * | 2010-10-09 | 2013-10-02 | 中国科学院上海微系统与信息技术研究所 | 相变存储单元的数据读出电路及读出方法 |
| CN102479546B (zh) * | 2010-11-30 | 2014-05-14 | 中国科学院微电子研究所 | 一种对电阻存储器进行编程的电路 |
| WO2012105164A1 (ja) * | 2011-02-01 | 2012-08-09 | パナソニック株式会社 | 不揮発性半導体記憶装置 |
| KR20120097998A (ko) * | 2011-02-28 | 2012-09-05 | 에스케이하이닉스 주식회사 | 집적 회로 |
| US9570164B2 (en) | 2011-08-24 | 2017-02-14 | Rambus Inc. | System and method for performing memory operations on RRAM cells |
| JP5642649B2 (ja) | 2011-10-07 | 2014-12-17 | シャープ株式会社 | 半導体記憶装置及び半導体装置 |
| KR101813182B1 (ko) * | 2011-11-16 | 2017-12-29 | 삼성전자주식회사 | 비휘발성 메모리 소자를 포함하는 다치 논리 장치 |
| JPWO2013179593A1 (ja) * | 2012-05-29 | 2016-01-18 | 株式会社ソシオネクスト | 半導体記憶装置および半導体記憶装置を搭載した半導体装置 |
| JP2014017042A (ja) * | 2012-07-11 | 2014-01-30 | Toppan Printing Co Ltd | 不揮発性メモリセル、不揮発性メモリセルアレイおよび不揮発性メモリ |
| US9183929B2 (en) * | 2012-08-29 | 2015-11-10 | Micron Technology, Inc. | Systems, methods and devices for programming a multilevel resistive memory cell |
| US8902636B2 (en) | 2013-03-22 | 2014-12-02 | Akira Katayama | Resistance change memory |
| JP2014229758A (ja) * | 2013-05-22 | 2014-12-08 | ソニー株式会社 | 半導体装置およびその製造方法 |
| US9987842B2 (en) | 2014-10-29 | 2018-06-05 | Hewlett-Packard Development Company, L.P. | Printhead with a number of memristors and inverters |
| CN105702290B (zh) * | 2014-11-25 | 2019-08-30 | 亿而得微电子股份有限公司 | 低成本电子抹除式可复写只读存储器数组的操作方法 |
| CN106033679B (zh) * | 2015-03-12 | 2019-03-08 | 华邦电子股份有限公司 | 电阻式存储器及量测该电阻式存储器的量测系统 |
| US9728253B2 (en) * | 2015-11-30 | 2017-08-08 | Windbond Electronics Corp. | Sense circuit for RRAM |
| KR102514045B1 (ko) * | 2016-04-21 | 2023-03-24 | 삼성전자주식회사 | 저항성 메모리 장치 및 이를 포함하는 메모리 시스템 |
| KR102570472B1 (ko) * | 2017-01-10 | 2023-08-25 | 에스케이하이닉스 주식회사 | 반도체 장치 |
| US9882566B1 (en) * | 2017-01-10 | 2018-01-30 | Ememory Technology Inc. | Driving circuit for non-volatile memory |
| CN110226203B (zh) * | 2017-01-20 | 2022-12-09 | 合肥睿科微电子有限公司 | Rram写入 |
| US10236053B1 (en) * | 2017-10-17 | 2019-03-19 | R&D 3 Llc | Method and circuit device incorporating time-to-transition signal node sensing |
| US10762960B2 (en) * | 2017-11-30 | 2020-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Resistive random access memory device |
| JP2019164875A (ja) | 2018-03-16 | 2019-09-26 | 東芝メモリ株式会社 | 半導体記憶装置 |
| US10818327B2 (en) * | 2018-06-29 | 2020-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory circuit and method of operating same |
| JP2020077445A (ja) * | 2018-11-07 | 2020-05-21 | ソニーセミコンダクタソリューションズ株式会社 | 記憶制御装置、記憶装置、および、情報処理システム |
| CN110223725B (zh) * | 2019-05-22 | 2022-03-22 | 北京航空航天大学 | 一种非易失性随机存储器数据读取电路、存储器及方法 |
| KR102667819B1 (ko) * | 2019-07-11 | 2024-05-21 | 삼성전자주식회사 | 전원 전압과 관계없이 동작하는 스위치 회로를 포함하는 메모리 장치 |
| US11223360B2 (en) * | 2019-07-23 | 2022-01-11 | Cirrus Logic, Inc. | Control of semiconductor devices |
| US11651819B2 (en) * | 2020-07-24 | 2023-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory circuit and method of operating the same |
| US11423973B2 (en) * | 2020-08-26 | 2022-08-23 | Micron Technology, Inc. | Contemporaneous sense amplifier timings for operations at internal and edge memory array mats |
| US12087359B2 (en) | 2022-06-13 | 2024-09-10 | Applied Materials, Inc. | Memory cell selector for high-voltage set and reset operations |
| CN115240733B (zh) * | 2022-09-23 | 2023-01-03 | 浙江力积存储科技有限公司 | 减小读出放大器面积的方法、电路及dram存储装置 |
| CN119091944A (zh) * | 2024-08-21 | 2024-12-06 | 北方集成电路技术创新中心(北京)有限公司 | 一种新型存储器的读取方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035164A (ja) * | 1999-07-19 | 2001-02-09 | Fujitsu Ltd | 半導体記憶装置 |
| WO2003065377A1 (en) * | 2002-02-01 | 2003-08-07 | Hitachi, Ltd. | Storage device |
| JP4167458B2 (ja) * | 2002-07-24 | 2008-10-15 | 松下電器産業株式会社 | 半導体メモリ装置及び半導体集積回路 |
| JP2004079033A (ja) * | 2002-08-12 | 2004-03-11 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
| JP2004158119A (ja) * | 2002-11-06 | 2004-06-03 | Sharp Corp | 不揮発性半導体記憶装置 |
| JP4249992B2 (ja) * | 2002-12-04 | 2009-04-08 | シャープ株式会社 | 半導体記憶装置及びメモリセルの書き込み並びに消去方法 |
| JP4205938B2 (ja) * | 2002-12-05 | 2009-01-07 | シャープ株式会社 | 不揮発性メモリ装置 |
| AU2003274579A1 (en) * | 2002-12-05 | 2004-06-23 | Koninklijke Philips Electronics N.V. | Programmable non-volatile semiconductor memory device |
| JP4113493B2 (ja) * | 2003-06-12 | 2008-07-09 | シャープ株式会社 | 不揮発性半導体記憶装置及びその制御方法 |
| EP1511042B1 (en) * | 2003-08-27 | 2012-12-05 | STMicroelectronics Srl | Phase-change memory device with biasing of deselected bit lines |
| JP4192060B2 (ja) * | 2003-09-12 | 2008-12-03 | シャープ株式会社 | 不揮発性半導体記憶装置 |
| JP4063239B2 (ja) * | 2004-04-16 | 2008-03-19 | ソニー株式会社 | データ読出し回路及びこの回路を有する半導体装置 |
| JP2006134398A (ja) * | 2004-11-04 | 2006-05-25 | Sony Corp | 記憶装置及び半導体装置 |
| JP2007234133A (ja) * | 2006-03-01 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 半導体記憶装置及び半導体集積回路システム |
-
2006
- 2006-03-01 JP JP2006055110A patent/JP2007234133A/ja active Pending
-
2007
- 2007-03-01 CN CN201110219399.9A patent/CN102354529B/zh active Active
- 2007-03-01 CN CN2007100861195A patent/CN101030448B/zh active Active
- 2007-03-01 US US11/712,480 patent/US7518903B2/en active Active
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