JP2007194598A5 - - Google Patents

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Publication number
JP2007194598A5
JP2007194598A5 JP2006332444A JP2006332444A JP2007194598A5 JP 2007194598 A5 JP2007194598 A5 JP 2007194598A5 JP 2006332444 A JP2006332444 A JP 2006332444A JP 2006332444 A JP2006332444 A JP 2006332444A JP 2007194598 A5 JP2007194598 A5 JP 2007194598A5
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JP
Japan
Prior art keywords
solder resist
connection pad
chip mounting
flip
opening
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006332444A
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English (en)
Japanese (ja)
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JP4971769B2 (ja
JP2007194598A (ja
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Application filed filed Critical
Priority to JP2006332444A priority Critical patent/JP4971769B2/ja
Priority claimed from JP2006332444A external-priority patent/JP4971769B2/ja
Priority to US11/613,753 priority patent/US7847417B2/en
Priority to TW095148367A priority patent/TW200733333A/zh
Publication of JP2007194598A publication Critical patent/JP2007194598A/ja
Priority to US12/478,128 priority patent/US8669665B2/en
Publication of JP2007194598A5 publication Critical patent/JP2007194598A5/ja
Application granted granted Critical
Publication of JP4971769B2 publication Critical patent/JP4971769B2/ja
Active legal-status Critical Current
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JP2006332444A 2005-12-22 2006-12-08 フリップチップ実装構造及びフリップチップ実装構造の製造方法 Active JP4971769B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006332444A JP4971769B2 (ja) 2005-12-22 2006-12-08 フリップチップ実装構造及びフリップチップ実装構造の製造方法
US11/613,753 US7847417B2 (en) 2005-12-22 2006-12-20 Flip-chip mounting substrate and flip-chip mounting method
TW095148367A TW200733333A (en) 2005-12-22 2006-12-22 Flip-chip mounting substrate and flip-chip mounting method
US12/478,128 US8669665B2 (en) 2005-12-22 2009-06-04 Flip-chip mounting substrate and flip-chip mounting method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005369714 2005-12-22
JP2005369714 2005-12-22
JP2006332444A JP4971769B2 (ja) 2005-12-22 2006-12-08 フリップチップ実装構造及びフリップチップ実装構造の製造方法

Publications (3)

Publication Number Publication Date
JP2007194598A JP2007194598A (ja) 2007-08-02
JP2007194598A5 true JP2007194598A5 (enExample) 2010-01-07
JP4971769B2 JP4971769B2 (ja) 2012-07-11

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ID=38192649

Family Applications (1)

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JP2006332444A Active JP4971769B2 (ja) 2005-12-22 2006-12-08 フリップチップ実装構造及びフリップチップ実装構造の製造方法

Country Status (3)

Country Link
US (2) US7847417B2 (enExample)
JP (1) JP4971769B2 (enExample)
TW (1) TW200733333A (enExample)

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JP6544354B2 (ja) * 2014-06-27 2019-07-17 ソニー株式会社 半導体装置の製造方法
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CN106463427B (zh) * 2014-06-27 2020-03-13 索尼公司 半导体装置及其制造方法
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