JP2006332204A - 静電チャック - Google Patents

静電チャック Download PDF

Info

Publication number
JP2006332204A
JP2006332204A JP2005151483A JP2005151483A JP2006332204A JP 2006332204 A JP2006332204 A JP 2006332204A JP 2005151483 A JP2005151483 A JP 2005151483A JP 2005151483 A JP2005151483 A JP 2005151483A JP 2006332204 A JP2006332204 A JP 2006332204A
Authority
JP
Japan
Prior art keywords
electrostatic chuck
dielectric substrate
electrode
plasma
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005151483A
Other languages
English (en)
Japanese (ja)
Inventor
Ikuo Itakura
郁夫 板倉
Shoichiro Himuro
正一郎 氷室
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Priority to JP2005151483A priority Critical patent/JP2006332204A/ja
Priority to US11/299,802 priority patent/US7468880B2/en
Priority to KR1020077021337A priority patent/KR100968019B1/ko
Priority to CNB2006800178949A priority patent/CN100562983C/zh
Priority to KR1020087029373A priority patent/KR100978996B1/ko
Priority to PCT/JP2006/310182 priority patent/WO2006126503A1/ja
Priority to TW095118484A priority patent/TW200707695A/zh
Publication of JP2006332204A publication Critical patent/JP2006332204A/ja
Priority to US12/217,532 priority patent/US7760484B2/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2005151483A 2005-05-24 2005-05-24 静電チャック Pending JP2006332204A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2005151483A JP2006332204A (ja) 2005-05-24 2005-05-24 静電チャック
US11/299,802 US7468880B2 (en) 2005-05-24 2005-12-13 Electrostatic chuck
KR1020077021337A KR100968019B1 (ko) 2005-05-24 2006-05-23 정전척
CNB2006800178949A CN100562983C (zh) 2005-05-24 2006-05-23 静电吸盘
KR1020087029373A KR100978996B1 (ko) 2005-05-24 2006-05-23 정전척의 제조방법
PCT/JP2006/310182 WO2006126503A1 (ja) 2005-05-24 2006-05-23 静電チャック
TW095118484A TW200707695A (en) 2005-05-24 2006-05-24 Electrostatic chuck
US12/217,532 US7760484B2 (en) 2005-05-24 2008-07-07 Electrostatic chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005151483A JP2006332204A (ja) 2005-05-24 2005-05-24 静電チャック

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006290709A Division JP2007088492A (ja) 2006-10-26 2006-10-26 静電チャックの製造方法および静電チャック

Publications (1)

Publication Number Publication Date
JP2006332204A true JP2006332204A (ja) 2006-12-07

Family

ID=37451929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005151483A Pending JP2006332204A (ja) 2005-05-24 2005-05-24 静電チャック

Country Status (6)

Country Link
US (2) US7468880B2 (enExample)
JP (1) JP2006332204A (enExample)
KR (2) KR100978996B1 (enExample)
CN (1) CN100562983C (enExample)
TW (1) TW200707695A (enExample)
WO (1) WO2006126503A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300491A (ja) * 2007-05-30 2008-12-11 Sumitomo Osaka Cement Co Ltd 静電チャック
WO2013047648A1 (ja) * 2011-09-30 2013-04-04 Toto株式会社 静電チャック
WO2018140394A1 (en) * 2017-01-27 2018-08-02 Ultratech, Inc. Chuck systems and methods having enhanced electrical isolation for substrate-biased ald
WO2024143432A1 (ja) * 2022-12-28 2024-07-04 株式会社クリエイティブテクノロジー 静電チャック

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070283891A1 (en) * 2006-03-29 2007-12-13 Nobuyuki Okayama Table for supporting substrate, and vacuum-processing equipment
US7672111B2 (en) * 2006-09-22 2010-03-02 Toto Ltd. Electrostatic chuck and method for manufacturing same
JP2008205415A (ja) * 2007-02-16 2008-09-04 Creative Technology:Kk 静電チャック
KR101553423B1 (ko) 2007-12-19 2015-09-15 램 리써치 코포레이션 반도체 진공 프로세싱 장치용 필름 점착제
JP5395798B2 (ja) * 2008-08-27 2014-01-22 株式会社アルバック 静電チャック及び真空処理装置
JP2010199475A (ja) * 2009-02-27 2010-09-09 Tokyo Electron Ltd プラズマ処理装置のクリーニング方法及び記憶媒体
JP2012204644A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
CN103227083B (zh) * 2012-01-31 2015-08-12 中微半导体设备(上海)有限公司 一种用于等离子体处理装置的载片台
CN103327720B (zh) * 2012-03-21 2016-01-20 长毅技研股份有限公司 可透视静电吸板
US9281226B2 (en) 2012-04-26 2016-03-08 Applied Materials, Inc. Electrostatic chuck having reduced power loss
JP5441019B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP5441021B1 (ja) * 2012-09-12 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP6152994B2 (ja) 2012-11-27 2017-06-28 株式会社クリエイティブテクノロジー 静電チャック及びガラス基板処理方法
JP6071514B2 (ja) * 2012-12-12 2017-02-01 東京エレクトロン株式会社 静電チャックの改質方法及びプラズマ処理装置
JP6132957B2 (ja) * 2015-10-13 2017-05-24 ヤス カンパニー リミテッド 帯電処理による基板チャッキング方法及びシステム
US20220181127A1 (en) * 2019-05-07 2022-06-09 Lam Research Corporation Electrostatic chuck system
US11911863B2 (en) * 2019-09-11 2024-02-27 Creative Technology Corporation Attachment and detachment device
US11302536B2 (en) * 2019-10-18 2022-04-12 Applied Materials, Inc. Deflectable platens and associated methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240243A (ja) * 1988-03-18 1989-09-25 Tokuda Seisakusho Ltd 電極およびその製造方法
JPH04133443U (ja) * 1991-05-30 1992-12-11 京セラ株式会社 セラミツク製静電チヤツク
JPH11265930A (ja) * 1998-03-16 1999-09-28 Taiheiyo Cement Corp 静電チャック及びその製造方法
JP2003152065A (ja) * 2001-11-14 2003-05-23 Sumitomo Osaka Cement Co Ltd 静電チャック及びその製造方法
JP2005057234A (ja) * 2003-07-24 2005-03-03 Kyocera Corp 静電チャック

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132048A (en) * 1979-04-03 1980-10-14 Toshiba Corp Semiconductor device
JPS6096832A (ja) 1983-11-01 1985-05-30 Fukuo Iwabori ガスライタの発火装置を製造する方法
JPH0697677B2 (ja) 1987-04-21 1994-11-30 東陶機器株式会社 静電チャック基盤の製造方法
JP2521471B2 (ja) 1987-05-14 1996-08-07 富士通株式会社 静電吸着装置
JPH04133443A (ja) 1990-09-26 1992-05-07 Fujitsu Ltd 半導体装置の製造方法
JP2971369B2 (ja) 1995-08-31 1999-11-02 トーカロ株式会社 静電チャック部材およびその製造方法
JP3457477B2 (ja) 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JP3225850B2 (ja) 1995-09-20 2001-11-05 株式会社日立製作所 静電吸着電極およびその製作方法
JPH10154745A (ja) 1996-11-26 1998-06-09 Hitachi Ltd 静電吸着装置
JP3527823B2 (ja) 1997-01-31 2004-05-17 京セラ株式会社 静電チャック
JPH10261697A (ja) 1997-03-19 1998-09-29 Kobe Steel Ltd 静電チャック
JP4156699B2 (ja) 1998-02-16 2008-09-24 株式会社巴川製紙所 静電チャック装置用シートおよび静電チャック装置
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001060619A (ja) 1999-06-16 2001-03-06 Toto Ltd 静電チャック及びその製造方法
JP2001284328A (ja) 2000-03-31 2001-10-12 Taiheiyo Cement Corp セラミック部品
JP2001313331A (ja) 2000-04-28 2001-11-09 Sumitomo Osaka Cement Co Ltd 静電吸着装置
JP2001338970A (ja) 2000-05-26 2001-12-07 Sumitomo Osaka Cement Co Ltd 静電吸着装置
JP2002093896A (ja) 2000-09-12 2002-03-29 Nippon Steel Corp 静電チャック及びその製造方法
JP4917715B2 (ja) 2001-07-24 2012-04-18 太平洋セメント株式会社 静電チャック
JP2003168725A (ja) 2001-11-30 2003-06-13 Kyocera Corp ウエハ支持部材及びその製造方法
JP2002324834A (ja) 2002-04-03 2002-11-08 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤
JP2004168609A (ja) 2002-11-21 2004-06-17 Taiheiyo Cement Corp 窒化アルミニウム焼結体およびそれを用いた静電チャック
JP2004200462A (ja) 2002-12-19 2004-07-15 Nhk Spring Co Ltd 静電チャックおよびその製造方法
JP2004235563A (ja) 2003-01-31 2004-08-19 Tomoegawa Paper Co Ltd 静電チャック装置用電極シート及びこれを用いた静電チャック装置
JP4064835B2 (ja) 2003-02-07 2008-03-19 太平洋セメント株式会社 静電チャック及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240243A (ja) * 1988-03-18 1989-09-25 Tokuda Seisakusho Ltd 電極およびその製造方法
JPH04133443U (ja) * 1991-05-30 1992-12-11 京セラ株式会社 セラミツク製静電チヤツク
JPH11265930A (ja) * 1998-03-16 1999-09-28 Taiheiyo Cement Corp 静電チャック及びその製造方法
JP2003152065A (ja) * 2001-11-14 2003-05-23 Sumitomo Osaka Cement Co Ltd 静電チャック及びその製造方法
JP2005057234A (ja) * 2003-07-24 2005-03-03 Kyocera Corp 静電チャック

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300491A (ja) * 2007-05-30 2008-12-11 Sumitomo Osaka Cement Co Ltd 静電チャック
WO2013047648A1 (ja) * 2011-09-30 2013-04-04 Toto株式会社 静電チャック
JP2013084938A (ja) * 2011-09-30 2013-05-09 Toto Ltd 静電チャック
US9042078B2 (en) 2011-09-30 2015-05-26 Toto Ltd. Electrostatic chuck
WO2018140394A1 (en) * 2017-01-27 2018-08-02 Ultratech, Inc. Chuck systems and methods having enhanced electrical isolation for substrate-biased ald
US10844488B2 (en) 2017-01-27 2020-11-24 Veeco Instruments Inc. Chuck systems and methods having enhanced electrical isolation for substrate-biased ALD
WO2024143432A1 (ja) * 2022-12-28 2024-07-04 株式会社クリエイティブテクノロジー 静電チャック

Also Published As

Publication number Publication date
CN101180721A (zh) 2008-05-14
US7760484B2 (en) 2010-07-20
US7468880B2 (en) 2008-12-23
KR100968019B1 (ko) 2010-07-07
KR20070106782A (ko) 2007-11-05
TW200707695A (en) 2007-02-16
TWI304257B (enExample) 2008-12-11
CN100562983C (zh) 2009-11-25
KR100978996B1 (ko) 2010-08-30
WO2006126503A1 (ja) 2006-11-30
US20060268491A1 (en) 2006-11-30
KR20090007476A (ko) 2009-01-16
US20080273284A1 (en) 2008-11-06

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A602 Written permission of extension of time

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Effective date: 20061003

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