KR100978996B1 - 정전척의 제조방법 - Google Patents

정전척의 제조방법 Download PDF

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Publication number
KR100978996B1
KR100978996B1 KR1020087029373A KR20087029373A KR100978996B1 KR 100978996 B1 KR100978996 B1 KR 100978996B1 KR 1020087029373 A KR1020087029373 A KR 1020087029373A KR 20087029373 A KR20087029373 A KR 20087029373A KR 100978996 B1 KR100978996 B1 KR 100978996B1
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KR
South Korea
Prior art keywords
electrostatic chuck
dielectric substrate
insulating adhesive
insulator film
manufacturing
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KR1020087029373A
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English (en)
Korean (ko)
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KR20090007476A (ko
Inventor
이쿠오 이타쿠라
쇼이치로 히무로
Original Assignee
토토 가부시키가이샤
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Publication of KR20090007476A publication Critical patent/KR20090007476A/ko
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Publication of KR100978996B1 publication Critical patent/KR100978996B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020087029373A 2005-05-24 2006-05-23 정전척의 제조방법 Active KR100978996B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-151483 2005-05-24
JP2005151483A JP2006332204A (ja) 2005-05-24 2005-05-24 静電チャック

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020077021337A Division KR100968019B1 (ko) 2005-05-24 2006-05-23 정전척

Publications (2)

Publication Number Publication Date
KR20090007476A KR20090007476A (ko) 2009-01-16
KR100978996B1 true KR100978996B1 (ko) 2010-08-30

Family

ID=37451929

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020087029373A Active KR100978996B1 (ko) 2005-05-24 2006-05-23 정전척의 제조방법
KR1020077021337A Active KR100968019B1 (ko) 2005-05-24 2006-05-23 정전척

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020077021337A Active KR100968019B1 (ko) 2005-05-24 2006-05-23 정전척

Country Status (6)

Country Link
US (2) US7468880B2 (enExample)
JP (1) JP2006332204A (enExample)
KR (2) KR100978996B1 (enExample)
CN (1) CN100562983C (enExample)
TW (1) TW200707695A (enExample)
WO (1) WO2006126503A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070283891A1 (en) * 2006-03-29 2007-12-13 Nobuyuki Okayama Table for supporting substrate, and vacuum-processing equipment
US7672111B2 (en) * 2006-09-22 2010-03-02 Toto Ltd. Electrostatic chuck and method for manufacturing same
JP2008205415A (ja) * 2007-02-16 2008-09-04 Creative Technology:Kk 静電チャック
JP5018244B2 (ja) * 2007-05-30 2012-09-05 住友大阪セメント株式会社 静電チャック
KR101553423B1 (ko) 2007-12-19 2015-09-15 램 리써치 코포레이션 반도체 진공 프로세싱 장치용 필름 점착제
JP5395798B2 (ja) * 2008-08-27 2014-01-22 株式会社アルバック 静電チャック及び真空処理装置
JP2010199475A (ja) * 2009-02-27 2010-09-09 Tokyo Electron Ltd プラズマ処理装置のクリーニング方法及び記憶媒体
JP2012204644A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
JP5348439B2 (ja) * 2011-09-30 2013-11-20 Ｔｏｔｏ株式会社 静電チャック
CN103227083B (zh) * 2012-01-31 2015-08-12 中微半导体设备(上海)有限公司 一种用于等离子体处理装置的载片台
CN103327720B (zh) * 2012-03-21 2016-01-20 长毅技研股份有限公司 可透视静电吸板
US9281226B2 (en) 2012-04-26 2016-03-08 Applied Materials, Inc. Electrostatic chuck having reduced power loss
JP5441019B1 (ja) * 2012-08-29 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP5441021B1 (ja) * 2012-09-12 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
JP6152994B2 (ja) 2012-11-27 2017-06-28 株式会社クリエイティブテクノロジー 静電チャック及びガラス基板処理方法
JP6071514B2 (ja) * 2012-12-12 2017-02-01 東京エレクトロン株式会社 静電チャックの改質方法及びプラズマ処理装置
JP6132957B2 (ja) * 2015-10-13 2017-05-24 ヤス カンパニー リミテッド 帯電処理による基板チャッキング方法及びシステム
CN110225997A (zh) * 2017-01-27 2019-09-10 超科技公司 具有用于基板偏置的ald的增强的电隔离的卡盘系统和方法
US20220181127A1 (en) * 2019-05-07 2022-06-09 Lam Research Corporation Electrostatic chuck system
US11911863B2 (en) * 2019-09-11 2024-02-27 Creative Technology Corporation Attachment and detachment device
US11302536B2 (en) * 2019-10-18 2022-04-12 Applied Materials, Inc. Deflectable platens and associated methods
WO2024143432A1 (ja) * 2022-12-28 2024-07-04 株式会社クリエイティブテクノロジー 静電チャック

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037158A (ja) * 2001-07-24 2003-02-07 Taiheiyo Cement Corp 静電チャック
JP2003152065A (ja) * 2001-11-14 2003-05-23 Sumitomo Osaka Cement Co Ltd 静電チャック及びその製造方法
JP2004168609A (ja) * 2002-11-21 2004-06-17 Taiheiyo Cement Corp 窒化アルミニウム焼結体およびそれを用いた静電チャック

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Publication number Priority date Publication date Assignee Title
JPS55132048A (en) * 1979-04-03 1980-10-14 Toshiba Corp Semiconductor device
JPS6096832A (ja) 1983-11-01 1985-05-30 Fukuo Iwabori ガスライタの発火装置を製造する方法
JPH0697677B2 (ja) 1987-04-21 1994-11-30 東陶機器株式会社 静電チャック基盤の製造方法
JP2521471B2 (ja) 1987-05-14 1996-08-07 富士通株式会社 静電吸着装置
JPH01240243A (ja) * 1988-03-18 1989-09-25 Tokuda Seisakusho Ltd 電極およびその製造方法
JPH04133443A (ja) 1990-09-26 1992-05-07 Fujitsu Ltd 半導体装置の製造方法
JP2552420Y2 (ja) * 1991-05-30 1997-10-29 京セラ株式会社 セラミック製静電チャック
JP2971369B2 (ja) 1995-08-31 1999-11-02 トーカロ株式会社 静電チャック部材およびその製造方法
JP3457477B2 (ja) 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JP3225850B2 (ja) 1995-09-20 2001-11-05 株式会社日立製作所 静電吸着電極およびその製作方法
JPH10154745A (ja) 1996-11-26 1998-06-09 Hitachi Ltd 静電吸着装置
JP3527823B2 (ja) 1997-01-31 2004-05-17 京セラ株式会社 静電チャック
JPH10261697A (ja) 1997-03-19 1998-09-29 Kobe Steel Ltd 静電チャック
JP4156699B2 (ja) 1998-02-16 2008-09-24 株式会社巴川製紙所 静電チャック装置用シートおよび静電チャック装置
JP3888766B2 (ja) * 1998-03-16 2007-03-07 太平洋セメント株式会社 静電チャック及びその製造方法
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001060619A (ja) 1999-06-16 2001-03-06 Toto Ltd 静電チャック及びその製造方法
JP2001284328A (ja) 2000-03-31 2001-10-12 Taiheiyo Cement Corp セラミック部品
JP2001313331A (ja) 2000-04-28 2001-11-09 Sumitomo Osaka Cement Co Ltd 静電吸着装置
JP2001338970A (ja) 2000-05-26 2001-12-07 Sumitomo Osaka Cement Co Ltd 静電吸着装置
JP2002093896A (ja) 2000-09-12 2002-03-29 Nippon Steel Corp 静電チャック及びその製造方法
JP2003168725A (ja) 2001-11-30 2003-06-13 Kyocera Corp ウエハ支持部材及びその製造方法
JP2002324834A (ja) 2002-04-03 2002-11-08 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤
JP2004200462A (ja) 2002-12-19 2004-07-15 Nhk Spring Co Ltd 静電チャックおよびその製造方法
JP2004235563A (ja) 2003-01-31 2004-08-19 Tomoegawa Paper Co Ltd 静電チャック装置用電極シート及びこれを用いた静電チャック装置
JP4064835B2 (ja) 2003-02-07 2008-03-19 太平洋セメント株式会社 静電チャック及びその製造方法
JP4369765B2 (ja) * 2003-07-24 2009-11-25 京セラ株式会社 静電チャック

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037158A (ja) * 2001-07-24 2003-02-07 Taiheiyo Cement Corp 静電チャック
JP2003152065A (ja) * 2001-11-14 2003-05-23 Sumitomo Osaka Cement Co Ltd 静電チャック及びその製造方法
JP2004168609A (ja) * 2002-11-21 2004-06-17 Taiheiyo Cement Corp 窒化アルミニウム焼結体およびそれを用いた静電チャック

Also Published As

Publication number Publication date
CN101180721A (zh) 2008-05-14
JP2006332204A (ja) 2006-12-07
US7760484B2 (en) 2010-07-20
US7468880B2 (en) 2008-12-23
KR100968019B1 (ko) 2010-07-07
KR20070106782A (ko) 2007-11-05
TW200707695A (en) 2007-02-16
TWI304257B (enExample) 2008-12-11
CN100562983C (zh) 2009-11-25
WO2006126503A1 (ja) 2006-11-30
US20060268491A1 (en) 2006-11-30
KR20090007476A (ko) 2009-01-16
US20080273284A1 (en) 2008-11-06

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