JP2005259879A5 - - Google Patents
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- Publication number
- JP2005259879A5 JP2005259879A5 JP2004067489A JP2004067489A JP2005259879A5 JP 2005259879 A5 JP2005259879 A5 JP 2005259879A5 JP 2004067489 A JP2004067489 A JP 2004067489A JP 2004067489 A JP2004067489 A JP 2004067489A JP 2005259879 A5 JP2005259879 A5 JP 2005259879A5
- Authority
- JP
- Japan
- Prior art keywords
- power
- line
- semiconductor integrated
- integrated circuit
- branch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims 15
Priority Applications (17)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004067489A JP4200926B2 (ja) | 2004-03-10 | 2004-03-10 | 半導体集積回路 |
| US11/070,205 US7274210B2 (en) | 2004-03-10 | 2005-03-03 | Semiconductor integrated circuit |
| KR1020050019736A KR101114555B1 (ko) | 2004-03-10 | 2005-03-09 | 반도체 집적회로 |
| EP10193384.4A EP2287906B1 (en) | 2004-03-10 | 2005-03-09 | Semiconductor integrated circuit |
| EP05290530A EP1575091B1 (en) | 2004-03-10 | 2005-03-09 | Semiconductor integrated circuit |
| EP10193386.9A EP2287907B1 (en) | 2004-03-10 | 2005-03-09 | Semiconductor integrated circuit |
| EP14190410.2A EP2835827B1 (en) | 2004-03-10 | 2005-03-09 | Semiconductor integrated circuit |
| DE602005025951T DE602005025951D1 (de) | 2004-03-10 | 2005-03-09 | Integrierter Halbleiterschaltkreis |
| EP14190409.4A EP2835826B1 (en) | 2004-03-10 | 2005-03-09 | Semiconductor integrated circuit |
| CN2007101070196A CN101060120B (zh) | 2004-03-10 | 2005-03-10 | 半导体集成电路 |
| CNB2005100537135A CN1324685C (zh) | 2004-03-10 | 2005-03-10 | 半导体集成电路 |
| US11/808,975 US7459934B2 (en) | 2004-03-10 | 2007-06-14 | Semiconductor integrated circuit |
| US11/808,976 US7456659B2 (en) | 2004-03-10 | 2007-06-14 | Semiconductor integrated circuit |
| US12/289,571 US7696788B2 (en) | 2004-03-10 | 2008-10-30 | Semiconductor integrated circuit |
| US13/340,130 USRE43912E1 (en) | 2004-03-10 | 2011-12-29 | Semiconductor integrated circuit |
| US13/687,996 USRE48694E1 (en) | 2004-03-10 | 2012-11-28 | Semiconductor integrated circuit |
| US14/301,197 USRE48373E1 (en) | 2004-03-10 | 2014-06-10 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004067489A JP4200926B2 (ja) | 2004-03-10 | 2004-03-10 | 半導体集積回路 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007263815A Division JP5029272B2 (ja) | 2007-10-09 | 2007-10-09 | 半導体集積回路 |
| JP2007263814A Division JP4229207B2 (ja) | 2007-10-09 | 2007-10-09 | 半導体集積回路 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005259879A JP2005259879A (ja) | 2005-09-22 |
| JP2005259879A5 true JP2005259879A5 (enExample) | 2007-07-26 |
| JP4200926B2 JP4200926B2 (ja) | 2008-12-24 |
Family
ID=34824577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004067489A Expired - Lifetime JP4200926B2 (ja) | 2004-03-10 | 2004-03-10 | 半導体集積回路 |
Country Status (6)
| Country | Link |
|---|---|
| US (7) | US7274210B2 (enExample) |
| EP (5) | EP2835827B1 (enExample) |
| JP (1) | JP4200926B2 (enExample) |
| KR (1) | KR101114555B1 (enExample) |
| CN (2) | CN1324685C (enExample) |
| DE (1) | DE602005025951D1 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4200926B2 (ja) * | 2004-03-10 | 2008-12-24 | ソニー株式会社 | 半導体集積回路 |
| JP2007095787A (ja) * | 2005-09-27 | 2007-04-12 | Nec Electronics Corp | 半導体集積回路 |
| JP4621113B2 (ja) * | 2005-10-28 | 2011-01-26 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
| JP2007243077A (ja) * | 2006-03-13 | 2007-09-20 | Renesas Technology Corp | 半導体集積回路装置 |
| JP5038654B2 (ja) * | 2006-06-06 | 2012-10-03 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4144892B2 (ja) * | 2006-08-28 | 2008-09-03 | キヤノン株式会社 | 光電変換装置及び撮像装置 |
| US7649787B2 (en) * | 2006-09-05 | 2010-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR100835425B1 (ko) * | 2006-09-14 | 2008-06-04 | 동부일렉트로닉스 주식회사 | Mtcmos반도체 집적회로 |
| KR100772269B1 (ko) * | 2006-09-21 | 2007-11-01 | 동부일렉트로닉스 주식회사 | Mtcmos 반도체 집적회로의 설계방법 |
| JP2008098353A (ja) * | 2006-10-11 | 2008-04-24 | Nec Electronics Corp | 半導体集積回路 |
| JP5198785B2 (ja) | 2007-03-30 | 2013-05-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4962173B2 (ja) | 2007-07-02 | 2012-06-27 | ソニー株式会社 | 半導体集積回路 |
| JP5528662B2 (ja) | 2007-09-18 | 2014-06-25 | ソニー株式会社 | 半導体集積回路 |
| JP4636077B2 (ja) * | 2007-11-07 | 2011-02-23 | ソニー株式会社 | 半導体集積回路 |
| US8922247B2 (en) * | 2007-11-14 | 2014-12-30 | Arm Limited | Power controlling integrated circuit and retention switching circuit |
| JP2009170650A (ja) * | 2008-01-16 | 2009-07-30 | Sony Corp | 半導体集積回路およびその配置配線方法 |
| JP4535136B2 (ja) * | 2008-01-17 | 2010-09-01 | ソニー株式会社 | 半導体集積回路、および、スイッチの配置配線方法 |
| JP4492736B2 (ja) | 2008-06-12 | 2010-06-30 | ソニー株式会社 | 半導体集積回路 |
| JP5152160B2 (ja) * | 2009-11-24 | 2013-02-27 | ソニー株式会社 | 半導体集積回路 |
| TWI403742B (zh) * | 2009-12-22 | 2013-08-01 | Mstar Semiconductor Inc | 靜態瞬態電壓降分析裝置及方法 |
| TWI511453B (zh) * | 2010-02-02 | 2015-12-01 | Advanced Risc Mach Ltd | 功率控制積體電路與保持切換電路 |
| WO2011118351A1 (en) * | 2010-03-25 | 2011-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5540910B2 (ja) * | 2010-06-08 | 2014-07-02 | 富士通セミコンダクター株式会社 | 集積回路、集積回路設計装置及び集積回路設計方法 |
| JP2012216590A (ja) * | 2011-03-31 | 2012-11-08 | Elpida Memory Inc | 半導体装置 |
| US9317087B2 (en) * | 2012-04-26 | 2016-04-19 | Ravindraraj Ramaraju | Memory column drowsy control |
| US8779592B2 (en) * | 2012-05-01 | 2014-07-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Via-free interconnect structure with self-aligned metal line interconnections |
| JP5540389B2 (ja) * | 2012-09-14 | 2014-07-02 | ソニー株式会社 | 半導体集積回路 |
| JP6031675B2 (ja) * | 2012-10-01 | 2016-11-24 | 株式会社ソシオネクスト | 半導体装置のレイアウト構造およびレイアウト方法 |
| JP5542191B2 (ja) * | 2012-12-10 | 2014-07-09 | ルネサスエレクトロニクス株式会社 | 半導体集積回路の製造方法 |
| KR102000643B1 (ko) * | 2012-12-27 | 2019-07-16 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| CN104459302B (zh) * | 2013-09-23 | 2017-05-17 | 赛恩倍吉科技顾问(深圳)有限公司 | 功率偏差检测装置 |
| US9058459B1 (en) * | 2013-12-30 | 2015-06-16 | Samsung Electronics Co., Ltd. | Integrated circuit layouts and methods to reduce leakage |
| JP5773338B2 (ja) * | 2014-03-10 | 2015-09-02 | ソニー株式会社 | 半導体集積回路 |
| JP6384210B2 (ja) * | 2014-09-02 | 2018-09-05 | 株式会社ソシオネクスト | 半導体装置 |
| US10262981B2 (en) * | 2016-04-29 | 2019-04-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit, system for and method of forming an integrated circuit |
| US10318694B2 (en) * | 2016-11-18 | 2019-06-11 | Qualcomm Incorporated | Adaptive multi-tier power distribution grids for integrated circuits |
| KR102541506B1 (ko) | 2018-01-17 | 2023-06-08 | 삼성전자주식회사 | 스위치 셀들을 포함하는 반도체 장치 |
| CN116472605B (zh) * | 2020-11-27 | 2025-06-24 | 株式会社索思未来 | 半导体集成电路装置的设计方法、半导体集成电路装置以及计算机可读记录介质 |
| JP7635557B2 (ja) * | 2021-01-19 | 2025-02-26 | 株式会社ソシオネクスト | 半導体装置 |
| WO2022186012A1 (ja) * | 2021-03-05 | 2022-09-09 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| US11433285B1 (en) | 2021-03-09 | 2022-09-06 | Acushnet Company | Golf club head with hosel hole cover |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2972425B2 (ja) * | 1992-01-30 | 1999-11-08 | 日本電気アイシーマイコンシステム株式会社 | 半導体集積回路 |
| JP3020370B2 (ja) | 1993-01-13 | 2000-03-15 | 株式会社日本自動車部品総合研究所 | 気液分離装置 |
| JP3488735B2 (ja) | 1994-03-03 | 2004-01-19 | 三菱電機株式会社 | 半導体装置 |
| US5615162A (en) * | 1995-01-04 | 1997-03-25 | Texas Instruments Incorporated | Selective power to memory |
| US6000829A (en) * | 1996-09-11 | 1999-12-14 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit capable of compensating for flucuations in power supply voltage level and method of manufacturing the same |
| JP4056107B2 (ja) | 1997-06-20 | 2008-03-05 | エルピーダメモリ株式会社 | 半導体集積回路 |
| JPH11354721A (ja) * | 1998-06-04 | 1999-12-24 | Mitsubishi Electric Corp | 半導体装置 |
| WO1999066640A1 (en) * | 1998-06-18 | 1999-12-23 | Hitachi, Ltd. | Semiconductor integrated circuit |
| US6169419B1 (en) * | 1998-09-10 | 2001-01-02 | Intel Corporation | Method and apparatus for reducing standby leakage current using a transistor stack effect |
| JP3209972B2 (ja) * | 1999-01-14 | 2001-09-17 | 沖電気工業株式会社 | 半導体集積回路装置 |
| JP3530450B2 (ja) * | 2000-02-18 | 2004-05-24 | Necエレクトロニクス株式会社 | マクロ回路の配線方法、マクロ回路配線装置、及びマクロ回路 |
| JP2001298090A (ja) * | 2000-04-17 | 2001-10-26 | Nec Corp | 半導体装置 |
| JP2002016144A (ja) * | 2000-06-29 | 2002-01-18 | Toshiba Corp | 上層配線端子付きセル |
| US6501300B2 (en) * | 2000-11-21 | 2002-12-31 | Hitachi, Ltd. | Semiconductor integrated circuit |
| JP3847147B2 (ja) | 2001-11-22 | 2006-11-15 | 富士通株式会社 | マルチスレショールド電圧mis集積回路装置及びその回路設計方法 |
| DE10209073A1 (de) * | 2002-02-28 | 2003-09-18 | Infineon Technologies Ag | Halbleiterchip, sowie Verfahren und Vorrichtung zur Herstellung des Halbleiterchips |
| JP3770836B2 (ja) * | 2002-01-23 | 2006-04-26 | 株式会社ルネサステクノロジ | 高速に電源スイッチのオンオフが可能な論理回路及び同論理回路における電流低減方法 |
| KR20040094598A (ko) * | 2002-04-03 | 2004-11-10 | 소니 가부시끼 가이샤 | 집적회로, 집적회로장치, 집적회로장치의 구성방법 및집적회로장치의 제조방법 |
| JP3957560B2 (ja) | 2002-05-23 | 2007-08-15 | 松下電器産業株式会社 | 半導体装置 |
| JP4039618B2 (ja) | 2002-08-09 | 2008-01-30 | 東邦瓦斯株式会社 | 固体酸化物形燃料電池 |
| JP2004186666A (ja) | 2002-10-09 | 2004-07-02 | Fujitsu Ltd | 半導体集積回路装置 |
| JP4200926B2 (ja) * | 2004-03-10 | 2008-12-24 | ソニー株式会社 | 半導体集積回路 |
| US7279926B2 (en) * | 2004-05-27 | 2007-10-09 | Qualcomm Incoporated | Headswitch and footswitch circuitry for power management |
| US20090079465A1 (en) | 2005-04-21 | 2009-03-26 | Toshio Sasaki | Semiconductor integrated circuit |
| US7253662B2 (en) * | 2005-04-22 | 2007-08-07 | Faraday Technology Corp. | Method for forming an electric device comprising power switches around a logic circuit and related apparatus |
| JP4535134B2 (ja) * | 2008-01-16 | 2010-09-01 | ソニー株式会社 | 半導体集積回路およびその電源制御方法 |
-
2004
- 2004-03-10 JP JP2004067489A patent/JP4200926B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-03 US US11/070,205 patent/US7274210B2/en not_active Expired - Lifetime
- 2005-03-09 EP EP14190410.2A patent/EP2835827B1/en not_active Expired - Lifetime
- 2005-03-09 EP EP10193386.9A patent/EP2287907B1/en not_active Expired - Lifetime
- 2005-03-09 EP EP10193384.4A patent/EP2287906B1/en not_active Expired - Lifetime
- 2005-03-09 EP EP05290530A patent/EP1575091B1/en not_active Expired - Lifetime
- 2005-03-09 DE DE602005025951T patent/DE602005025951D1/de not_active Expired - Lifetime
- 2005-03-09 EP EP14190409.4A patent/EP2835826B1/en not_active Expired - Lifetime
- 2005-03-09 KR KR1020050019736A patent/KR101114555B1/ko not_active Expired - Fee Related
- 2005-03-10 CN CNB2005100537135A patent/CN1324685C/zh not_active Expired - Lifetime
- 2005-03-10 CN CN2007101070196A patent/CN101060120B/zh not_active Expired - Fee Related
-
2007
- 2007-06-14 US US11/808,976 patent/US7456659B2/en not_active Expired - Lifetime
- 2007-06-14 US US11/808,975 patent/US7459934B2/en not_active Expired - Lifetime
-
2008
- 2008-10-30 US US12/289,571 patent/US7696788B2/en not_active Ceased
-
2011
- 2011-12-29 US US13/340,130 patent/USRE43912E1/en not_active Expired - Fee Related
-
2012
- 2012-11-28 US US13/687,996 patent/USRE48694E1/en not_active Expired - Lifetime
-
2014
- 2014-06-10 US US14/301,197 patent/USRE48373E1/en not_active Expired - Lifetime
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