CN1324685C - 半导体集成电路 - Google Patents

半导体集成电路 Download PDF

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Publication number
CN1324685C
CN1324685C CNB2005100537135A CN200510053713A CN1324685C CN 1324685 C CN1324685 C CN 1324685C CN B2005100537135 A CNB2005100537135 A CN B2005100537135A CN 200510053713 A CN200510053713 A CN 200510053713A CN 1324685 C CN1324685 C CN 1324685C
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China
Prior art keywords
line
power
branch
connection line
branch line
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Expired - Lifetime
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CNB2005100537135A
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English (en)
Chinese (zh)
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CN1667815A (zh
Inventor
绪方博美
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Sony Corp
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Sony Corp
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34824577&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1324685(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN1667815A publication Critical patent/CN1667815A/zh
Application granted granted Critical
Publication of CN1324685C publication Critical patent/CN1324685C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63J—AUXILIARIES ON VESSELS
    • B63J2/00—Arrangements of ventilation, heating, cooling, or air-conditioning
    • B63J2/12—Heating; Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/40—Mixing liquids with liquids; Emulsifying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
    • B01F27/80—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0008—Arrangements for reducing power consumption
    • H03K19/0013—Arrangements for reducing power consumption in field effect transistor circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0008—Arrangements for reducing power consumption
    • H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CNB2005100537135A 2004-03-10 2005-03-10 半导体集成电路 Expired - Lifetime CN1324685C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004067489A JP4200926B2 (ja) 2004-03-10 2004-03-10 半導体集積回路
JP067489/2004 2004-03-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2007101070196A Division CN101060120B (zh) 2004-03-10 2005-03-10 半导体集成电路

Publications (2)

Publication Number Publication Date
CN1667815A CN1667815A (zh) 2005-09-14
CN1324685C true CN1324685C (zh) 2007-07-04

Family

ID=34824577

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2005100537135A Expired - Lifetime CN1324685C (zh) 2004-03-10 2005-03-10 半导体集成电路
CN2007101070196A Expired - Fee Related CN101060120B (zh) 2004-03-10 2005-03-10 半导体集成电路

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2007101070196A Expired - Fee Related CN101060120B (zh) 2004-03-10 2005-03-10 半导体集成电路

Country Status (6)

Country Link
US (7) US7274210B2 (enExample)
EP (5) EP2835827B1 (enExample)
JP (1) JP4200926B2 (enExample)
KR (1) KR101114555B1 (enExample)
CN (2) CN1324685C (enExample)
DE (1) DE602005025951D1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4200926B2 (ja) * 2004-03-10 2008-12-24 ソニー株式会社 半導体集積回路
JP2007095787A (ja) * 2005-09-27 2007-04-12 Nec Electronics Corp 半導体集積回路
JP4621113B2 (ja) * 2005-10-28 2011-01-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置
JP2007243077A (ja) * 2006-03-13 2007-09-20 Renesas Technology Corp 半導体集積回路装置
JP5038654B2 (ja) * 2006-06-06 2012-10-03 ルネサスエレクトロニクス株式会社 半導体装置
JP4144892B2 (ja) * 2006-08-28 2008-09-03 キヤノン株式会社 光電変換装置及び撮像装置
US7649787B2 (en) * 2006-09-05 2010-01-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR100835425B1 (ko) * 2006-09-14 2008-06-04 동부일렉트로닉스 주식회사 Ｍｔｃｍｏｓ반도체 집적회로
KR100772269B1 (ko) * 2006-09-21 2007-11-01 동부일렉트로닉스 주식회사 Ｍｔｃｍｏｓ 반도체 집적회로의 설계방법
JP2008098353A (ja) * 2006-10-11 2008-04-24 Nec Electronics Corp 半導体集積回路
JP5198785B2 (ja) 2007-03-30 2013-05-15 ルネサスエレクトロニクス株式会社 半導体装置
JP4962173B2 (ja) 2007-07-02 2012-06-27 ソニー株式会社 半導体集積回路
JP5528662B2 (ja) 2007-09-18 2014-06-25 ソニー株式会社 半導体集積回路
JP4636077B2 (ja) * 2007-11-07 2011-02-23 ソニー株式会社 半導体集積回路
US8922247B2 (en) * 2007-11-14 2014-12-30 Arm Limited Power controlling integrated circuit and retention switching circuit
JP2009170650A (ja) * 2008-01-16 2009-07-30 Sony Corp 半導体集積回路およびその配置配線方法
JP4535136B2 (ja) * 2008-01-17 2010-09-01 ソニー株式会社 半導体集積回路、および、スイッチの配置配線方法
JP4492736B2 (ja) 2008-06-12 2010-06-30 ソニー株式会社 半導体集積回路
JP5152160B2 (ja) * 2009-11-24 2013-02-27 ソニー株式会社 半導体集積回路
TWI403742B (zh) * 2009-12-22 2013-08-01 Mstar Semiconductor Inc 靜態瞬態電壓降分析裝置及方法
TWI511453B (zh) * 2010-02-02 2015-12-01 Advanced Risc Mach Ltd 功率控制積體電路與保持切換電路
WO2011118351A1 (en) * 2010-03-25 2011-09-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5540910B2 (ja) * 2010-06-08 2014-07-02 富士通セミコンダクター株式会社 集積回路、集積回路設計装置及び集積回路設計方法
JP2012216590A (ja) * 2011-03-31 2012-11-08 Elpida Memory Inc 半導体装置
US9317087B2 (en) * 2012-04-26 2016-04-19 Ravindraraj Ramaraju Memory column drowsy control
US8779592B2 (en) * 2012-05-01 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Via-free interconnect structure with self-aligned metal line interconnections
JP5540389B2 (ja) * 2012-09-14 2014-07-02 ソニー株式会社 半導体集積回路
JP6031675B2 (ja) * 2012-10-01 2016-11-24 株式会社ソシオネクスト 半導体装置のレイアウト構造およびレイアウト方法
JP5542191B2 (ja) * 2012-12-10 2014-07-09 ルネサスエレクトロニクス株式会社 半導体集積回路の製造方法
KR102000643B1 (ko) * 2012-12-27 2019-07-16 엘지디스플레이 주식회사 유기발광 표시장치
CN104459302B (zh) * 2013-09-23 2017-05-17 赛恩倍吉科技顾问（深圳）有限公司 功率偏差检测装置
US9058459B1 (en) * 2013-12-30 2015-06-16 Samsung Electronics Co., Ltd. Integrated circuit layouts and methods to reduce leakage
JP5773338B2 (ja) * 2014-03-10 2015-09-02 ソニー株式会社 半導体集積回路
JP6384210B2 (ja) * 2014-09-02 2018-09-05 株式会社ソシオネクスト 半導体装置
US10262981B2 (en) * 2016-04-29 2019-04-16 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit, system for and method of forming an integrated circuit
US10318694B2 (en) * 2016-11-18 2019-06-11 Qualcomm Incorporated Adaptive multi-tier power distribution grids for integrated circuits
KR102541506B1 (ko) 2018-01-17 2023-06-08 삼성전자주식회사 스위치 셀들을 포함하는 반도체 장치
CN116472605B (zh) * 2020-11-27 2025-06-24 株式会社索思未来 半导体集成电路装置的设计方法、半导体集成电路装置以及计算机可读记录介质
JP7635557B2 (ja) * 2021-01-19 2025-02-26 株式会社ソシオネクスト 半導体装置
WO2022186012A1 (ja) * 2021-03-05 2022-09-09 株式会社ソシオネクスト 半導体集積回路装置
US11433285B1 (en) 2021-03-09 2022-09-06 Acushnet Company Golf club head with hosel hole cover

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2972425B2 (ja) * 1992-01-30 1999-11-08 日本電気アイシーマイコンシステム株式会社 半導体集積回路
JP2002016144A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 上層配線端子付きセル
US6410936B1 (en) * 1998-06-04 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20030160268A1 (en) * 2002-02-28 2003-08-28 Michael Wagner Semiconductor chip, method and apparatus for fabricating the semiconductor chip
US6643840B2 (en) * 2000-02-18 2003-11-04 Nec Electronics Corporation Designing method of semiconductor integrated circuit using library storing mask pattern of macro circuit and designing apparatus executing the same

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3020370B2 (ja) 1993-01-13 2000-03-15 株式会社日本自動車部品総合研究所 気液分離装置
JP3488735B2 (ja) 1994-03-03 2004-01-19 三菱電機株式会社 半導体装置
US5615162A (en) * 1995-01-04 1997-03-25 Texas Instruments Incorporated Selective power to memory
US6000829A (en) * 1996-09-11 1999-12-14 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit capable of compensating for flucuations in power supply voltage level and method of manufacturing the same
JP4056107B2 (ja) 1997-06-20 2008-03-05 エルピーダメモリ株式会社 半導体集積回路
WO1999066640A1 (en) * 1998-06-18 1999-12-23 Hitachi, Ltd. Semiconductor integrated circuit
US6169419B1 (en) * 1998-09-10 2001-01-02 Intel Corporation Method and apparatus for reducing standby leakage current using a transistor stack effect
JP3209972B2 (ja) * 1999-01-14 2001-09-17 沖電気工業株式会社 半導体集積回路装置
JP2001298090A (ja) * 2000-04-17 2001-10-26 Nec Corp 半導体装置
US6501300B2 (en) * 2000-11-21 2002-12-31 Hitachi, Ltd. Semiconductor integrated circuit
JP3847147B2 (ja) 2001-11-22 2006-11-15 富士通株式会社 マルチスレショールド電圧ｍｉｓ集積回路装置及びその回路設計方法
JP3770836B2 (ja) * 2002-01-23 2006-04-26 株式会社ルネサステクノロジ 高速に電源スイッチのオンオフが可能な論理回路及び同論理回路における電流低減方法
KR20040094598A (ko) * 2002-04-03 2004-11-10 소니 가부시끼 가이샤 집적회로, 집적회로장치, 집적회로장치의 구성방법 및집적회로장치의 제조방법
JP3957560B2 (ja) 2002-05-23 2007-08-15 松下電器産業株式会社 半導体装置
JP4039618B2 (ja) 2002-08-09 2008-01-30 東邦瓦斯株式会社 固体酸化物形燃料電池
JP2004186666A (ja) 2002-10-09 2004-07-02 Fujitsu Ltd 半導体集積回路装置
JP4200926B2 (ja) * 2004-03-10 2008-12-24 ソニー株式会社 半導体集積回路
US7279926B2 (en) * 2004-05-27 2007-10-09 Qualcomm Incoporated Headswitch and footswitch circuitry for power management
US20090079465A1 (en) 2005-04-21 2009-03-26 Toshio Sasaki Semiconductor integrated circuit
US7253662B2 (en) * 2005-04-22 2007-08-07 Faraday Technology Corp. Method for forming an electric device comprising power switches around a logic circuit and related apparatus
JP4535134B2 (ja) * 2008-01-16 2010-09-01 ソニー株式会社 半導体集積回路およびその電源制御方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2972425B2 (ja) * 1992-01-30 1999-11-08 日本電気アイシーマイコンシステム株式会社 半導体集積回路
US6410936B1 (en) * 1998-06-04 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6643840B2 (en) * 2000-02-18 2003-11-04 Nec Electronics Corporation Designing method of semiconductor integrated circuit using library storing mask pattern of macro circuit and designing apparatus executing the same
JP2002016144A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 上層配線端子付きセル
US20030160268A1 (en) * 2002-02-28 2003-08-28 Michael Wagner Semiconductor chip, method and apparatus for fabricating the semiconductor chip

Also Published As

Publication number Publication date
USRE48373E1 (en) 2020-12-29
USRE43912E1 (en) 2013-01-08
US7456659B2 (en) 2008-11-25
EP2287907A2 (en) 2011-02-23
EP2835827A2 (en) 2015-02-11
US7459934B2 (en) 2008-12-02
EP1575091A2 (en) 2005-09-14
EP2835826A2 (en) 2015-02-11
EP2287907A3 (en) 2011-04-20
CN101060120B (zh) 2010-06-23
DE602005025951D1 (de) 2011-03-03
EP2287907B1 (en) 2018-11-28
US20050200383A1 (en) 2005-09-15
CN101060120A (zh) 2007-10-24
US20070241790A1 (en) 2007-10-18
EP2287906B1 (en) 2016-03-09
EP2835827B1 (en) 2019-06-12
CN1667815A (zh) 2005-09-14
US7696788B2 (en) 2010-04-13
USRE48694E1 (en) 2021-08-17
EP2835826A3 (en) 2015-04-22
US20070241779A1 (en) 2007-10-18
US20090079469A1 (en) 2009-03-26
US7274210B2 (en) 2007-09-25
KR20060043789A (ko) 2006-05-15
EP2287906A3 (en) 2011-04-20
EP1575091A3 (en) 2009-03-18
EP2835827A3 (en) 2015-04-22
JP4200926B2 (ja) 2008-12-24
EP2835826B1 (en) 2019-06-26
EP2287906A2 (en) 2011-02-23
EP1575091B1 (en) 2011-01-19
KR101114555B1 (ko) 2012-02-27
JP2005259879A (ja) 2005-09-22

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Granted publication date: 20070704