JP2005179541A5 - - Google Patents
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- JP2005179541A5 JP2005179541A5 JP2003423726A JP2003423726A JP2005179541A5 JP 2005179541 A5 JP2005179541 A5 JP 2005179541A5 JP 2003423726 A JP2003423726 A JP 2003423726A JP 2003423726 A JP2003423726 A JP 2003423726A JP 2005179541 A5 JP2005179541 A5 JP 2005179541A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
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- transmittance
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001296 polysiloxane Polymers 0.000 claims description 21
- 238000007259 addition reaction Methods 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- -1 siloxane unit Chemical group 0.000 description 29
- 238000002834 transmittance Methods 0.000 description 25
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000003786 synthesis reaction Methods 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 8
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 3
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- WYUIWUCVZCRTRH-UHFFFAOYSA-N [[[ethenyl(dimethyl)silyl]amino]-dimethylsilyl]ethene Chemical compound C=C[Si](C)(C)N[Si](C)(C)C=C WYUIWUCVZCRTRH-UHFFFAOYSA-N 0.000 description 1
- OOGRAMOPTBMVKO-UHFFFAOYSA-N bis[[ethenyl(dimethyl)silyl]oxy]-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)C1=CC=CC=C1 OOGRAMOPTBMVKO-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003423726A JP4801320B2 (ja) | 2003-12-19 | 2003-12-19 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
| CNB2004800377939A CN100489563C (zh) | 2003-12-19 | 2004-12-17 | 可加成固化的有机聚硅氧烷树脂组合物 |
| US10/583,436 US7649059B2 (en) | 2003-12-19 | 2004-12-17 | Addition-curable organopolysiloxane resin composition |
| AT04807824T ATE442597T1 (de) | 2003-12-19 | 2004-12-17 | Additionsaushärtbare organopolysiloxan- harzzusammensetzung |
| EP04807824A EP1695124B1 (en) | 2003-12-19 | 2004-12-17 | Addition-curable organopolysiloxane resin composition |
| DE602004023118T DE602004023118D1 (de) | 2003-12-19 | 2004-12-17 | Additionsaushärtbare organopolysiloxan-harzzusammensetzung |
| KR1020067014390A KR101176931B1 (ko) | 2003-12-19 | 2004-12-17 | 부가반응 경화형 오가노폴리실록산 수지 조성물 |
| PCT/JP2004/019469 WO2005062080A2 (en) | 2003-12-19 | 2004-12-17 | Addition-curable organopolysiloxane resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003423726A JP4801320B2 (ja) | 2003-12-19 | 2003-12-19 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005179541A JP2005179541A (ja) | 2005-07-07 |
| JP2005179541A5 true JP2005179541A5 (enExample) | 2008-06-05 |
| JP4801320B2 JP4801320B2 (ja) | 2011-10-26 |
Family
ID=34708763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003423726A Expired - Fee Related JP4801320B2 (ja) | 2003-12-19 | 2003-12-19 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7649059B2 (enExample) |
| EP (1) | EP1695124B1 (enExample) |
| JP (1) | JP4801320B2 (enExample) |
| KR (1) | KR101176931B1 (enExample) |
| CN (1) | CN100489563C (enExample) |
| AT (1) | ATE442597T1 (enExample) |
| DE (1) | DE602004023118D1 (enExample) |
| WO (1) | WO2005062080A2 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006137895A (ja) * | 2004-11-15 | 2006-06-01 | Ge Toshiba Silicones Co Ltd | 光学材料用ポリオルガノシロキサン組成物 |
| JP5138158B2 (ja) * | 2005-05-23 | 2013-02-06 | 信越化学工業株式会社 | Ｌｅｄ発光装置用シリコーンレンズ成形材料 |
| EP1905795A4 (en) | 2005-07-19 | 2010-08-11 | Dow Corning Toray Co Ltd | POLYSILOXAN AND MANUFACTURING METHOD THEREFOR |
| DE602007000068D1 (de) * | 2006-02-20 | 2008-09-25 | Shinetsu Chemical Co | Hitzeerhärtbare Silikonzusammensetzung |
| JP4822008B2 (ja) * | 2006-02-20 | 2011-11-24 | 信越化学工業株式会社 | 加熱硬化性シリコーン組成物 |
| JP5148088B2 (ja) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| KR20090115803A (ko) | 2007-02-13 | 2009-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 렌즈를 갖는 ｌｅｄ 소자 및 그 제조 방법 |
| US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
| JP4927019B2 (ja) * | 2007-04-10 | 2012-05-09 | 信越化学工業株式会社 | 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法 |
| JP2009007515A (ja) * | 2007-06-29 | 2009-01-15 | Showa Denko Kk | 微細パターン転写材料用組成物および微細パターンの形成方法 |
| JP2009155442A (ja) * | 2007-12-26 | 2009-07-16 | Nippon Steel Chem Co Ltd | レンズ用樹脂組成物及びその硬化物 |
| US8101242B2 (en) * | 2008-03-07 | 2012-01-24 | Sri International | Method of imparting corrosion resistance to a substrate surface, and coated substrates prepared thereby |
| US8629222B2 (en) | 2008-03-28 | 2014-01-14 | Mitsubishi Chemical Corporation | Curable polysiloxane composition, and polysiloxane cured product, optical member, member for aerospace industry, semiconductor light-emitting device, illuminating device and image display device using the same |
| JP5287116B2 (ja) * | 2008-10-09 | 2013-09-11 | 三菱化学株式会社 | ポリオルガノシロキサン硬化物及び発光装置の製造方法 |
| JP5383250B2 (ja) * | 2009-02-26 | 2014-01-08 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物及び硬化物 |
| FR2946657A1 (fr) * | 2009-06-12 | 2010-12-17 | Bluestar Silicones France | Procede d'etancheification et d'assemblage de composants d'un groupe moto-propulseur |
| FR2946656A1 (fr) * | 2009-06-12 | 2010-12-17 | Bluestar Silicones France | Procede d'etancheification et d'assemblage de composants d'un groupe moto-propulseur |
| FR2946981A1 (fr) * | 2009-06-19 | 2010-12-24 | Bluestar Silicones France | Composition silicone reticulable par deshydrogenocondensation en presence d'un catalyseur metallique |
| JP5554405B2 (ja) * | 2009-06-19 | 2014-07-23 | ブルースター・シリコーンズ・フランス・エスアエス | 非金属触媒の存在下において脱水素縮合によって架橋可能なシリコーン組成物 |
| KR101364798B1 (ko) * | 2009-06-19 | 2014-02-19 | 블루스타 실리콘즈 프랑스 에스에이에스 | 비-금속 촉매의 존재 하에 탈수소 축합에 의한 가교에 적합한 실리콘 조성물 |
| JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
| JP5453326B2 (ja) * | 2011-01-11 | 2014-03-26 | 積水化学工業株式会社 | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
| JP5919903B2 (ja) * | 2011-03-31 | 2016-05-18 | 三菱化学株式会社 | 半導体発光装置用パッケージ及び該パッケージを有してなる半導体発光装置並びにそれらの製造方法 |
| FI127433B (fi) | 2011-06-14 | 2018-05-31 | Pibond Oy | Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö |
| JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
| JP6057503B2 (ja) * | 2011-09-21 | 2017-01-11 | 東レ・ダウコーニング株式会社 | 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子 |
| WO2013096554A1 (en) * | 2011-12-20 | 2013-06-27 | 3M Innovative Properties Company | Dual condensation cure silicone |
| JP6046395B2 (ja) * | 2012-06-29 | 2016-12-14 | 東レ・ダウコーニング株式会社 | 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置 |
| JP6157085B2 (ja) | 2012-10-24 | 2017-07-05 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6084808B2 (ja) | 2012-10-24 | 2017-02-22 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6081774B2 (ja) * | 2012-10-30 | 2017-02-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| WO2014105963A2 (en) * | 2012-12-28 | 2014-07-03 | Dow Corning Corporation | Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers |
| KR101775476B1 (ko) * | 2013-08-09 | 2017-09-06 | 요코하마 고무 가부시키가이샤 | 경화성 수지 조성물 |
| CN105199397B (zh) * | 2014-06-17 | 2018-05-08 | 广州慧谷化学有限公司 | 一种可固化的有机聚硅氧烷组合物及半导体器件 |
| KR102757326B1 (ko) | 2018-06-12 | 2025-01-20 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재 |
| JP7170450B2 (ja) | 2018-07-31 | 2022-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物及び半導体装置 |
| EP3853299B1 (en) | 2018-09-19 | 2025-08-20 | Dow Silicones Corporation | Aryl scission inhibition in aryl-functionalized polysiloxane |
| EP3954739A4 (en) * | 2019-03-29 | 2022-12-28 | Dow Toray Co., Ltd. | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF |
| CN115353857B (zh) * | 2022-07-11 | 2023-06-27 | 武汉飞恩微电子有限公司 | 一种压力传感器芯片用封装介质及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3732330A (en) | 1972-03-08 | 1973-05-08 | Dow Corning | Curable compositions containing hydrogen-functional organopolysiloxanes |
| CA1133169A (en) | 1978-06-05 | 1982-10-05 | Dow Corning Corporation | Curable solventless organopolysiloxane compositions |
| US4472563A (en) * | 1984-02-06 | 1984-09-18 | Dow Corning Corporation | Heat curable silicones having improved room temperature stability |
| JPS62215658A (ja) * | 1986-03-17 | 1987-09-22 | Shin Etsu Chem Co Ltd | 光硬化性オルガノポリシロキサン組成物 |
| JP3024475B2 (ja) * | 1993-12-21 | 2000-03-21 | 信越化学工業株式会社 | オルガノポリシロキサン組成物及び光ファイバ |
| FR2727119B1 (fr) * | 1994-11-18 | 1997-01-03 | Rhone Poulenc Chimie | Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation |
| CN1155562A (zh) * | 1995-10-11 | 1997-07-30 | 陶氏康宁公司 | 改进粘合性的可固化有机聚硅氧烷组合物 |
| JPH10101935A (ja) * | 1996-09-27 | 1998-04-21 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| CN1194280A (zh) * | 1996-12-24 | 1998-09-30 | 陶氏康宁公司 | 具有改进粘合性的可固化有机硅组合物 |
| JP3983333B2 (ja) * | 1997-02-20 | 2007-09-26 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
| JP3344286B2 (ja) | 1997-06-12 | 2002-11-11 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| JP2000336272A (ja) * | 1999-05-28 | 2000-12-05 | Shin Etsu Chem Co Ltd | 定着ロール用液状付加硬化型シリコーンゴム組成物及び定着ロール |
| JP4009067B2 (ja) | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
| JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
| DE10359705A1 (de) * | 2003-12-18 | 2005-07-14 | Wacker-Chemie Gmbh | Additionsvernetzende Siliconharzzusammensetzungen |
-
2003
- 2003-12-19 JP JP2003423726A patent/JP4801320B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-17 EP EP04807824A patent/EP1695124B1/en not_active Expired - Lifetime
- 2004-12-17 KR KR1020067014390A patent/KR101176931B1/ko not_active Expired - Fee Related
- 2004-12-17 AT AT04807824T patent/ATE442597T1/de not_active IP Right Cessation
- 2004-12-17 CN CNB2004800377939A patent/CN100489563C/zh not_active Expired - Fee Related
- 2004-12-17 DE DE602004023118T patent/DE602004023118D1/de not_active Expired - Lifetime
- 2004-12-17 US US10/583,436 patent/US7649059B2/en not_active Expired - Fee Related
- 2004-12-17 WO PCT/JP2004/019469 patent/WO2005062080A2/en not_active Ceased
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