ATE442597T1 - Additionsaushärtbare organopolysiloxan- harzzusammensetzung - Google Patents
Additionsaushärtbare organopolysiloxan- harzzusammensetzungInfo
- Publication number
- ATE442597T1 ATE442597T1 AT04807824T AT04807824T ATE442597T1 AT E442597 T1 ATE442597 T1 AT E442597T1 AT 04807824 T AT04807824 T AT 04807824T AT 04807824 T AT04807824 T AT 04807824T AT E442597 T1 ATE442597 T1 AT E442597T1
- Authority
- AT
- Austria
- Prior art keywords
- organopolysiloxane resin
- resin composition
- addition curing
- phenyl
- curing organopolysiloxane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003423726A JP4801320B2 (ja) | 2003-12-19 | 2003-12-19 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
PCT/JP2004/019469 WO2005062080A2 (en) | 2003-12-19 | 2004-12-17 | Addition-curable organopolysiloxane resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE442597T1 true ATE442597T1 (de) | 2009-09-15 |
Family
ID=34708763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04807824T ATE442597T1 (de) | 2003-12-19 | 2004-12-17 | Additionsaushärtbare organopolysiloxan- harzzusammensetzung |
Country Status (8)
Country | Link |
---|---|
US (1) | US7649059B2 (de) |
EP (1) | EP1695124B1 (de) |
JP (1) | JP4801320B2 (de) |
KR (1) | KR101176931B1 (de) |
CN (1) | CN100489563C (de) |
AT (1) | ATE442597T1 (de) |
DE (1) | DE602004023118D1 (de) |
WO (1) | WO2005062080A2 (de) |
Families Citing this family (39)
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---|---|---|---|---|
JP2006137895A (ja) * | 2004-11-15 | 2006-06-01 | Ge Toshiba Silicones Co Ltd | 光学材料用ポリオルガノシロキサン組成物 |
JP5138158B2 (ja) * | 2005-05-23 | 2013-02-06 | 信越化学工業株式会社 | Led発光装置用シリコーンレンズ成形材料 |
CN101248106A (zh) | 2005-07-19 | 2008-08-20 | 陶氏康宁东丽株式会社 | 聚硅氧烷及其制造方法 |
EP1820824B1 (de) * | 2006-02-20 | 2008-08-13 | Shin-Etsu Chemical Co., Ltd. | Hitzeerhärtbare Silikonzusammensetzung |
JP4822008B2 (ja) * | 2006-02-20 | 2011-11-24 | 信越化学工業株式会社 | 加熱硬化性シリコーン組成物 |
JP5148088B2 (ja) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
KR20090115803A (ko) | 2007-02-13 | 2009-11-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 렌즈를 갖는 led 소자 및 그 제조 방법 |
JP4927019B2 (ja) * | 2007-04-10 | 2012-05-09 | 信越化学工業株式会社 | 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法 |
JP2009007515A (ja) * | 2007-06-29 | 2009-01-15 | Showa Denko Kk | 微細パターン転写材料用組成物および微細パターンの形成方法 |
JP2009155442A (ja) * | 2007-12-26 | 2009-07-16 | Nippon Steel Chem Co Ltd | レンズ用樹脂組成物及びその硬化物 |
US8101242B2 (en) * | 2008-03-07 | 2012-01-24 | Sri International | Method of imparting corrosion resistance to a substrate surface, and coated substrates prepared thereby |
WO2009119841A1 (ja) * | 2008-03-28 | 2009-10-01 | 三菱化学株式会社 | 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置 |
JP5287116B2 (ja) * | 2008-10-09 | 2013-09-11 | 三菱化学株式会社 | ポリオルガノシロキサン硬化物及び発光装置の製造方法 |
JP5383250B2 (ja) * | 2009-02-26 | 2014-01-08 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物及び硬化物 |
FR2946656A1 (fr) * | 2009-06-12 | 2010-12-17 | Bluestar Silicones France | Procede d'etancheification et d'assemblage de composants d'un groupe moto-propulseur |
FR2946657A1 (fr) * | 2009-06-12 | 2010-12-17 | Bluestar Silicones France | Procede d'etancheification et d'assemblage de composants d'un groupe moto-propulseur |
EP2443179B1 (de) * | 2009-06-19 | 2014-04-02 | Bluestar Silicones France | Silikonzusammensetzung zur vernetzung mittels dehydrokondensation in gegenwart eines metallkatalysators |
FR2946981A1 (fr) * | 2009-06-19 | 2010-12-24 | Bluestar Silicones France | Composition silicone reticulable par deshydrogenocondensation en presence d'un catalyseur metallique |
CN102575011B (zh) * | 2009-06-19 | 2014-03-12 | 蓝星有机硅法国公司 | 通过在非金属催化剂存在下脱氢缩合可交联的有机硅组合物 |
JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
JP5453326B2 (ja) * | 2011-01-11 | 2014-03-26 | 積水化学工業株式会社 | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
JP5919903B2 (ja) * | 2011-03-31 | 2016-05-18 | 三菱化学株式会社 | 半導体発光装置用パッケージ及び該パッケージを有してなる半導体発光装置並びにそれらの製造方法 |
FI127433B (fi) | 2011-06-14 | 2018-05-31 | Pibond Oy | Menetelmä siloksaanimonomeerien syntetisoimiseksi sekä näiden käyttö |
JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
JP6057503B2 (ja) * | 2011-09-21 | 2017-01-11 | 東レ・ダウコーニング株式会社 | 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子 |
JP2015508433A (ja) * | 2011-12-20 | 2015-03-19 | スリーエム イノベイティブ プロパティズ カンパニー | 二重縮合硬化シリコーン |
JP6046395B2 (ja) * | 2012-06-29 | 2016-12-14 | 東レ・ダウコーニング株式会社 | 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置 |
JP6084808B2 (ja) | 2012-10-24 | 2017-02-22 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP6157085B2 (ja) | 2012-10-24 | 2017-07-05 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP6081774B2 (ja) * | 2012-10-30 | 2017-02-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
TW201431959A (zh) * | 2012-12-28 | 2014-08-16 | Dow Corning | 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用 |
WO2015019705A1 (ja) * | 2013-08-09 | 2015-02-12 | 横浜ゴム株式会社 | 硬化性樹脂組成物 |
CN105199397B (zh) * | 2014-06-17 | 2018-05-08 | 广州慧谷化学有限公司 | 一种可固化的有机聚硅氧烷组合物及半导体器件 |
CN112218912A (zh) * | 2018-06-12 | 2021-01-12 | 迈图高新材料日本合同公司 | 硅酮固化物的制备方法、硅酮固化物及光学用部件 |
JP7170450B2 (ja) | 2018-07-31 | 2022-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物及び半導体装置 |
WO2020060702A1 (en) | 2018-09-19 | 2020-03-26 | Dow Silicones Corporation | Aryl scission inhibition in aryl-functionalized polysiloxane |
CN113490722A (zh) * | 2019-03-29 | 2021-10-08 | 陶氏东丽株式会社 | 固化性有机硅组合物、其固化物及其制造方法 |
CN115353857B (zh) * | 2022-07-11 | 2023-06-27 | 武汉飞恩微电子有限公司 | 一种压力传感器芯片用封装介质及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3732330A (en) | 1972-03-08 | 1973-05-08 | Dow Corning | Curable compositions containing hydrogen-functional organopolysiloxanes |
CA1133169A (en) | 1978-06-05 | 1982-10-05 | Dow Corning Corporation | Curable solventless organopolysiloxane compositions |
US4472563A (en) | 1984-02-06 | 1984-09-18 | Dow Corning Corporation | Heat curable silicones having improved room temperature stability |
JPS62215658A (ja) * | 1986-03-17 | 1987-09-22 | Shin Etsu Chem Co Ltd | 光硬化性オルガノポリシロキサン組成物 |
JP3024475B2 (ja) * | 1993-12-21 | 2000-03-21 | 信越化学工業株式会社 | オルガノポリシロキサン組成物及び光ファイバ |
FR2727119B1 (fr) * | 1994-11-18 | 1997-01-03 | Rhone Poulenc Chimie | Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation |
CN1155562A (zh) * | 1995-10-11 | 1997-07-30 | 陶氏康宁公司 | 改进粘合性的可固化有机聚硅氧烷组合物 |
JPH10101935A (ja) * | 1996-09-27 | 1998-04-21 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
CN1194280A (zh) * | 1996-12-24 | 1998-09-30 | 陶氏康宁公司 | 具有改进粘合性的可固化有机硅组合物 |
JP3983333B2 (ja) * | 1997-02-20 | 2007-09-26 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
JP3344286B2 (ja) | 1997-06-12 | 2002-11-11 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
JP2000336272A (ja) * | 1999-05-28 | 2000-12-05 | Shin Etsu Chem Co Ltd | 定着ロール用液状付加硬化型シリコーンゴム組成物及び定着ロール |
JP4009067B2 (ja) * | 2001-03-06 | 2007-11-14 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物 |
JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
DE10359705A1 (de) * | 2003-12-18 | 2005-07-14 | Wacker-Chemie Gmbh | Additionsvernetzende Siliconharzzusammensetzungen |
-
2003
- 2003-12-19 JP JP2003423726A patent/JP4801320B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-17 EP EP04807824A patent/EP1695124B1/de not_active Not-in-force
- 2004-12-17 US US10/583,436 patent/US7649059B2/en not_active Expired - Fee Related
- 2004-12-17 KR KR1020067014390A patent/KR101176931B1/ko not_active IP Right Cessation
- 2004-12-17 CN CNB2004800377939A patent/CN100489563C/zh not_active Expired - Fee Related
- 2004-12-17 WO PCT/JP2004/019469 patent/WO2005062080A2/en active Application Filing
- 2004-12-17 AT AT04807824T patent/ATE442597T1/de not_active IP Right Cessation
- 2004-12-17 DE DE602004023118T patent/DE602004023118D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
CN1894600A (zh) | 2007-01-10 |
US20070244214A1 (en) | 2007-10-18 |
JP2005179541A (ja) | 2005-07-07 |
DE602004023118D1 (de) | 2009-10-22 |
JP4801320B2 (ja) | 2011-10-26 |
KR101176931B1 (ko) | 2012-08-30 |
US7649059B2 (en) | 2010-01-19 |
EP1695124A2 (de) | 2006-08-30 |
WO2005062080A3 (en) | 2006-03-02 |
KR20070004581A (ko) | 2007-01-09 |
CN100489563C (zh) | 2009-05-20 |
WO2005062080A2 (en) | 2005-07-07 |
EP1695124B1 (de) | 2009-09-09 |
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Legal Events
Date | Code | Title | Description |
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |