ATE456624T1 - Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material - Google Patents

Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material

Info

Publication number
ATE456624T1
ATE456624T1 AT04799945T AT04799945T ATE456624T1 AT E456624 T1 ATE456624 T1 AT E456624T1 AT 04799945 T AT04799945 T AT 04799945T AT 04799945 T AT04799945 T AT 04799945T AT E456624 T1 ATE456624 T1 AT E456624T1
Authority
AT
Austria
Prior art keywords
organopolysiloxane resin
optical material
resin composition
weight
parts
Prior art date
Application number
AT04799945T
Other languages
English (en)
Inventor
Makoto Yoshitake
Koji Nakanishi
Hisataka Nakashima
Hideki Kobayashi
Masashi Murakami
Kasumi Takeuchi
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE456624T1 publication Critical patent/ATE456624T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT04799945T 2003-12-02 2004-11-29 Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material ATE456624T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003402810A JP2005162859A (ja) 2003-12-02 2003-12-02 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
PCT/JP2004/018093 WO2005054371A2 (en) 2003-12-02 2004-11-29 Addition-curable organopolysiloxane resin composition and an optical material

Publications (1)

Publication Number Publication Date
ATE456624T1 true ATE456624T1 (de) 2010-02-15

Family

ID=34650044

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04799945T ATE456624T1 (de) 2003-12-02 2004-11-29 Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material

Country Status (10)

Country Link
US (1) US7625986B2 (de)
EP (1) EP1699875B1 (de)
JP (1) JP2005162859A (de)
KR (1) KR101150744B1 (de)
CN (1) CN100465233C (de)
AT (1) ATE456624T1 (de)
DE (1) DE602004025379D1 (de)
MY (1) MY140964A (de)
TW (1) TWI366589B (de)
WO (1) WO2005054371A2 (de)

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US8071697B2 (en) * 2005-05-26 2011-12-06 Dow Corning Corporation Silicone encapsulant composition for molding small shapes
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
WO2007100445A2 (en) * 2006-02-24 2007-09-07 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP4933179B2 (ja) 2006-07-14 2012-05-16 信越化学工業株式会社 硬化性シリコーンゴム組成物及びその硬化物
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5085089B2 (ja) * 2006-10-17 2012-11-28 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 シリコーンゴム組成物
DE102007055485A1 (de) * 2007-11-21 2009-06-04 Evonik Goldschmidt Gmbh Verfahren zur Herstellung verzweigter SiH-funktioneller Polysiloxane und deren Verwendung zur Herstellung SiC- und SiOC-verknüpfter, verzweigter organomodifizierter Polysiloxane
JP5844252B2 (ja) 2010-04-02 2016-01-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
US8519429B2 (en) * 2010-06-24 2013-08-27 Sekisui Chemical Co., Ltd. Encapsulant for optical semiconductor device and optical semiconductor device using same
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
WO2012078617A1 (en) * 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
JP2014506263A (ja) * 2010-12-08 2014-03-13 ダウ コーニング コーポレーション 封止材を作成するのに好適なシロキサン組成物
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
KR101562091B1 (ko) 2011-11-25 2015-10-21 주식회사 엘지화학 경화성 조성물
EP2850122B1 (de) 2012-05-14 2018-08-01 Momentive Performance Materials Inc. Material mit hohem brechungsindex
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
WO2014021419A1 (ja) * 2012-08-03 2014-02-06 横浜ゴム株式会社 硬化性樹脂組成物
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN103012456B (zh) * 2012-12-18 2015-11-18 烟台德邦先进硅材料有限公司 一种大功率led封装用有机硅低聚体的制备方法
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
EP2994290B1 (de) 2013-05-10 2023-10-04 ABL IP Holding LLC Silikonoptik
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
CN104892940B (zh) * 2014-03-05 2018-08-24 马凤国 一种硅氧烷的制备方法
TW201602174A (zh) * 2014-05-23 2016-01-16 Daicel Corp 分枝鏈狀聚有機矽烷氧基矽烷基烯、其製造方法、硬化性樹脂組成物及半導體裝置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
DE102015225906A1 (de) * 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
WO2017143508A1 (en) * 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR20210018999A (ko) * 2018-06-12 2021-02-19 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재

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US3944519A (en) 1975-03-13 1976-03-16 Dow Corning Corporation Curable organopolysiloxane compositions
US3948848A (en) * 1975-08-04 1976-04-06 Dow Corning Corporation Low temperature solventless silicone resins
US4198131A (en) * 1978-03-23 1980-04-15 Dow Corning Corporation Silicone resin optical devices
CA1133169A (en) 1978-06-05 1982-10-05 Dow Corning Corporation Curable solventless organopolysiloxane compositions
US4234713A (en) * 1979-05-29 1980-11-18 Dow Corning Corporation Curable solventless organopolysiloxane compositions
JPH07292320A (ja) * 1994-04-22 1995-11-07 Shin Etsu Chem Co Ltd プライマー組成物及びシリコーン積層体
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3489639B2 (ja) * 1994-06-17 2004-01-26 信越化学工業株式会社 無溶剤型剥離性オルガノポリシロキサン組成物
DE59607465D1 (de) * 1996-04-18 2001-09-13 Kettenbach Gmbh & Co Kg Additionsvernetzende 2-komponenten-siliconmaterialien
JPH10158400A (ja) * 1996-11-27 1998-06-16 Shin Etsu Polymer Co Ltd 光学用レンズ
JP3344286B2 (ja) * 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
DE10017154A1 (de) * 2000-04-06 2001-11-22 Wacker Chemie Gmbh Niedermolekulare alkenyl-terminierte Polydiorganosiloxane enthaltende additionsvernetzbare Siliconmassen
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物

Also Published As

Publication number Publication date
WO2005054371A2 (en) 2005-06-16
KR20060135684A (ko) 2006-12-29
TW200528518A (en) 2005-09-01
CN100465233C (zh) 2009-03-04
MY140964A (en) 2010-02-12
EP1699875A2 (de) 2006-09-13
US7625986B2 (en) 2009-12-01
US20080033120A1 (en) 2008-02-07
DE602004025379D1 (de) 2010-03-18
WO2005054371A3 (en) 2005-08-11
EP1699875B1 (de) 2010-01-27
CN1890324A (zh) 2007-01-03
JP2005162859A (ja) 2005-06-23
KR101150744B1 (ko) 2012-06-08
TWI366589B (en) 2012-06-21

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