CN1890324A - 可加成固化的有机聚硅氧烷树脂组合物和光学材料 - Google Patents
可加成固化的有机聚硅氧烷树脂组合物和光学材料 Download PDFInfo
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- CN1890324A CN1890324A CNA2004800358196A CN200480035819A CN1890324A CN 1890324 A CN1890324 A CN 1890324A CN A2004800358196 A CNA2004800358196 A CN A2004800358196A CN 200480035819 A CN200480035819 A CN 200480035819A CN 1890324 A CN1890324 A CN 1890324A
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- alkenyl
- phenyl
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 77
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- 230000003287 optical effect Effects 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 claims abstract description 73
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 67
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000007259 addition reaction Methods 0.000 claims abstract description 14
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 5
- 230000003197 catalytic effect Effects 0.000 claims abstract description 4
- -1 polysiloxanes Polymers 0.000 claims description 88
- 229910052739 hydrogen Inorganic materials 0.000 claims description 30
- 239000001257 hydrogen Substances 0.000 claims description 30
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 239000004793 Polystyrene Substances 0.000 claims description 13
- 238000005227 gel permeation chromatography Methods 0.000 claims description 13
- 229920002223 polystyrene Polymers 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 11
- 229910014307 bSiO Inorganic materials 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 75
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 53
- 229910052697 platinum Inorganic materials 0.000 description 26
- 239000000047 product Substances 0.000 description 22
- 238000010992 reflux Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 239000007787 solid Substances 0.000 description 18
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- AJUBKAPANIUYJT-UHFFFAOYSA-N 2-methylprop-1-enyl(silyloxy)silane Chemical group CC(C)=C[SiH2]O[SiH3] AJUBKAPANIUYJT-UHFFFAOYSA-N 0.000 description 11
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 9
- 150000001721 carbon Chemical group 0.000 description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 235000010290 biphenyl Nutrition 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 238000013019 agitation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- CMQCNTNASCDNGR-UHFFFAOYSA-N toluene;hydrate Chemical compound O.CC1=CC=CC=C1 CMQCNTNASCDNGR-UHFFFAOYSA-N 0.000 description 6
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 5
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- CRXNJSWBRJXDTE-UHFFFAOYSA-N Cl[SiH2]Cl.CC=C Chemical compound Cl[SiH2]Cl.CC=C CRXNJSWBRJXDTE-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 238000002207 thermal evaporation Methods 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical group C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 150000003057 platinum Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XLFPVMWSGUZRFK-UHFFFAOYSA-N [Pt].C(C)CC(CC(=O)O)=O Chemical compound [Pt].C(C)CC(CC(=O)O)=O XLFPVMWSGUZRFK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000319 biphenyl-4-yl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- VDCSGNNYCFPWFK-UHFFFAOYSA-N diphenylsilane Chemical class C=1C=CC=CC=1[SiH2]C1=CC=CC=C1 VDCSGNNYCFPWFK-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- NOKUWSXLHXMAOM-UHFFFAOYSA-N hydroxy(phenyl)silicon Chemical group O[Si]C1=CC=CC=C1 NOKUWSXLHXMAOM-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- AFFLGGQVNFXPEV-UHFFFAOYSA-N n-decene Natural products CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003283 rhodium Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
组分(A) | 组分(B) | 组分(C) | ||||||||
a | b | Ph% | Mw | c | d | Ph% | e | f | Ph% | |
实践实施例1 | 0.15 | 1.15 | 74 | 3030 | 0.67 | 2.00 | 33 | 0.60 | 1.60 | 25 |
实践实施例2 | 0.10 | 1.15 | 65 | 7200 | 0.67 | 2.00 | 33 | 0.60 | 1.60 | 25 |
实践实施例3 | 0.10 | 1.15 | 65 | 7200 | 0.50 | 1.83 | 20 | 0.40 | 1.40 | 43 |
实践实施例4 | 0.10 | 1.15 | 65 | 7200 | 0.50 | 1.83 | 20 | 0.50 | 1.00 | 50 |
对比例1 | (0.25) | 1.25 | 60 | (2300) | 0.67 | 2.00 | 33 | 0.40 | 1.40 | 43 |
对比例2 | (0.30) | 1.15 | 48 | (2700) | - | - | - | 0.60 | 1.60 | 25 |
对比例3 | 0.10 | 1.15 | 65 | 7200 | 0.75 | 1.75 | 14 | (0.75) | (1.75) | (14) |
对比例4 | (0.05) | 1.15 | 65 | 7100 | 0.67 | 2.00 | 33 | 0.40 | 1.40 | 43 |
对比例5 | 0.10 | (1.40) | (18) | 4200 | 0.75 | 1.75 | 14 | 0.50 | (1.00) | (0) |
含量 | 粘度Pa.s | 肖氏硬度 | ||||
(A) | (B) | (C) | 25℃ | 150℃ | ||
实践实施例1 | 100 | 17.8 | 30.0 | 1040 | 70 | 43 |
实践实施例2 | 100 | 19.7 | 31.6 | 1100 | 72 | 56 |
实践实施例3 | 100 | 33.3 | 88.0 | 12 | 68 | 48 |
实践实施例4 | 100 | 33.3 | 85.0 | 15 | 72 | 53 |
对比例1 | 100 | 22.5 | 90.1 | 4.8 | 68 | (32) |
对比例2 | 100 | (0) | 51.1 | 32 | 72 | (30) |
对比例3 | 100 | 16.5 | 29.5 | 16 | 70 | (35) |
对比例4 | 100 | 40 | 69.5 | 24 | (52) | (20) |
对比例5 | 100 | 12.3 | 23.6 | 2.7 | 66 | (20) |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003402810A JP2005162859A (ja) | 2003-12-02 | 2003-12-02 | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
JP402810/2003 | 2003-12-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1890324A true CN1890324A (zh) | 2007-01-03 |
CN100465233C CN100465233C (zh) | 2009-03-04 |
Family
ID=34650044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800358196A Expired - Fee Related CN100465233C (zh) | 2003-12-02 | 2004-11-29 | 可加成固化的有机聚硅氧烷树脂组合物和光学材料 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7625986B2 (zh) |
EP (1) | EP1699875B1 (zh) |
JP (1) | JP2005162859A (zh) |
KR (1) | KR101150744B1 (zh) |
CN (1) | CN100465233C (zh) |
AT (1) | ATE456624T1 (zh) |
DE (1) | DE602004025379D1 (zh) |
MY (1) | MY140964A (zh) |
TW (1) | TWI366589B (zh) |
WO (1) | WO2005054371A2 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103232707A (zh) * | 2013-04-19 | 2013-08-07 | 深圳新宙邦科技股份有限公司 | 可固化硅橡胶组合物及其固化产品与涂覆固化方法 |
CN104411771A (zh) * | 2012-08-03 | 2015-03-11 | 横滨橡胶株式会社 | 硬化性树脂组合物 |
CN104892940A (zh) * | 2014-03-05 | 2015-09-09 | 马凤国 | 一种硅氧烷的制备方法 |
CN105960437A (zh) * | 2014-02-19 | 2016-09-21 | 道康宁公司 | 反应性有机硅组合物、由其制成的热熔材料和可固化热熔组合物 |
US9598542B2 (en) | 2011-11-25 | 2017-03-21 | Lg Chem, Ltd. | Curable composition |
CN108291089A (zh) * | 2015-12-18 | 2018-07-17 | 瓦克化学股份公司 | 硅氧烷树脂组合物 |
CN112218912A (zh) * | 2018-06-12 | 2021-01-12 | 迈图高新材料日本合同公司 | 硅酮固化物的制备方法、硅酮固化物及光学用部件 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006127100A1 (en) * | 2005-05-26 | 2006-11-30 | Dow Corning Corporation | Process and silicone encapsulant composition for molding small shapes |
JP5392805B2 (ja) | 2005-06-28 | 2014-01-22 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
JP2009527622A (ja) * | 2006-02-24 | 2009-07-30 | ダウ・コーニング・コーポレイション | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
JP4933179B2 (ja) | 2006-07-14 | 2012-05-16 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物及びその硬化物 |
JP5148088B2 (ja) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP5085089B2 (ja) * | 2006-10-17 | 2012-11-28 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シリコーンゴム組成物 |
DE102007055485A1 (de) * | 2007-11-21 | 2009-06-04 | Evonik Goldschmidt Gmbh | Verfahren zur Herstellung verzweigter SiH-funktioneller Polysiloxane und deren Verwendung zur Herstellung SiC- und SiOC-verknüpfter, verzweigter organomodifizierter Polysiloxane |
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- 2004-11-29 CN CNB2004800358196A patent/CN100465233C/zh not_active Expired - Fee Related
- 2004-11-29 EP EP04799945A patent/EP1699875B1/en not_active Not-in-force
- 2004-11-29 DE DE602004025379T patent/DE602004025379D1/de active Active
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- 2004-11-29 WO PCT/JP2004/018093 patent/WO2005054371A2/en active Application Filing
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- 2004-12-02 TW TW93137211A patent/TWI366589B/zh not_active IP Right Cessation
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US9598542B2 (en) | 2011-11-25 | 2017-03-21 | Lg Chem, Ltd. | Curable composition |
CN104411771A (zh) * | 2012-08-03 | 2015-03-11 | 横滨橡胶株式会社 | 硬化性树脂组合物 |
CN104411771B (zh) * | 2012-08-03 | 2017-02-22 | 横滨橡胶株式会社 | 硬化性树脂组合物 |
CN103232707A (zh) * | 2013-04-19 | 2013-08-07 | 深圳新宙邦科技股份有限公司 | 可固化硅橡胶组合物及其固化产品与涂覆固化方法 |
CN103232707B (zh) * | 2013-04-19 | 2015-12-09 | 深圳新宙邦科技股份有限公司 | 可固化硅橡胶组合物及其固化产品与涂覆固化方法 |
CN105960437A (zh) * | 2014-02-19 | 2016-09-21 | 道康宁公司 | 反应性有机硅组合物、由其制成的热熔材料和可固化热熔组合物 |
CN105960437B (zh) * | 2014-02-19 | 2019-01-22 | 美国陶氏有机硅公司 | 反应性有机硅组合物、由其制成的热熔材料和可固化热熔组合物 |
CN104892940A (zh) * | 2014-03-05 | 2015-09-09 | 马凤国 | 一种硅氧烷的制备方法 |
CN108291089A (zh) * | 2015-12-18 | 2018-07-17 | 瓦克化学股份公司 | 硅氧烷树脂组合物 |
CN112218912A (zh) * | 2018-06-12 | 2021-01-12 | 迈图高新材料日本合同公司 | 硅酮固化物的制备方法、硅酮固化物及光学用部件 |
US12065567B2 (en) | 2018-06-12 | 2024-08-20 | Momentive Performance Materials Japan Llc | Method of manufacturing silicone cured product, silicone cured product and optical member |
Also Published As
Publication number | Publication date |
---|---|
US7625986B2 (en) | 2009-12-01 |
WO2005054371A2 (en) | 2005-06-16 |
TWI366589B (en) | 2012-06-21 |
TW200528518A (en) | 2005-09-01 |
JP2005162859A (ja) | 2005-06-23 |
EP1699875A2 (en) | 2006-09-13 |
US20080033120A1 (en) | 2008-02-07 |
EP1699875B1 (en) | 2010-01-27 |
MY140964A (en) | 2010-02-12 |
KR101150744B1 (ko) | 2012-06-08 |
WO2005054371A3 (en) | 2005-08-11 |
KR20060135684A (ko) | 2006-12-29 |
CN100465233C (zh) | 2009-03-04 |
DE602004025379D1 (de) | 2010-03-18 |
ATE456624T1 (de) | 2010-02-15 |
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