JP2005064362A - 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法 - Google Patents

電子装置の製造方法及びその電子装置並びに半導体装置の製造方法 Download PDF

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Publication number
JP2005064362A
JP2005064362A JP2003295067A JP2003295067A JP2005064362A JP 2005064362 A JP2005064362 A JP 2005064362A JP 2003295067 A JP2003295067 A JP 2003295067A JP 2003295067 A JP2003295067 A JP 2003295067A JP 2005064362 A JP2005064362 A JP 2005064362A
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Prior art keywords
electronic device
electrode
manufacturing
chip
adhesive layer
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Pending
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JP2003295067A
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Japanese (ja)
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JP2005064362A5 (https=
Inventor
Yoichiro Kurita
洋一郎 栗田
Rieka Oouchi
利枝佳 大内
Takashi Miyazaki
崇誌 宮崎
Toshiyuki Yamada
俊之 山田
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NEC Electronics Corp
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NEC Electronics Corp
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Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to JP2003295067A priority Critical patent/JP2005064362A/ja
Priority to KR1020040064361A priority patent/KR100652242B1/ko
Priority to US10/919,411 priority patent/US7238548B2/en
Priority to CNB2004100577886A priority patent/CN100438001C/zh
Priority to CN2008101610589A priority patent/CN101388387B/zh
Priority to TW093124940A priority patent/TWI248655B/zh
Publication of JP2005064362A publication Critical patent/JP2005064362A/ja
Publication of JP2005064362A5 publication Critical patent/JP2005064362A5/ja
Priority to US11/798,224 priority patent/US7554205B2/en
Priority to US12/257,689 priority patent/US7763985B2/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003295067A 2003-08-19 2003-08-19 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法 Pending JP2005064362A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2003295067A JP2005064362A (ja) 2003-08-19 2003-08-19 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法
KR1020040064361A KR100652242B1 (ko) 2003-08-19 2004-08-16 플립칩형 반도체장치, 이의 제조를 위한 제조방법 및 이런 플립칩형 반도체장치를 사용하여 전자제품을 제조하기 위한 제조방법
US10/919,411 US7238548B2 (en) 2003-08-19 2004-08-17 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
CNB2004100577886A CN100438001C (zh) 2003-08-19 2004-08-19 倒装芯片型半导体器件及其制造工艺和电子产品制造工艺
CN2008101610589A CN101388387B (zh) 2003-08-19 2004-08-19 电子装置和制造电子装置的方法
TW093124940A TWI248655B (en) 2003-08-19 2004-08-19 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
US11/798,224 US7554205B2 (en) 2003-08-19 2007-05-11 Flip-chip type semiconductor device
US12/257,689 US7763985B2 (en) 2003-08-19 2008-10-24 Flip-chip type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003295067A JP2005064362A (ja) 2003-08-19 2003-08-19 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2008110753A Division JP2008219039A (ja) 2008-04-21 2008-04-21 半導体パッケージ及び製造方法
JP2008265799A Division JP2009065183A (ja) 2008-10-14 2008-10-14 電子装置及びその電子装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005064362A true JP2005064362A (ja) 2005-03-10
JP2005064362A5 JP2005064362A5 (https=) 2005-10-06

Family

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JP2003295067A Pending JP2005064362A (ja) 2003-08-19 2003-08-19 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法

Country Status (5)

Country Link
US (3) US7238548B2 (https=)
JP (1) JP2005064362A (https=)
KR (1) KR100652242B1 (https=)
CN (2) CN101388387B (https=)
TW (1) TWI248655B (https=)

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JP2007194303A (ja) * 2006-01-18 2007-08-02 Sony Corp 半導体装置の製造方法
JP2011086829A (ja) * 2009-10-16 2011-04-28 Renesas Electronics Corp 半導体パッケージ及びその製造方法
US8981574B2 (en) 2012-12-20 2015-03-17 Samsung Electronics Co., Ltd. Semiconductor package
US9356397B2 (en) 2012-01-19 2016-05-31 Asustek Computer Inc. Connector and electronic system using the same
CN113524015A (zh) * 2020-04-13 2021-10-22 株式会社迪思科 板状物的加工方法

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KR101281748B1 (ko) * 2008-10-23 2013-07-04 엘지디스플레이 주식회사 상부 발광방식 유기전계발광소자
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US11018133B2 (en) * 2009-10-12 2021-05-25 Monolithic 3D Inc. 3D integrated circuit
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US9620455B2 (en) * 2010-06-24 2017-04-11 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
JP5252007B2 (ja) * 2011-03-08 2013-07-31 株式会社村田製作所 電子部品の製造方法
US9075105B2 (en) 2011-09-29 2015-07-07 Broadcom Corporation Passive probing of various locations in a wireless enabled integrated circuit (IC)
US9570420B2 (en) 2011-09-29 2017-02-14 Broadcom Corporation Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package
US8508029B2 (en) * 2011-09-29 2013-08-13 Broadcom Corporation Semiconductor package including an integrated waveguide
US9318785B2 (en) 2011-09-29 2016-04-19 Broadcom Corporation Apparatus for reconfiguring an integrated waveguide
TWI467733B (zh) * 2012-05-16 2015-01-01 矽品精密工業股份有限公司 半導體封裝件及其製法
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CN110246814B (zh) * 2019-05-30 2021-07-06 全球能源互联网研究院有限公司 功率芯片预封装、封装方法及其结构、晶圆预封装结构
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JP2003168700A (ja) 2001-09-18 2003-06-13 Seiko Epson Corp 半導体ウエハ、半導体装置及びその製造方法、回路基板並びに電子機器
US6838316B2 (en) * 2002-03-06 2005-01-04 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method using ultrasonic flip chip bonding technique

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JP2007194303A (ja) * 2006-01-18 2007-08-02 Sony Corp 半導体装置の製造方法
JP2011086829A (ja) * 2009-10-16 2011-04-28 Renesas Electronics Corp 半導体パッケージ及びその製造方法
US8456020B2 (en) 2009-10-16 2013-06-04 Renesas Electronics Corporation Semiconductor package and method of manufacturing the same
US9356397B2 (en) 2012-01-19 2016-05-31 Asustek Computer Inc. Connector and electronic system using the same
US8981574B2 (en) 2012-12-20 2015-03-17 Samsung Electronics Co., Ltd. Semiconductor package
US9633973B2 (en) 2012-12-20 2017-04-25 Samsung Electronics Co., Ltd. Semiconductor package
CN113524015A (zh) * 2020-04-13 2021-10-22 株式会社迪思科 板状物的加工方法

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US7763985B2 (en) 2010-07-27
KR100652242B1 (ko) 2006-12-01
CN1585123A (zh) 2005-02-23
US20050040541A1 (en) 2005-02-24
CN101388387A (zh) 2009-03-18
US20070216035A1 (en) 2007-09-20
US7238548B2 (en) 2007-07-03
CN100438001C (zh) 2008-11-26
US7554205B2 (en) 2009-06-30
TWI248655B (en) 2006-02-01
KR20050020632A (ko) 2005-03-04

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