JP5014890B2 - 電極芯線の接合方法 - Google Patents
電極芯線の接合方法 Download PDFInfo
- Publication number
- JP5014890B2 JP5014890B2 JP2007162072A JP2007162072A JP5014890B2 JP 5014890 B2 JP5014890 B2 JP 5014890B2 JP 2007162072 A JP2007162072 A JP 2007162072A JP 2007162072 A JP2007162072 A JP 2007162072A JP 5014890 B2 JP5014890 B2 JP 5014890B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- thermosetting resin
- core wire
- sheet
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図1は本発明の実施の形態1における電子ユニットの斜視図、図2(a),(b)は本発明の実施の形態1における電子ユニットの電極芯線の接合部分の断面図、図3は本発明の実施の形態1における被覆付き導線の斜視図、図4(a),(b),(c),(d),(e)は本発明の実施の形態1における電極芯線の接合工程の説明図である。
化物8となり、その熱硬化物8によって各芯線6は基板2に強固に固定される。熱圧着工程では、熱圧着ツール12はシート状部材11を介して熱硬化性樹脂8aを押圧加熱するので、熱圧着ツール12に熱硬化性樹脂8aを付着させて汚す心配がない。
図5は本発明の実施の形態2における電子ユニットの電極芯線の接合部分の断面図、図6は本発明の実施の形態2における被覆付き導線の斜視図である。この実施の形態2では
、図5に示すように、被覆付き導線5の芯線16が複数の導体細線を撚り合わせた撚線ではなく1本の導線から成るものであるが、上述の実施の形態1の場合と同様の工程で基板2上の電極3に接合することができ(図6)、実施の形態1の場合と同様の効果を得ることができる。しかし、実施の形態1のように、芯線6が複数の導体細線6aを撚り合わせた撚線から成っており、熱硬化性樹脂8aに含まれる半田粒子7aの溶融物(半田溶融物7b)が導体細線6a同士の間の溝状部9に沿って濡れ広がった状態で固化するようになっているのであれば、電極芯線の接合部により多くの半田固化物7を集めることができるという利点がある。
2 基板
3 電極
4 電子部品
5 被覆付き導線
6 芯線
6a 導体細線
7 半田固化物
7a 半田粒子
7b 半田溶融物(半田粒子の溶融物)
8 熱硬化物
8a 熱硬化性樹脂
9 溝状部
11 シート状部材
12 熱圧着ツール
Claims (1)
- 基板上に並設された複数の電極に電子部品が備える複数の被覆付き導線の芯線を接合させる電極芯線の接合方法であって、電極を上に向けた基板に半田粒子入りの熱硬化性樹脂を複数の電極を覆うように供給する樹脂供給工程と、熱硬化性樹脂が供給された基板の上方に各芯線を各電極と上下に対向させて配置する芯線配置工程と、各電極と対向させて配置された複数の芯線の上方にシート状部材を配置するシート状部材配置工程と、前記シート状部材の上方から熱圧着ツールにより前記シート状部材を介して各芯線及び熱硬化性樹脂を押圧加熱し、熱硬化性樹脂を熱硬化させるとともに熱硬化性樹脂に含まれる半田粒子を溶融させる熱圧着工程と、熱硬化性樹脂の熱硬化物から熱圧着ツールを離間させて前記熱硬化物を冷却し、半田粒子の溶融物が固化して生じた半田固化物によって電極と芯線を接合させる冷却工程と、前記熱硬化物から前記シート状部材を剥離するシート状部材剥離工程とを含み、
各芯線が複数の導体細線を撚り合わせた撚線から成り、半田粒子の溶融物が導体細線同士の間の溝状部に沿って濡れ広がった状態で固化するようにし、
前記熱圧着工程において、前記熱圧着ツールで前記撚線を前記電極に対して押圧することにより前記撚線を前記電極上に扁平となるように押し広げ、半田粒子の溶融物を扁平になった前記撚線の溝状部に沿って濡れ広がらせることを特徴とする電極芯線の接合方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007162072A JP5014890B2 (ja) | 2007-06-20 | 2007-06-20 | 電極芯線の接合方法 |
TW097122632A TW200900190A (en) | 2007-06-20 | 2008-06-18 | Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires |
US12/595,682 US8367938B2 (en) | 2007-06-20 | 2008-06-18 | Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires |
PCT/JP2008/061508 WO2008156200A2 (en) | 2007-06-20 | 2008-06-18 | Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires |
KR1020097022346A KR20100018494A (ko) | 2007-06-20 | 2008-06-18 | 전극 심선의 접합방법 및 전극 심선이 접합되어 이루어진 전자유닛 |
CN2008800155043A CN101683000B (zh) | 2007-06-20 | 2008-06-18 | 将芯线连结到电极的方法和通过连结电极和芯线而形成的电子单元 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007162072A JP5014890B2 (ja) | 2007-06-20 | 2007-06-20 | 電極芯線の接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009004464A JP2009004464A (ja) | 2009-01-08 |
JP5014890B2 true JP5014890B2 (ja) | 2012-08-29 |
Family
ID=39967823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007162072A Active JP5014890B2 (ja) | 2007-06-20 | 2007-06-20 | 電極芯線の接合方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8367938B2 (ja) |
JP (1) | JP5014890B2 (ja) |
KR (1) | KR20100018494A (ja) |
CN (1) | CN101683000B (ja) |
TW (1) | TW200900190A (ja) |
WO (1) | WO2008156200A2 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
JPH0240881A (ja) * | 1988-07-28 | 1990-02-09 | Matsushita Electric Ind Co Ltd | 端子接続方法 |
JPH07130225A (ja) * | 1993-10-28 | 1995-05-19 | Nec Corp | フラットケーブルおよびその半田付け方法 |
JP3417110B2 (ja) * | 1994-12-30 | 2003-06-16 | カシオ計算機株式会社 | 電子部品の接続方法 |
JPH0957436A (ja) | 1995-08-21 | 1997-03-04 | Saitama Nippon Denki Kk | 自動機用半田ごてユニット |
JPH10173210A (ja) * | 1996-12-13 | 1998-06-26 | Canon Inc | 電極、その形成方法及び該電極を有する光起電力素子 |
JP3422243B2 (ja) | 1998-01-07 | 2003-06-30 | 日本電気株式会社 | 樹脂フィルム |
SE518454C2 (sv) * | 1999-01-15 | 2002-10-08 | Forskarpatent I Uppsala Ab | Metod för framställning av en elektrokemisk cell samt elektrokemisk cell |
KR100502222B1 (ko) * | 1999-01-29 | 2005-07-18 | 마츠시타 덴끼 산교 가부시키가이샤 | 전자부품의 실장방법 및 그 장치 |
EP1204136B1 (en) * | 1999-07-16 | 2009-08-19 | Panasonic Corporation | Method of fabricating a packaged semiconductor device |
JP2001345469A (ja) * | 2000-06-01 | 2001-12-14 | Canon Inc | 光起電力素子および光起電力素子の製造方法 |
US20020180029A1 (en) * | 2001-04-25 | 2002-12-05 | Hideki Higashitani | Semiconductor device with intermediate connector |
JP2005064362A (ja) * | 2003-08-19 | 2005-03-10 | Nec Electronics Corp | 電子装置の製造方法及びその電子装置並びに半導体装置の製造方法 |
JP4134976B2 (ja) * | 2004-10-26 | 2008-08-20 | 松下電器産業株式会社 | 半田接合方法 |
US20060196600A1 (en) * | 2005-03-03 | 2006-09-07 | Gi-Jung Nam | Apparatus and method for bonding anisotropic conductive film using laser beam |
JP4591330B2 (ja) * | 2005-11-25 | 2010-12-01 | パナソニック株式会社 | 電子部品接続構造および電子部品接続方法 |
-
2007
- 2007-06-20 JP JP2007162072A patent/JP5014890B2/ja active Active
-
2008
- 2008-06-18 US US12/595,682 patent/US8367938B2/en active Active
- 2008-06-18 CN CN2008800155043A patent/CN101683000B/zh active Active
- 2008-06-18 KR KR1020097022346A patent/KR20100018494A/ko not_active Application Discontinuation
- 2008-06-18 WO PCT/JP2008/061508 patent/WO2008156200A2/en active Application Filing
- 2008-06-18 TW TW097122632A patent/TW200900190A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN101683000B (zh) | 2012-05-23 |
TW200900190A (en) | 2009-01-01 |
CN101683000A (zh) | 2010-03-24 |
US8367938B2 (en) | 2013-02-05 |
US20100200282A1 (en) | 2010-08-12 |
JP2009004464A (ja) | 2009-01-08 |
KR20100018494A (ko) | 2010-02-17 |
WO2008156200A2 (en) | 2008-12-24 |
WO2008156200A3 (en) | 2009-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5794577B2 (ja) | ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造 | |
JPH02192876A (ja) | ヒーター装置および部材の接合方法 | |
JP5819052B2 (ja) | 半導体装置および半導体装置の製造方法 | |
CN104716443A (zh) | 用于电子组件的编织线连接件 | |
US9697933B2 (en) | PTC device | |
JPH11163501A (ja) | 電子部品の実装方法、およびその方法によって製造された電子回路装置 | |
JP2007103449A (ja) | 電子部品実装方法 | |
CN212752742U (zh) | 基板接合构造 | |
JP5782013B2 (ja) | フレキシブルプリント基板の接合方法 | |
CN109413886B (zh) | 半导体装置的制造方法及焊接辅助工具 | |
TWI451817B (zh) | 配線板及配線板的製造方法 | |
JP5014890B2 (ja) | 電極芯線の接合方法 | |
JP5991540B2 (ja) | フレキシブル基板の実装方法 | |
CN105931974B (zh) | 电子部件的制造方法、电子部件以及电子部件的制造装置 | |
JP4752813B2 (ja) | 基板の接合方法及び基板接合体 | |
JP2003157949A (ja) | Fpcの接続方法 | |
JP2006324181A (ja) | 面状発熱体 | |
JPH05299804A (ja) | 導電接続構造 | |
JPS63100793A (ja) | 細線のはんだ付構造,はんだ付方法およびそれに用いる装置 | |
JP2006245108A (ja) | フレキシブル配線基板の接続方法および接続構造 | |
KR200324833Y1 (ko) | 필름 히터 | |
JP2015177004A (ja) | フレキシブルプリント基板 | |
JP2010165574A (ja) | リード線付き電子部品の製造方法 | |
JP4755151B2 (ja) | 電気接続装置 | |
JP3486104B2 (ja) | フィルム回路の接続構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090225 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20091127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100921 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101110 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110315 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110517 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20110524 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20110729 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120606 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150615 Year of fee payment: 3 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5014890 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150615 Year of fee payment: 3 |