CN101683000B - 将芯线连结到电极的方法和通过连结电极和芯线而形成的电子单元 - Google Patents

将芯线连结到电极的方法和通过连结电极和芯线而形成的电子单元 Download PDF

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CN101683000B
CN101683000B CN2008800155043A CN200880015504A CN101683000B CN 101683000 B CN101683000 B CN 101683000B CN 2008800155043 A CN2008800155043 A CN 2008800155043A CN 200880015504 A CN200880015504 A CN 200880015504A CN 101683000 B CN101683000 B CN 101683000B
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境忠彦
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Abstract

旨在提供一种能够缩短操作时间并提高连结强度的连结电极和芯线的方法以及一种通过连结电极和芯线而形成的电子单元。在供应结合有焊料颗粒(7a)的热固性树脂(8a)以覆盖基板(2)上的多个电极(3)之后，将每个芯线(6)布置成与基板(2)上的每个电极(3)垂直相对，将片元件(11)定位在芯线(6)的上方，借助片元件(11)用热压连结工具(12)从片元件(11)的上方对每个芯线(6)和热固性树脂(8a)进行热压，从而热固化热固性树脂(8a)并使热固性树脂(8a)中所含的焊料颗粒(7a)熔化，使热压连结工具(12)与热固性树脂(8a)的热固化产物(8)脱离，通过由焊料颗粒的熔融产物(熔融焊料(7b))凝固而形成的焊料凝固产物(7)来连结芯线(6)和电极(3)，并且最后使片元件(11)从热固化产物(8)上剥离。

Description

将芯线连结到电极的方法和通过连结电极和芯线而形成的电子单元
技术领域
本发明涉及一种将芯线连结到电极的方法，即，将设置到电子元件的多个被覆导线的芯线连结到布置在基板上的多个电极，还涉及一种通过连结电极和芯线而形成的电子单元。
背景技术
作为连结布置在基板上的电极和设置到电子元件的被覆导线的芯线的方法，已知的是使用烙铁的方法。在使用烙铁来连结电极和芯线的方法中，由烙铁进行热熔的焊料被供应到电极和芯线的重叠部分，然后焊料冷却从而凝固，由此在机械和电学上连结电极和芯线(专利文献1)。
[专利文献1]日本未审查专利申请JP-A-9-57436
发明内容
技术问题
然而，在上述使用烙铁的方法中，在多个待连结部分存在于电极和芯线之间的情况下，由于必须将芯线一个接一个地连结到多个电极，因此引入了操作时间长的问题。此外，虽然电极和芯线借助焊料凝固产物不仅在电学上而且在机械上连结，但是连结强度并不是很高，由此引起倾向于导致故障的问题。
考虑到上面这些，本发明旨在提供一种能够缩短操作时间并提高连结强度的连结电极和芯线的方法，以及通过连结电极和芯线而形成的电子单元。
技术方案
根据本发明的第一方面，一种连结电极和芯线的方法，将设置到电子元件的被覆导线的多个芯线连结到布置在基板上的多个电极，其中该方法包括：树脂供应步骤，将结合有焊料颗粒的热固性树脂供应到具有朝向上的电极的基板以覆盖所述多个电极；芯线布置步骤，将供应有热固性树脂的基板的上方的每个芯线布置成与每个电极垂直相对；片元件布置步骤，将片元件布置在分别布置成与电极相对的所述多个芯线的上方；热压连结步骤，借助片元件用热压连结工具从片元件的上方对每个芯线和热固性树脂进行热压，从而使热固性树脂热固化并使热固性树脂中所含的焊料颗粒熔化；冷却步骤，使热压连结工具与热固性树脂的热固化产物脱离，从而使热固化产物冷却，并通过由焊料颗粒的熔融产物凝固而形成的焊料凝固产物来连结电极和芯线；和片元件剥离步骤，将片元件从热固化产物上剥离。
优选地，每个芯线包括通过使多个细导线相互扭绞而形成的绞合线，并且，焊料颗粒的熔融产物沿着每个细导线之间的凹槽部在润湿并扩散的状态下凝固。
根据本发明的第二方面，一种通过连结电极和芯线而形成的电子单元包括：基板，多个电极布置在该基板上；电子元件，具有将要与基板上的多个电极连结的多个被覆导线的芯线；结合有焊料颗粒的热固性树脂的热固化产物，用于将每个芯线固定到基板；以及焊料的凝固产物，用于连结每个电极和每个芯线，其中焊料的凝固产物包括热固性树脂中所含的已熔化并凝固的焊料颗粒。
优选地，固定到基板的芯线的上表面和热固化产物的上表面构成相同高度的平表面。
有益效果
在本发明中，由于结合有焊料颗粒的热固性树脂供应到基板，每个电极和每个芯线垂直相对，并且借助片元件用热压连结工具对热固性树脂进行热压，从而使热固性树脂热固化，以将每个芯线固定到基板，并通过由热固性树脂中所含的焊料颗粒的熔融产物凝固而形成的焊料凝固产物来连结电极和芯线，电极和芯线的连结部分(如果有多个的话)可以集体地连结，从而缩短了操作时间。此外，由于每个芯线不仅通过焊料凝固产物连结并固定到电极，而且还通过热固性树脂的热固化产物牢固地固定到基板，因此可以提高连结部分处的连结强度。
附图说明
图1是本发明第一实施例的电子单元的透视图。
图2A和2B是本发明第一实施例中的电子单元的电极和芯线的连结部分的截面图。
图3是本发明第一实施例的被覆导线的透视图。
图4A至4E是本发明第一实施例1中的电极和芯线的连结步骤的解释图。
图5是本发明第二实施例中的电极和芯线的连结部分的截面图。
图6是本发明第二实施例中的被覆导线的透视图。
具体实施方式
(实施例1)
在图1以及图2A和2B(图2A是由图1中的箭头II-II指示的截面图，图2B是由图2A中的箭头B-B指示的截面图)中，电子单元1通过连结布置在基板2上的多个电极3和设置到电子元件4的多个被覆导线5的芯线6而形成，其中每个芯线6通过热固化在基板2上的结合有焊料颗粒7a的热固性树脂8a的热固化产物8而牢固地固定到基板2(参照图4A)。在热固化产物8的内部，使热固性树脂8a中所含的焊料颗粒7a的熔融产物(熔融焊料7b)凝固而形成的焊料凝固产物7分散，并且电极3和芯线6通过熔融焊料产物7b在电极3和芯线6之间凝固而形成的焊料凝固产物7而连结。在该实施例中，芯线6包括通过使多个细导线6a如图3所示彼此扭绞而形成的绞合线，并且电极3和芯线6主要通过由每个细导线6a之间的凹槽部9中的熔融焊料7b凝固而形成的焊料凝固产物7来连结。
参照图4A至4E描述连结电极和芯线(电极3与芯线6之间连结)的方法。首先，将具有向上的电极3的基板2放置在用于热压连结操作的工作台(stage)10上，然后将结合有焊料颗粒7a的热固性树脂8a供应到基板2上(图4A：树脂供应步骤)。在该情况下，基板2上的所有多个电极3都覆盖有热固性树脂8a。该供应在基板2上的结合有焊料颗粒7a的热固性树脂8a可以是液体形式或制造成类似片的形状。
在将热固性树脂8a供应在基板2上之后，使电子元件4的被覆导线5的多个芯线6以一间隔布置，该间隔与基板2上的电极3之间的间隔相同，然后使每个芯线6布置成与每个电极3垂直相对(芯线布置步骤)。在该情况下，当热固性树脂8a是液体时，通过将每个芯线6布置成浸入热固性树脂8a中的状态直至热压连结步骤(以后描述)来临时地设置芯线6(图4B)。然后，将包括诸如Teflon(注册商标)的耐热材料的片元件11定位在布置成分别与电极3相对的多个芯线6的上方(片元件布置步骤：图4B)。然后，借助片元件11将每个芯线6压向每个电极3，并且通过下降至热元件11的热压连结工具12将热固性树脂8a热压在基板2上(图4C：热压连结步骤)。通过热固性树脂8a的热压，热固性树脂8a热固化成热固化产物8，从而每个芯线6由热固化产物8牢固地固定到基板2。在热压连结步骤中，由于热压连结工具12借助片元件11对热固性树脂8a进行热压，因此不用担心热固性树脂8a的沉积会污染热压连结工具12。
在热压连结步骤中，热固性树脂8a中所含的焊料颗粒7a熔化成熔融焊料7b，一部分熔融焊料7b被润湿并扩散到芯线6的凹槽部9中(参照图2B)。
在该情况下，由于凹槽部9完全在芯线6的延伸方向上延伸，即使在热固性树脂8a受压且施加垂直压缩力的情况下，凹槽部9中的熔融焊料7b也进行扩散并主要在芯线6的延伸方向上进行润湿，而不会向朝着另一相邻的芯线6或电极3的方向(电极3并排布置的方向)流太多。因此，在电极3和芯线6之间确保了足以连结电极3和芯线6的足量熔融焊料7b。
当热固性树脂热固化成热固化产物8时，热压连结工具12脱离片元件11并被向上拉拽，从而热固化产物8冷却至常温(图4D：冷却步骤)。这样，形成在热固性树脂8a中的熔融焊料7b凝固成焊料的焊料凝固产物7。电极3和芯线6通过电极3和芯线6之间的熔融焊料7b的凝固而连结，并且，由于如上所述在凹槽部9中确保有足以连结电极3和芯线6的足量熔融焊料7b，因此电极3和芯线6通过足量的熔融焊料7b的凝固产物(焊料凝固产物7)而可靠地连结。此外，由于熔融焊料7b沿着凹槽部9润湿并扩散然后凝固，因此焊料与电极3和芯线6的接触面积得以扩大，从而能够获得具有高连结强度和低电阻的连结状态。当热固化产物8充分冷却时，附着到热固化产物8的上表面的片元件11通过被沿着图4E中的箭头A的方向拉拽而被剥离(图4E：片元件冷却步骤)。这样，完成了电极-芯线的连结步骤。
如上所述，在该实施例中的电极和芯线的连结方法中，由于结合有焊料颗粒7a的热固性树脂8a供应至基板2，每个电极3和每个芯线6垂直相对，并且借助片元件11通过热压连结工具12对热固性树脂8a进行热压，从而使热固性树脂8a热固化，以将每个芯线6固定到基板2，并通过由热固性树脂8a中所含的焊料颗粒7a的熔融产物(熔融焊料7b)凝固而形成的焊料凝固产物7来连结电极3和芯线6，电极3和芯线6甚至可以在多个连结部分进行连结，并且它们可以集体地(collectively)连结以缩短操作时间。此外，由于每个芯线6不仅通过焊料凝固产物7连结并固定至电极3，而且还通过热固性树脂8a的热固化产物8牢固地固定到基板2，因此可以提高连结部分处的连结强度。
此外，在电极3和芯线6通过上述电极-芯线连结方法连结的电子单元1中，通过热压连结工具12的加压，固定到基板2的每个芯线6的上表面和热固性树脂8的上表面构成相同高度的平表面(参照图2A)。因此，电极和芯线的连结部分的厚度可以减小至比通常情况(焊料因烙铁而凸出的情况)小。此外，由于芯线6通过焊料凝固产物7和热固化产物8固定到基板2，因此甚至能够以减小的厚度确保足够的连结强度。此外，由于可以使连结部分的上表面为平的，因此可以获得能够容易地组装成重量和厚度减小的电子设备的电子单元1。
(实施例2)
图5是本发明实施例2中的电子单元的电极和芯线的连结部分的截面图，图6是本发明实施例2中的被覆导线的透视图。在实施例2中，本发明的。如图5所示，虽然被覆导线5的芯线16不是通过多个细导线扭绞而形成的绞合线，而是单一导线，但是可以通过与第一实施例中相同的步骤将其连结到基板2上的电极3(图6)，并且可以提供与第一实施例相同的效果。然而，在芯线6包括通过扭绞多个细导线6a而形成的绞合线且热固性树脂8a中所含的焊料颗粒7a的熔融产物(熔融焊料7b)在沿着每个细导线6a之间的凹槽部9润湿并扩散的状态下凝固的情况下，这可以提供能够将更大量的焊料凝固产物7收集到电极-芯线的连结部分的优点。
本申请基于2007年6月20日提交的日本专利申请No.2007-162072，并要求享有其优选权，该专利申请的全部内容在此引入作为参考。
工业实用性
根据本发明，可以缩短操作时间，并且可以提高连结强度。

Claims (3)

1.一种连结电极和芯线的方法，将设置到电子元件的多个被覆导线的芯线连结到布置在基板上的多个电极，芯线是通过扭绞多个细导线而形成的绞合线，该方法包括：
树脂供应步骤，将结合有焊料颗粒的热固性树脂供应到具有朝向上的电极的基板以覆盖多个电极；
芯线布置步骤，将与每个电极垂直相对的每个芯线布置在供应有热固性树脂的基板的上方；
片元件布置步骤，将片元件布置在分别布置成与电极相对的所述多个芯线的上方；
热压连结步骤，借助片元件用热压连结工具从片元件的上方对每个芯线和热固性树脂进行热压，从而使绞合线在电极上变为扁平，使热固性树脂热固化，并使热固性树脂中所含的焊料颗粒熔化，从而熔融的焊料颗粒被润湿并扩散到每个细导线之间的凹槽部中；
冷却步骤，使热压连结工具与热固性树脂的热固化产物脱离，从而使热固化产物冷却，由此通过由焊料颗粒的熔融产物凝固而形成的焊料凝固产物来连结电极和芯线；和
片元件剥离步骤，将片元件从热固化产物上剥离。
2.根据权利要求1的连结电极和芯线的方法，其中，焊料颗粒的熔融产物沿着每个细导线之间的凹槽部凝固。
3.一种通过连结电极和芯线而形成的电子单元，包括：
基板，多个电极布置在该基板上；
电子元件，具有将要与基板上的多个电极连结的被覆导线的多个芯线，芯线是通过扭绞多个细导线而形成的绞合线；
结合有焊料颗粒的热固性树脂的热固化产物，用于将每个芯线固定到基板；以及焊料的凝固产物，用于连结每个电极和每个芯线，其中焊料的凝固产物包括热固性树脂中所含的已熔化并凝固的焊料颗粒，并且焊料的凝固产物在沿着变扁平的绞合线的每个细导线之间的凹槽部扩散后凝固，并且
其中，固定到基板的芯线的上表面和热固化产物的上表面构成相同高度的平表面。
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