JP4010458B2 - 樹脂パッケージ型半導体装置 - Google Patents
樹脂パッケージ型半導体装置 Download PDFInfo
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- JP4010458B2 JP4010458B2 JP2004352039A JP2004352039A JP4010458B2 JP 4010458 B2 JP4010458 B2 JP 4010458B2 JP 2004352039 A JP2004352039 A JP 2004352039A JP 2004352039 A JP2004352039 A JP 2004352039A JP 4010458 B2 JP4010458 B2 JP 4010458B2
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Description
せられている複数本の内部リード13と、を備えて構成されている。
チップ10に電力が十分に供給されないといった事態が生じ、上記樹脂パッケージ型半導体装置1が本来有する機能を発揮することができなくなってしまう。
10 半導体チップ
11 ダイパッド
12 ワイヤ
12a 圧着部(半導体チップとワイヤとの)
12b 圧着部(内部リードとワイヤとの)
12d 屈曲部(ワイヤの)
13 内部リード
14 樹脂パッケージ
15 外部リード
Claims (5)
- 半導体チップと、半導体チップが搭載されるダイパッドと、半導体チップに一端部が圧着された少なくとも1本のワイヤと、このワイヤの他端部が圧着されて上記半導体チップと電気的に導通させられている内部リードと、この内部リードと連続して形成されている外部リードと、上記半導体チップないし上記内部リードを包み込む樹脂パッケージと、を備えた樹脂パッケージ型半導体装置であって、
上記ワイヤは、上記内部リードとの圧着部の基端から一定距離だけ上記内部リードの表面に添わせられている部分と、その部分の端に位置する屈曲部分と、を上記内部リードとの圧着部の基端の近傍に有し、
上記ワイヤにおける上記屈曲部分から延出する角度は、上記内部リードに対して15度以下であることを特徴とする、樹脂パッケージ型半導体装置。 - 半導体チップと、半導体チップが搭載されるダイパッドと、半導体チップに一端部が圧着された少なくとも1本のワイヤと、このワイヤの他端部が圧着されて上記半導体チップと電気的に導通させられている内部リードと、この内部リードと連続して形成されている外部リードと、上記半導体チップないし上記内部リードを包み込む樹脂パッケージと、を備えた樹脂パッケージ型半導体装置であって、
上記ワイヤは、上記内部リードとの圧着部の基端から延出する角度が略0度であって上記内部リードとの圧着部の基端から一定距離だけ存在する部分と、その部分の端に位置する屈曲部分と、を上記内部リードとの圧着部の基端の近傍に有し、
上記ワイヤにおける上記屈曲部分から延出する角度は、上記内部リードに対して15度以下であることを特徴とする、樹脂パッケージ型半導体装置。 - 上記ワイヤにおける上記一定距離は少なくとも上記ワイヤの直径の2倍に相当する長さ分である、請求項1または2に記載の樹脂パッケージ型半導体装置。
- 上記ワイヤにおける上記屈曲部分から延出する角度は、上記内部リードに対して10度以下である、請求項1ないし3のいずれかに記載の樹脂パッケージ型半導体装置。
- 上記外部リードは先端部が屈曲させられた水平部を有する、請求項1ないし4のいずれかに記載の樹脂パッケージ型半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004352039A JP4010458B2 (ja) | 2004-12-03 | 2004-12-03 | 樹脂パッケージ型半導体装置 |
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Application Number | Priority Date | Filing Date | Title |
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JP2004352039A JP4010458B2 (ja) | 2004-12-03 | 2004-12-03 | 樹脂パッケージ型半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP14910497A Division JP3634566B2 (ja) | 1997-06-06 | 1997-06-06 | 樹脂パッケージ型半導体装置 |
Related Child Applications (1)
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JP2007210288A Division JP4666395B2 (ja) | 2007-08-10 | 2007-08-10 | 樹脂パッケージ型半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2005064544A JP2005064544A (ja) | 2005-03-10 |
JP4010458B2 true JP4010458B2 (ja) | 2007-11-21 |
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JP2004352039A Expired - Lifetime JP4010458B2 (ja) | 2004-12-03 | 2004-12-03 | 樹脂パッケージ型半導体装置 |
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Country | Link |
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JP (1) | JP4010458B2 (ja) |
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- 2004-12-03 JP JP2004352039A patent/JP4010458B2/ja not_active Expired - Lifetime
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