JP2004265895A - 光学的測長器を備えたプローブ装置及びプローブ検査方法 - Google Patents

光学的測長器を備えたプローブ装置及びプローブ検査方法 Download PDF

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Publication number
JP2004265895A
JP2004265895A JP2003011140A JP2003011140A JP2004265895A JP 2004265895 A JP2004265895 A JP 2004265895A JP 2003011140 A JP2003011140 A JP 2003011140A JP 2003011140 A JP2003011140 A JP 2003011140A JP 2004265895 A JP2004265895 A JP 2004265895A
Authority
JP
Japan
Prior art keywords
probe
optical length
length measuring
measuring device
mounting table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003011140A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004265895A5 (https=
Inventor
Shigekazu Komatsu
茂和 小松
Takanori Momotome
孝憲 百留
Hiromi Chatani
博美 茶谷
Naohisa Hayashi
尚久 林
Yukie Shigeno
幸英 茂野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Tokyo Electron Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Tokyo Electron Ltd
Priority to JP2003011140A priority Critical patent/JP2004265895A/ja
Priority to KR1020057013305A priority patent/KR100787401B1/ko
Priority to CNB2004800024161A priority patent/CN100395877C/zh
Priority to PCT/JP2004/000309 priority patent/WO2004066378A1/ja
Priority to EP04702857A priority patent/EP1617468A4/en
Priority to TW093101370A priority patent/TW200416397A/zh
Publication of JP2004265895A publication Critical patent/JP2004265895A/ja
Priority to US11/184,796 priority patent/US7221177B2/en
Publication of JP2004265895A5 publication Critical patent/JP2004265895A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2003011140A 2003-01-20 2003-01-20 光学的測長器を備えたプローブ装置及びプローブ検査方法 Pending JP2004265895A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003011140A JP2004265895A (ja) 2003-01-20 2003-01-20 光学的測長器を備えたプローブ装置及びプローブ検査方法
KR1020057013305A KR100787401B1 (ko) 2003-01-20 2004-01-16 프로브 장치 및 피검사체 검사 방법
CNB2004800024161A CN100395877C (zh) 2003-01-20 2004-01-16 包含光学测距仪的探针装置以及探针的检查方法
PCT/JP2004/000309 WO2004066378A1 (ja) 2003-01-20 2004-01-16 光学的測長器を備えたプローブ装置及びプローブ検査方法
EP04702857A EP1617468A4 (en) 2003-01-20 2004-01-16 PROBE WITH OPTICAL LENGTH MEASURING UNIT AND PROBE PROCESSING
TW093101370A TW200416397A (en) 2003-01-20 2004-01-19 Probe apparatus with distance-measuring device by optical way and probing method of the same
US11/184,796 US7221177B2 (en) 2003-01-20 2005-07-20 Probe apparatus with optical length-measuring unit and probe testing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003011140A JP2004265895A (ja) 2003-01-20 2003-01-20 光学的測長器を備えたプローブ装置及びプローブ検査方法

Publications (2)

Publication Number Publication Date
JP2004265895A true JP2004265895A (ja) 2004-09-24
JP2004265895A5 JP2004265895A5 (https=) 2006-02-09

Family

ID=32767271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003011140A Pending JP2004265895A (ja) 2003-01-20 2003-01-20 光学的測長器を備えたプローブ装置及びプローブ検査方法

Country Status (7)

Country Link
US (1) US7221177B2 (https=)
EP (1) EP1617468A4 (https=)
JP (1) JP2004265895A (https=)
KR (1) KR100787401B1 (https=)
CN (1) CN100395877C (https=)
TW (1) TW200416397A (https=)
WO (1) WO2004066378A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007183194A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP2009276215A (ja) * 2008-05-15 2009-11-26 Tokyo Electron Ltd プローブ装置及びコンタクト位置の補正方法
US7855568B2 (en) 2008-06-20 2010-12-21 Tokyo Electron Limited Probe apparatus with mechanism for achieving a predetermined contact load

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US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7352198B2 (en) * 2006-01-18 2008-04-01 Electroglas, Inc. Methods and apparatuses for improved stabilization in a probing system
JP5040190B2 (ja) 2006-06-27 2012-10-03 富士通セミコンダクター株式会社 プローバ装置の制御方法、制御プログラム、およびプローバ装置
US20080024796A1 (en) * 2006-07-31 2008-01-31 Samsung Electronics Co., Ltd. Apparatus and method for sensing the position of a susceptor in semiconductor device manufacturing equipment
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
KR100779029B1 (ko) * 2006-12-15 2007-11-23 세크론 주식회사 프로브 스테이션 및 이를 이용한 웨이퍼 검사방법
KR100878213B1 (ko) * 2007-06-27 2009-01-13 세크론 주식회사 프로브카드 탐침 위치인지 장치
JP5377915B2 (ja) * 2008-09-30 2013-12-25 東京エレクトロン株式会社 検査装置及び検査方法
JP5356769B2 (ja) * 2008-10-15 2013-12-04 東京エレクトロン株式会社 載置台
US8519728B2 (en) * 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses
US8120304B2 (en) 2008-12-12 2012-02-21 Formfactor, Inc. Method for improving motion times of a stage
KR101052506B1 (ko) * 2010-06-16 2011-07-29 주식회사 이노비즈 엘이디 검사장치 및 이를 이용한 엘이디 검사방법
CN102350713B (zh) * 2011-08-01 2014-04-02 济南德佳机器控股有限公司 物料优选加工设备及方法
JP5781864B2 (ja) * 2011-08-25 2015-09-24 株式会社日本マイクロニクス 発光素子の検査装置及び検査方法
EP2838107B1 (en) 2013-08-14 2016-06-01 Fei Company Circuit probe for charged particle beam system
US9478237B2 (en) 2013-09-18 2016-10-25 Seagate Technology Llc Work piece contact pad with centering feature
US10281518B2 (en) * 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
JP6555002B2 (ja) * 2015-08-19 2019-08-07 三星ダイヤモンド工業株式会社 スクライブラインの検査方法
CN106298578A (zh) * 2016-10-21 2017-01-04 安徽鼎晖新能源科技有限公司 一种太阳能电池片测试台
CN107768265B (zh) * 2017-10-16 2021-01-26 德淮半导体有限公司 晶圆测试系统和方法
CN109917194A (zh) 2017-12-13 2019-06-21 清华四川能源互联网研究院 一种用于无线充电测试系统的自动激光距离校准套件
CN109283452A (zh) * 2018-10-19 2019-01-29 义乌臻格科技有限公司 一种激光二极管芯片光电属性检测方法和检测装置
TWI704360B (zh) * 2019-07-09 2020-09-11 致茂電子股份有限公司 覆晶式面射型雷射二極體之晶圓測試裝置
KR102798910B1 (ko) * 2020-08-26 2025-04-22 삼성디스플레이 주식회사 광학 검사 장치 및 광학 검사 방법
TWI794968B (zh) * 2021-09-10 2023-03-01 鴻勁精密股份有限公司 承置器檢知機構及其應用之作業裝置、作業機
WO2026078079A1 (en) * 2024-10-09 2026-04-16 Technoprobe S.P.A. Measurement system provided with means for measuring a distance from the semiconductor wafer
CN119178914B (zh) * 2024-11-22 2025-08-08 杭州广立微电子股份有限公司 探针针压自动控制装置和晶圆接受测试系统

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US5661548A (en) * 1994-11-30 1997-08-26 Nikon Corporation Projection exposure method and apparatus including a changing system for changing the reference image-formation position used to generate a focus signal
JPH08213436A (ja) * 1995-02-01 1996-08-20 Tokyo Electron Ltd 光学的高さ検出装置及びプローブ装置
JP3639887B2 (ja) * 1997-01-30 2005-04-20 東京エレクトロン株式会社 検査方法及び検査装置
JP3491059B2 (ja) 1997-05-08 2004-01-26 東京エレクトロン株式会社 プローブ装置
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US6023172A (en) * 1997-12-17 2000-02-08 Micron Technology, Inc. Light-based method and apparatus for maintaining probe cards
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JP3090132B2 (ja) * 1998-12-18 2000-09-18 株式会社日立製作所 プローブヘッドの製造方法
JP2001110857A (ja) * 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
JP4357813B2 (ja) 2002-08-23 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブ方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007183194A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
JP2009276215A (ja) * 2008-05-15 2009-11-26 Tokyo Electron Ltd プローブ装置及びコンタクト位置の補正方法
KR101059603B1 (ko) 2008-05-15 2011-08-25 도쿄엘렉트론가부시키가이샤 프로브 장치 및 콘택트 위치의 보정 방법
US8130004B2 (en) 2008-05-15 2012-03-06 Tokyo Electron Limited Probe apparatus and method for correcting contact position by adjusting overdriving amount
US7855568B2 (en) 2008-06-20 2010-12-21 Tokyo Electron Limited Probe apparatus with mechanism for achieving a predetermined contact load
TWI425219B (zh) * 2008-06-20 2014-02-01 東京威力科創股份有限公司 Probe device

Also Published As

Publication number Publication date
CN1739194A (zh) 2006-02-22
US7221177B2 (en) 2007-05-22
TWI313751B (https=) 2009-08-21
US20050253613A1 (en) 2005-11-17
EP1617468A4 (en) 2011-03-09
WO2004066378A1 (ja) 2004-08-05
TW200416397A (en) 2004-09-01
KR100787401B1 (ko) 2007-12-21
EP1617468A1 (en) 2006-01-18
CN100395877C (zh) 2008-06-18
KR20050095614A (ko) 2005-09-29

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