JP2003263949A - 低抵抗ポリマーマトリクスヒューズ装置および方法 - Google Patents
低抵抗ポリマーマトリクスヒューズ装置および方法Info
- Publication number
- JP2003263949A JP2003263949A JP2003004659A JP2003004659A JP2003263949A JP 2003263949 A JP2003263949 A JP 2003263949A JP 2003004659 A JP2003004659 A JP 2003004659A JP 2003004659 A JP2003004659 A JP 2003004659A JP 2003263949 A JP2003263949 A JP 2003263949A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- layer
- fuse element
- element layer
- intermediate insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 57
- 229920000642 polymer Polymers 0.000 title description 2
- 239000011159 matrix material Substances 0.000 title 1
- 238000009413 insulation Methods 0.000 claims abstract description 18
- 239000011888 foil Substances 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 43
- 229920001721 polyimide Polymers 0.000 claims description 20
- 239000004642 Polyimide Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000002659 electrodeposit Substances 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000012777 electrically insulating material Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
Landscapes
- Fuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34809802P | 2002-01-10 | 2002-01-10 | |
| US60/348098 | 2002-01-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003263949A true JP2003263949A (ja) | 2003-09-19 |
| JP2003263949A5 JP2003263949A5 (enExample) | 2006-02-23 |
Family
ID=27613225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003004659A Pending JP2003263949A (ja) | 2002-01-10 | 2003-01-10 | 低抵抗ポリマーマトリクスヒューズ装置および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7570148B2 (enExample) |
| EP (1) | EP1327999A3 (enExample) |
| JP (1) | JP2003263949A (enExample) |
| KR (1) | KR20030061353A (enExample) |
| CN (1) | CN1276454C (enExample) |
| TW (1) | TWI274363B (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243621A (ja) * | 2004-01-29 | 2005-09-08 | Cooper Technol Co | 低抵抗ポリマーマトリックスヒューズの装置および方法 |
| JP2006237008A (ja) * | 2005-02-24 | 2006-09-07 | Cooper Technol Co | 低抵抗ヒューズおよび低抵抗ヒューズを製造する方法 |
| JP2013539904A (ja) * | 2010-10-14 | 2013-10-28 | エイヴィーエックス コーポレイション | 低電流ヒューズ |
| JP2017073373A (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| WO2017061458A1 (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| JP2022515634A (ja) * | 2018-12-27 | 2022-02-21 | シュルター アクチェンゲゼルシャフト | ヒューズの製造方法 |
| JP2024103729A (ja) * | 2021-03-30 | 2024-08-01 | 株式会社オートネットワーク技術研究所 | ヒューズ素子 |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7494596B2 (en) * | 2003-03-21 | 2009-02-24 | Hewlett-Packard Development Company, L.P. | Measurement of etching |
| JP2007508706A (ja) * | 2003-10-17 | 2007-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ヒューズを含むプリント回路基板 |
| US7029228B2 (en) | 2003-12-04 | 2006-04-18 | General Electric Company | Method and apparatus for convective cooling of side-walls of turbine nozzle segments |
| WO2005086196A1 (en) * | 2004-03-03 | 2005-09-15 | 3M Innovative Properties Company | Flexible fuse |
| US8368502B2 (en) * | 2006-03-16 | 2013-02-05 | Panasonic Corporation | Surface-mount current fuse |
| ITMI20061663A1 (it) * | 2006-08-31 | 2008-03-01 | I R E Industria Resistenza Elettriche Srl | Resistore con punto critico controllato,specialmente per applicazioni veicolari |
| WO2009006318A1 (en) | 2007-06-29 | 2009-01-08 | Artificial Muscle, Inc. | Electroactive polymer transducers for sensory feedback applications |
| JP4510858B2 (ja) * | 2007-08-08 | 2010-07-28 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
| US9190235B2 (en) * | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
| US8203420B2 (en) * | 2009-06-26 | 2012-06-19 | Cooper Technologies Company | Subminiature fuse with surface mount end caps and improved connectivity |
| JP5260592B2 (ja) * | 2010-04-08 | 2013-08-14 | デクセリアルズ株式会社 | 保護素子、バッテリ制御装置、及びバッテリパック |
| EP2408277B1 (de) * | 2010-07-16 | 2016-02-17 | Schurter AG | Sicherungselement |
| DE102011054485A1 (de) | 2010-10-14 | 2012-04-19 | Avx Corporation | Niedrigstrom-Sicherung |
| US9553254B2 (en) | 2011-03-01 | 2017-01-24 | Parker-Hannifin Corporation | Automated manufacturing processes for producing deformable polymer devices and films |
| KR20140026455A (ko) * | 2011-04-07 | 2014-03-05 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 전도성 중합체 퓨즈 |
| US9876160B2 (en) | 2012-03-21 | 2018-01-23 | Parker-Hannifin Corporation | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
| EP2837043B1 (en) | 2012-04-12 | 2017-11-22 | Parker-Hannifin Corporation | Eap transducers with improved performance |
| KR20150031285A (ko) | 2012-06-18 | 2015-03-23 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 연신 공정을 위한 연신 프레임 |
| US9852868B2 (en) * | 2012-09-28 | 2017-12-26 | Kamaya Electric Co., Ltd. | Chip fuse and manufacturing method therefor |
| WO2014066576A1 (en) | 2012-10-24 | 2014-05-01 | Bayer Intellectual Property Gmbh | Polymer diode |
| JP6294165B2 (ja) * | 2014-06-19 | 2018-03-14 | Koa株式会社 | チップ型ヒューズ |
| CN104157518B (zh) * | 2014-08-22 | 2016-09-21 | Aem科技(苏州)股份有限公司 | 一种中空结构熔断器的制造方法 |
| EP3179495B1 (en) * | 2015-12-09 | 2018-05-02 | ABB Schweiz AG | Power capacitor unit for high pressure applications |
| US10141150B2 (en) * | 2016-02-17 | 2018-11-27 | Littelfuse, Inc. | High current one-piece fuse element and split body |
| CN105551905B (zh) * | 2016-02-18 | 2017-11-21 | Aem科技(苏州)股份有限公司 | 一种悬空熔丝型表面贴装熔断器及其制备方法 |
| JP6452001B2 (ja) * | 2016-06-08 | 2019-01-16 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
| WO2019032358A1 (en) | 2017-08-07 | 2019-02-14 | Deputy Synthes Products, Inc | MOLDED SECURE REINFORCED SPOOL ASSEMBLY |
| JP7368144B2 (ja) * | 2019-08-27 | 2023-10-24 | Koa株式会社 | チップ型電流ヒューズ |
| US11217415B2 (en) * | 2019-09-25 | 2022-01-04 | Littelfuse, Inc. | High breaking capacity chip fuse |
| US11807770B2 (en) * | 2020-06-15 | 2023-11-07 | Littelfuse, Inc. | Thin film coating packaging for device having meltable and wetting links |
| WO2023075200A1 (ko) | 2021-10-28 | 2023-05-04 | 주식회사 엘지에너지솔루션 | 패턴 퓨즈 및 이의 제조방법 |
| US12002643B2 (en) * | 2021-11-30 | 2024-06-04 | Eaton Intelligent Power Limited | Ceramic printed fuse fabrication |
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| US3500276A (en) * | 1967-10-25 | 1970-03-10 | Texas Instruments Inc | Electrical fuse and heater units |
| US3585556A (en) * | 1969-07-22 | 1971-06-15 | Ashok R Hingorany | Electrical fuse and heater units |
| US3715698A (en) * | 1971-02-16 | 1973-02-06 | Westinghouse Electric Corp | Current limiting fuse |
| US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
| US4612529A (en) * | 1985-03-25 | 1986-09-16 | Cooper Industries, Inc. | Subminiature fuse |
| US4924203A (en) * | 1987-03-24 | 1990-05-08 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
| US4763228A (en) * | 1987-11-20 | 1988-08-09 | Union Carbide Corporation | Fuse assembly for solid electrolytic capacitor |
| US4814946A (en) * | 1987-11-20 | 1989-03-21 | Kemet Electronics Corporation | Fuse assembly for solid electrolytic capacitor |
| NL8802872A (nl) | 1988-11-21 | 1990-06-18 | Littelfuse Tracor | Smeltveiligheid. |
| US4988969A (en) * | 1990-04-23 | 1991-01-29 | Cooper Industries, Inc. | Higher current carrying capacity 250V subminiature fuse |
| JPH04275018A (ja) | 1991-02-27 | 1992-09-30 | Mitsubishi Electric Corp | 変電所事故区間検出装置 |
| US5196819A (en) * | 1991-02-28 | 1993-03-23 | Rock Ltd. Partnership | Printed circuits containing fuse elements and the method of making this circuit |
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| JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
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| JP2557019B2 (ja) | 1993-10-01 | 1996-11-27 | エス・オー・シー株式会社 | 超小型チップヒューズおよびその製造方法 |
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| JPH07182600A (ja) | 1993-12-22 | 1995-07-21 | Nissan Motor Co Ltd | 車両用距離検出装置 |
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-
2003
- 2003-01-09 US US10/339,114 patent/US7570148B2/en not_active Expired - Fee Related
- 2003-01-10 EP EP03100029A patent/EP1327999A3/en not_active Withdrawn
- 2003-01-10 KR KR10-2003-0001633A patent/KR20030061353A/ko not_active Withdrawn
- 2003-01-10 JP JP2003004659A patent/JP2003263949A/ja active Pending
- 2003-01-10 CN CNB031217702A patent/CN1276454C/zh not_active Expired - Fee Related
- 2003-01-10 TW TW092100511A patent/TWI274363B/zh not_active IP Right Cessation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243621A (ja) * | 2004-01-29 | 2005-09-08 | Cooper Technol Co | 低抵抗ポリマーマトリックスヒューズの装置および方法 |
| JP2006237008A (ja) * | 2005-02-24 | 2006-09-07 | Cooper Technol Co | 低抵抗ヒューズおよび低抵抗ヒューズを製造する方法 |
| JP2013539904A (ja) * | 2010-10-14 | 2013-10-28 | エイヴィーエックス コーポレイション | 低電流ヒューズ |
| US9847203B2 (en) | 2010-10-14 | 2017-12-19 | Avx Corporation | Low current fuse |
| JP2017073373A (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| WO2017061458A1 (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| US10727019B2 (en) | 2015-10-09 | 2020-07-28 | Dexerials Corporation | Fuse device |
| JP2020191307A (ja) * | 2015-10-09 | 2020-11-26 | デクセリアルズ株式会社 | ヒューズ素子 |
| JP7319237B2 (ja) | 2015-10-09 | 2023-08-01 | デクセリアルズ株式会社 | ヒューズ素子 |
| JP2022515634A (ja) * | 2018-12-27 | 2022-02-21 | シュルター アクチェンゲゼルシャフト | ヒューズの製造方法 |
| JP7438221B2 (ja) | 2018-12-27 | 2024-02-26 | シュルター アクチェンゲゼルシャフト | ヒューズの製造方法 |
| JP2024103729A (ja) * | 2021-03-30 | 2024-08-01 | 株式会社オートネットワーク技術研究所 | ヒューズ素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200402077A (en) | 2004-02-01 |
| TWI274363B (en) | 2007-02-21 |
| CN1447365A (zh) | 2003-10-08 |
| US7570148B2 (en) | 2009-08-04 |
| EP1327999A2 (en) | 2003-07-16 |
| KR20030061353A (ko) | 2003-07-18 |
| CN1276454C (zh) | 2006-09-20 |
| EP1327999A3 (en) | 2004-05-19 |
| US20030142453A1 (en) | 2003-07-31 |
| HK1059843A1 (en) | 2004-07-16 |
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