TWI274363B - Low resistance polymer matrix fuse apparatus and method - Google Patents
Low resistance polymer matrix fuse apparatus and method Download PDFInfo
- Publication number
- TWI274363B TWI274363B TW092100511A TW92100511A TWI274363B TW I274363 B TWI274363 B TW I274363B TW 092100511 A TW092100511 A TW 092100511A TW 92100511 A TW92100511 A TW 92100511A TW I274363 B TWI274363 B TW I274363B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- fuse
- insulating layer
- fuse element
- intermediate insulating
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 51
- 229920000642 polymer Polymers 0.000 title description 3
- 239000011159 matrix material Substances 0.000 title 1
- 239000000463 material Substances 0.000 claims description 35
- 238000004519 manufacturing process Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 238000009413 insulation Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 267
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010923 batch production Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- -1 polyethylene naphthalate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000003656 Electric Burns Diseases 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 230000002535 lyotropic effect Effects 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-AKLPVKDBSA-N oxygen-19 atom Chemical compound [19O] QVGXLLKOCUKJST-AKLPVKDBSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
Landscapes
- Fuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34809802P | 2002-01-10 | 2002-01-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200402077A TW200402077A (en) | 2004-02-01 |
| TWI274363B true TWI274363B (en) | 2007-02-21 |
Family
ID=27613225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092100511A TWI274363B (en) | 2002-01-10 | 2003-01-10 | Low resistance polymer matrix fuse apparatus and method |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7570148B2 (enExample) |
| EP (1) | EP1327999A3 (enExample) |
| JP (1) | JP2003263949A (enExample) |
| KR (1) | KR20030061353A (enExample) |
| CN (1) | CN1276454C (enExample) |
| TW (1) | TWI274363B (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7436284B2 (en) * | 2002-01-10 | 2008-10-14 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| US7385475B2 (en) * | 2002-01-10 | 2008-06-10 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| US7494596B2 (en) * | 2003-03-21 | 2009-02-24 | Hewlett-Packard Development Company, L.P. | Measurement of etching |
| EP1678988A1 (en) * | 2003-10-17 | 2006-07-12 | Koninklijke Philips Electronics N.V. | Printed circuit board including a fuse |
| US7029228B2 (en) | 2003-12-04 | 2006-04-18 | General Electric Company | Method and apparatus for convective cooling of side-walls of turbine nozzle segments |
| WO2005086196A1 (en) * | 2004-03-03 | 2005-09-15 | 3M Innovative Properties Company | Flexible fuse |
| US8368502B2 (en) * | 2006-03-16 | 2013-02-05 | Panasonic Corporation | Surface-mount current fuse |
| ITMI20061663A1 (it) * | 2006-08-31 | 2008-03-01 | I R E Industria Resistenza Elettriche Srl | Resistore con punto critico controllato,specialmente per applicazioni veicolari |
| KR20100053536A (ko) | 2007-06-29 | 2010-05-20 | 아트피셜 머슬, 인코퍼레이션 | 감각적 피드백을 부여하는 전기활성 고분자 변환기 |
| JP4510858B2 (ja) * | 2007-08-08 | 2010-07-28 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
| US9190235B2 (en) * | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
| US8203420B2 (en) * | 2009-06-26 | 2012-06-19 | Cooper Technologies Company | Subminiature fuse with surface mount end caps and improved connectivity |
| JP5260592B2 (ja) * | 2010-04-08 | 2013-08-14 | デクセリアルズ株式会社 | 保護素子、バッテリ制御装置、及びバッテリパック |
| EP2408277B1 (de) * | 2010-07-16 | 2016-02-17 | Schurter AG | Sicherungselement |
| DE102011054485A1 (de) | 2010-10-14 | 2012-04-19 | Avx Corporation | Niedrigstrom-Sicherung |
| US9847203B2 (en) | 2010-10-14 | 2017-12-19 | Avx Corporation | Low current fuse |
| KR20140008416A (ko) | 2011-03-01 | 2014-01-21 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 변형가능한 중합체 장치 및 필름을 제조하기 위한 자동화 제조 방법 |
| US20150009009A1 (en) * | 2011-04-07 | 2015-01-08 | Bayer Intellectual Property Gmbh | Conductive polymer fuse |
| WO2013142552A1 (en) | 2012-03-21 | 2013-09-26 | Bayer Materialscience Ag | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
| EP2837043B1 (en) | 2012-04-12 | 2017-11-22 | Parker-Hannifin Corporation | Eap transducers with improved performance |
| US9761790B2 (en) | 2012-06-18 | 2017-09-12 | Parker-Hannifin Corporation | Stretch frame for stretching process |
| KR101706875B1 (ko) * | 2012-09-28 | 2017-02-14 | 가마야 덴끼 가부시끼가이샤 | 칩 퓨즈 및 그 제조 방법 |
| US9590193B2 (en) | 2012-10-24 | 2017-03-07 | Parker-Hannifin Corporation | Polymer diode |
| JP6294165B2 (ja) * | 2014-06-19 | 2018-03-14 | Koa株式会社 | チップ型ヒューズ |
| CN104157518B (zh) * | 2014-08-22 | 2016-09-21 | Aem科技(苏州)股份有限公司 | 一种中空结构熔断器的制造方法 |
| WO2017061458A1 (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| JP2017073373A (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| EP3179495B1 (en) * | 2015-12-09 | 2018-05-02 | ABB Schweiz AG | Power capacitor unit for high pressure applications |
| US10141150B2 (en) * | 2016-02-17 | 2018-11-27 | Littelfuse, Inc. | High current one-piece fuse element and split body |
| CN105551905B (zh) * | 2016-02-18 | 2017-11-21 | Aem科技(苏州)股份有限公司 | 一种悬空熔丝型表面贴装熔断器及其制备方法 |
| JP6452001B2 (ja) * | 2016-06-08 | 2019-01-16 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
| US11322299B2 (en) | 2017-08-07 | 2022-05-03 | DePuy Synthes Products, Inc. | Folded MRI safe coil assembly |
| WO2020135914A1 (de) * | 2018-12-27 | 2020-07-02 | Schurter Ag | Schmelzsicherung |
| JP7368144B2 (ja) * | 2019-08-27 | 2023-10-24 | Koa株式会社 | チップ型電流ヒューズ |
| US11217415B2 (en) * | 2019-09-25 | 2022-01-04 | Littelfuse, Inc. | High breaking capacity chip fuse |
| EP3926647A3 (en) * | 2020-06-15 | 2022-03-16 | Littelfuse, Inc. | A method for thin-film coating packaging of device having meltable and wetting links |
| JP7501425B2 (ja) * | 2021-03-30 | 2024-06-18 | 株式会社オートネットワーク技術研究所 | ヒューズ素子 |
| EP4258824A4 (en) | 2021-10-28 | 2024-10-02 | LG Energy Solution, Ltd. | Pattern fuse and method for manufacturing same |
| US12002643B2 (en) * | 2021-11-30 | 2024-06-04 | Eaton Intelligent Power Limited | Ceramic printed fuse fabrication |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3500276A (en) * | 1967-10-25 | 1970-03-10 | Texas Instruments Inc | Electrical fuse and heater units |
| US3585556A (en) * | 1969-07-22 | 1971-06-15 | Ashok R Hingorany | Electrical fuse and heater units |
| US3715698A (en) * | 1971-02-16 | 1973-02-06 | Westinghouse Electric Corp | Current limiting fuse |
| US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
| US4612529A (en) * | 1985-03-25 | 1986-09-16 | Cooper Industries, Inc. | Subminiature fuse |
| US4924203A (en) * | 1987-03-24 | 1990-05-08 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
| US4814946A (en) * | 1987-11-20 | 1989-03-21 | Kemet Electronics Corporation | Fuse assembly for solid electrolytic capacitor |
| US4763228A (en) * | 1987-11-20 | 1988-08-09 | Union Carbide Corporation | Fuse assembly for solid electrolytic capacitor |
| NL8802872A (nl) | 1988-11-21 | 1990-06-18 | Littelfuse Tracor | Smeltveiligheid. |
| US4988969A (en) * | 1990-04-23 | 1991-01-29 | Cooper Industries, Inc. | Higher current carrying capacity 250V subminiature fuse |
| JPH04275018A (ja) | 1991-02-27 | 1992-09-30 | Mitsubishi Electric Corp | 変電所事故区間検出装置 |
| US5196819A (en) * | 1991-02-28 | 1993-03-23 | Rock Ltd. Partnership | Printed circuits containing fuse elements and the method of making this circuit |
| JPH052360U (ja) * | 1991-06-25 | 1993-01-14 | 矢崎総業株式会社 | 圧接ヒユーズ |
| US5153553A (en) * | 1991-11-08 | 1992-10-06 | Illinois Tool Works, Inc. | Fuse structure |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
| US5294905A (en) * | 1993-04-23 | 1994-03-15 | Gould Inc. | Current limiting fuse |
| US5357234A (en) * | 1993-04-23 | 1994-10-18 | Gould Electronics Inc. | Current limiting fuse |
| US5296832A (en) * | 1993-04-23 | 1994-03-22 | Gould Inc. | Current limiting fuse |
| JP2557019B2 (ja) | 1993-10-01 | 1996-11-27 | エス・オー・シー株式会社 | 超小型チップヒューズおよびその製造方法 |
| US5432378A (en) * | 1993-12-15 | 1995-07-11 | Cooper Industries, Inc. | Subminiature surface mounted circuit protector |
| JPH07182600A (ja) | 1993-12-22 | 1995-07-21 | Nissan Motor Co Ltd | 車両用距離検出装置 |
| US5790008A (en) | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
| US5552757A (en) | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
| US5712610C1 (en) * | 1994-08-19 | 2002-06-25 | Sony Chemicals Corp | Protective device |
| US5726621A (en) * | 1994-09-12 | 1998-03-10 | Cooper Industries, Inc. | Ceramic chip fuses with multiple current carrying elements and a method for making the same |
| US5929741A (en) | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
| US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
| JPH10269927A (ja) | 1997-03-28 | 1998-10-09 | Hitachi Chem Co Ltd | チップフューズおよびその製造法 |
| US5914649A (en) | 1997-03-28 | 1999-06-22 | Hitachi Chemical Company, Ltd. | Chip fuse and process for production thereof |
| US5821849A (en) * | 1997-07-17 | 1998-10-13 | Littelfuse, Inc. | Flexible blown fuse indicator |
| US5923239A (en) | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| US6002322A (en) | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| US5886613A (en) * | 1998-06-16 | 1999-03-23 | Cooper Technologies Company | Indicating fuse with protective shield |
| US6078245A (en) | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
| JP2000331590A (ja) | 1999-03-18 | 2000-11-30 | Koa Corp | 回路保護素子及びその製造方法 |
| US20030048620A1 (en) | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
-
2003
- 2003-01-09 US US10/339,114 patent/US7570148B2/en not_active Expired - Fee Related
- 2003-01-10 TW TW092100511A patent/TWI274363B/zh not_active IP Right Cessation
- 2003-01-10 CN CNB031217702A patent/CN1276454C/zh not_active Expired - Fee Related
- 2003-01-10 KR KR10-2003-0001633A patent/KR20030061353A/ko not_active Withdrawn
- 2003-01-10 EP EP03100029A patent/EP1327999A3/en not_active Withdrawn
- 2003-01-10 JP JP2003004659A patent/JP2003263949A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1447365A (zh) | 2003-10-08 |
| EP1327999A3 (en) | 2004-05-19 |
| CN1276454C (zh) | 2006-09-20 |
| KR20030061353A (ko) | 2003-07-18 |
| US20030142453A1 (en) | 2003-07-31 |
| JP2003263949A (ja) | 2003-09-19 |
| HK1059843A1 (en) | 2004-07-16 |
| EP1327999A2 (en) | 2003-07-16 |
| US7570148B2 (en) | 2009-08-04 |
| TW200402077A (en) | 2004-02-01 |
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