JP6294165B2 - チップ型ヒューズ - Google Patents
チップ型ヒューズ Download PDFInfo
- Publication number
- JP6294165B2 JP6294165B2 JP2014126036A JP2014126036A JP6294165B2 JP 6294165 B2 JP6294165 B2 JP 6294165B2 JP 2014126036 A JP2014126036 A JP 2014126036A JP 2014126036 A JP2014126036 A JP 2014126036A JP 6294165 B2 JP6294165 B2 JP 6294165B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- chip
- metal layer
- barrier layer
- type fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 230000004888 barrier function Effects 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 18
- 239000006121 base glass Substances 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052715 tantalum Inorganic materials 0.000 claims description 8
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 7
- 229910001120 nichrome Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 102
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0414—Surface mounted fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/18—Casing fillings, e.g. powder
- H01H85/185—Insulating members for supporting fusible elements inside a casing, e.g. for helically wound fusible elements
Landscapes
- Fuses (AREA)
Description
B2O3(ガラス)+ 3H2O → 2H3BO3(ホウ酸)
CuO + 2H3BO3(ホウ酸) → Cu(BO2)2 + 3H2O
Claims (5)
- 絶縁性基板と、
該絶縁性基板上に積層した下地ガラス層と、
該下地ガラス層上の両端側に配設された一対の電極と、
前記電極間に配設されたヒューズエレメントと、
該エレメントの少なくとも溶断部を被覆する上側ガラス層を備え、
前記エレメントは第一の金属層と第二の金属層とが積層され、さらに前記エレメントの幅よりも広い幅で前記第一と第二の金属層を覆う第三の金属層からなるバリア層を備えたことを特徴とするチップ型ヒューズ。 - 請求項1に記載のチップ型ヒューズにおいて、
前記第三の金属層によって第二の金属層を介して第一の金属層まで回り込んで覆われていることを特徴とするチップ型ヒューズ。 - 請求項1に記載のチップ型ヒューズにおいて、
前記第一の金属層はCrからなり、前記第二の金属層はCuからなるヒューズエレメントであることを特徴とするチップ型ヒューズ。 - 請求項1に記載のチップ型ヒューズにおいて、
前記第三の金属層は、Ta、Cr、Ni、NiCr、またはTiのいずれかからなるバリア層であることを特徴とするチップ型ヒューズ。 - 請求項1に記載のチップ型ヒューズにおいて、
前記バリア層の膜厚は、50〜2000Åの範囲であることを特徴とするチップ型ヒューズ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014126036A JP6294165B2 (ja) | 2014-06-19 | 2014-06-19 | チップ型ヒューズ |
US14/739,119 US9779904B2 (en) | 2014-06-19 | 2015-06-15 | Chip type fuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014126036A JP6294165B2 (ja) | 2014-06-19 | 2014-06-19 | チップ型ヒューズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016004736A JP2016004736A (ja) | 2016-01-12 |
JP6294165B2 true JP6294165B2 (ja) | 2018-03-14 |
Family
ID=54870283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014126036A Active JP6294165B2 (ja) | 2014-06-19 | 2014-06-19 | チップ型ヒューズ |
Country Status (2)
Country | Link |
---|---|
US (1) | US9779904B2 (ja) |
JP (1) | JP6294165B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7154907B2 (ja) * | 2018-09-14 | 2022-10-18 | 株式会社東芝 | 半導体モジュール |
US11923162B2 (en) * | 2022-06-22 | 2024-03-05 | Littelfuse, Inc. | Step-terminated SMD fuse |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2911504A (en) * | 1958-05-15 | 1959-11-03 | Sigmund Cohn Corp | Fuse member and method of making the same |
CH642772A5 (de) * | 1977-05-28 | 1984-04-30 | Knudsen Ak L | Elektrische schmelzsicherung und deren herstellungsverfahren. |
US4140988A (en) * | 1977-08-04 | 1979-02-20 | Gould Inc. | Electric fuse for small current intensities |
US4320374A (en) * | 1979-03-21 | 1982-03-16 | Kearney-National (Canada) Limited | Electric fuses employing composite aluminum and cadmium fuse elements |
US4315235A (en) * | 1980-07-31 | 1982-02-09 | Jacobs Jr Philip C | Composite fusible element for electric current-limiting fuses |
JPH0465046A (ja) * | 1990-07-02 | 1992-03-02 | Tateyama Kagaku Kogyo Kk | チップ形ヒューズ抵抗器 |
US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
JP2624439B2 (ja) * | 1993-04-30 | 1997-06-25 | コーア株式会社 | 回路保護用素子 |
JP2745190B2 (ja) * | 1993-08-27 | 1998-04-28 | 矢崎総業株式会社 | 遅断ヒューズ |
JP2747877B2 (ja) * | 1993-10-28 | 1998-05-06 | 矢崎総業株式会社 | 遅断ヒューズ及びその製造方法 |
US5432378A (en) * | 1993-12-15 | 1995-07-11 | Cooper Industries, Inc. | Subminiature surface mounted circuit protector |
US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
JPH09129115A (ja) * | 1995-10-30 | 1997-05-16 | Kyocera Corp | チップヒューズ |
US5914649A (en) * | 1997-03-28 | 1999-06-22 | Hitachi Chemical Company, Ltd. | Chip fuse and process for production thereof |
DE19738575A1 (de) * | 1997-09-04 | 1999-06-10 | Wickmann Werke Gmbh | Elektrisches Sicherungselement |
JP3562696B2 (ja) * | 1997-12-16 | 2004-09-08 | 矢崎総業株式会社 | ヒューズエレメントの製造方法 |
US6034589A (en) * | 1998-12-17 | 2000-03-07 | Aem, Inc. | Multi-layer and multi-element monolithic surface mount fuse and method of making the same |
JP2000306477A (ja) * | 1999-04-16 | 2000-11-02 | Sony Chem Corp | 保護素子 |
WO2001069988A1 (fr) * | 2000-03-14 | 2001-09-20 | Rohm Co., Ltd. | Carte a circuits imprimes comprenant un fusible |
JP2001325869A (ja) * | 2000-05-17 | 2001-11-22 | Sony Chem Corp | 保護素子 |
WO2002095783A1 (fr) * | 2001-05-21 | 2002-11-28 | Matsushita Electric Industrial Co., Ltd. | Fusible thermique |
WO2002103735A1 (de) * | 2001-06-11 | 2002-12-27 | Wickmann-Werke Gmbh | Sicherungsbauelement |
US7570148B2 (en) * | 2002-01-10 | 2009-08-04 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
JP4632358B2 (ja) * | 2005-06-08 | 2011-02-16 | 三菱マテリアル株式会社 | チップ型ヒューズ |
JP4716099B2 (ja) * | 2005-09-30 | 2011-07-06 | 三菱マテリアル株式会社 | チップ型ヒューズの製造方法 |
JP4693001B2 (ja) | 2006-08-23 | 2011-06-01 | コーア株式会社 | チップ型回路保護素子 |
TWI323906B (en) * | 2007-02-14 | 2010-04-21 | Besdon Technology Corp | Chip-type fuse and method of manufacturing the same |
JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
US20110163840A1 (en) * | 2008-10-28 | 2011-07-07 | Nanjing Sart Science & Technology Development Co., Ltd. | High reliability blade fuse and the manufacturing method thereof |
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CN104025242B (zh) * | 2011-10-19 | 2017-08-15 | 保险丝公司 | 复合熔丝元件及其制造方法 |
JP6249600B2 (ja) * | 2012-03-29 | 2017-12-20 | デクセリアルズ株式会社 | 保護素子 |
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-
2014
- 2014-06-19 JP JP2014126036A patent/JP6294165B2/ja active Active
-
2015
- 2015-06-15 US US14/739,119 patent/US9779904B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2016004736A (ja) | 2016-01-12 |
US9779904B2 (en) | 2017-10-03 |
US20150371804A1 (en) | 2015-12-24 |
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