JP5457814B2 - 電子部品の実装構造 - Google Patents
電子部品の実装構造 Download PDFInfo
- Publication number
- JP5457814B2 JP5457814B2 JP2009286587A JP2009286587A JP5457814B2 JP 5457814 B2 JP5457814 B2 JP 5457814B2 JP 2009286587 A JP2009286587 A JP 2009286587A JP 2009286587 A JP2009286587 A JP 2009286587A JP 5457814 B2 JP5457814 B2 JP 5457814B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electronic component
- electrode
- conductive adhesive
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
3a,3b 下内部電極
4 抵抗体
5 一次保護膜
6 トリミング痕
7 二次保護膜
8a,8b 内部端面電極
10a,10b 一次端子電極
12a,12b 二次端子電極
13a,13b 電極保護膜
30 電子部品
31 回路基板
33a,33b 導電性接着剤
35a,35b 端子電極
40a,40b 実装用ランド
41a,41b 配線パターン
Claims (1)
- 実装用ランドと配線パターンが形成された回路基板に、Agを含む導電フィラーを含有した樹脂からなる導電性接着剤を供給し、その導電性接着剤によって前記実装用ランドに抵抗器の端子電極を接続した構成をとる抵抗器の実装構造であって、
前記抵抗器は、絶縁性基板と、その絶縁性基板上に形成され所定の電気的特性を発現する抵抗体と、その抵抗体と接続された内部電極と、前記抵抗体を覆う素子保護膜とを備え、前記端子電極と前記内部電極とが電気的に接続されており、
前記端子電極は、電解メッキ銅からなる金属層と、銅との間に錯体を形成するイミダゾール系プレフラックスにより前記金属層の表面に形成された電極保護膜とを備えることを特徴とする抵抗器の実装構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009286587A JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
PCT/JP2010/069895 WO2011074351A1 (ja) | 2009-12-17 | 2010-11-09 | 電子部品の実装構造 |
CN201080056663.5A CN102687211B (zh) | 2009-12-17 | 2010-11-09 | 电子部件的安装构造 |
US13/517,044 US8895869B2 (en) | 2009-12-17 | 2010-11-09 | Mounting structure of electronic component |
DE112010004864T DE112010004864T5 (de) | 2009-12-17 | 2010-11-09 | Montagestruktur für elektronische Bauteile |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009286587A JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011129696A JP2011129696A (ja) | 2011-06-30 |
JP5457814B2 true JP5457814B2 (ja) | 2014-04-02 |
Family
ID=44167116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009286587A Expired - Fee Related JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8895869B2 (ja) |
JP (1) | JP5457814B2 (ja) |
CN (1) | CN102687211B (ja) |
DE (1) | DE112010004864T5 (ja) |
WO (1) | WO2011074351A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5278709B2 (ja) * | 2009-12-04 | 2013-09-04 | 株式会社村田製作所 | 導電性樹脂組成物およびチップ型電子部品 |
FR3011713B1 (fr) * | 2013-10-09 | 2017-06-23 | Valeo Systemes De Controle Moteur | Module electrique, systeme electrique comportant un tel module electrique, procedes de fabrication correspondants |
JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10032583B2 (en) * | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
KR102527723B1 (ko) * | 2016-11-15 | 2023-05-02 | 삼성전기주식회사 | 칩 저항 소자 및 칩 저항 소자 어셈블리 |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
CN111710488B (zh) * | 2020-06-21 | 2021-10-22 | 广东风华邦科电子有限公司 | 一种片式精密电阻器的制备方法 |
CN112103458B (zh) * | 2020-09-23 | 2022-11-11 | 长春富超威硕科技有限公司 | 防氧化快速接线电瓶 |
CN117393253A (zh) | 2022-07-04 | 2024-01-12 | 国巨电子(中国)有限公司 | 抗浪涌电阻器及其制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0741146Y2 (ja) * | 1989-06-21 | 1995-09-20 | ティーディーケイ株式会社 | セラミック電子部品 |
JPH0336166U (ja) * | 1989-08-18 | 1991-04-09 | ||
JPH0763105B2 (ja) * | 1993-02-12 | 1995-07-05 | 日本電気株式会社 | 印刷配線板の製造方法 |
JPH08330105A (ja) * | 1995-05-31 | 1996-12-13 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH1084177A (ja) * | 1996-09-09 | 1998-03-31 | Matsushita Electric Ind Co Ltd | 回路基板およびその製造方法 |
DE10035172B4 (de) * | 2000-07-19 | 2004-09-16 | Epcos Ag | Keramikmasse und Kondensator mit der Keramikmasse |
JP2002343668A (ja) * | 2001-05-15 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 電子部品と回路基板および電子部品の実装体 |
US7258819B2 (en) * | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
JP3845030B2 (ja) * | 2002-02-25 | 2006-11-15 | コーア株式会社 | チップ抵抗器の製造方法 |
JP4089273B2 (ja) * | 2002-04-18 | 2008-05-28 | ソニー株式会社 | 部品内蔵基板の製造方法 |
JP4135565B2 (ja) * | 2003-06-06 | 2008-08-20 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
TWI230995B (en) * | 2004-05-28 | 2005-04-11 | Via Tech Inc | Electronic package with passive components |
JP4295202B2 (ja) * | 2004-11-30 | 2009-07-15 | 太陽社電気株式会社 | チップ部品及びチップ部品の製造方法 |
JP4883996B2 (ja) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | 水溶性プレフラックス及びその利用 |
JP5036216B2 (ja) * | 2006-05-19 | 2012-09-26 | 四国化成工業株式会社 | 金属の表面処理剤およびその利用 |
JP4600687B2 (ja) * | 2007-03-29 | 2010-12-15 | Tdk株式会社 | 電子部品およびその製造方法 |
JP2009099913A (ja) * | 2007-10-19 | 2009-05-07 | Nec Tokin Corp | 多端子型固体電解コンデンサ |
JP2010003800A (ja) * | 2008-06-19 | 2010-01-07 | Murata Mfg Co Ltd | チップ部品及びその製造方法並びに部品内蔵モジュール及びその製造方法 |
-
2009
- 2009-12-17 JP JP2009286587A patent/JP5457814B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-09 US US13/517,044 patent/US8895869B2/en active Active
- 2010-11-09 CN CN201080056663.5A patent/CN102687211B/zh not_active Expired - Fee Related
- 2010-11-09 WO PCT/JP2010/069895 patent/WO2011074351A1/ja active Application Filing
- 2010-11-09 DE DE112010004864T patent/DE112010004864T5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN102687211A (zh) | 2012-09-19 |
JP2011129696A (ja) | 2011-06-30 |
WO2011074351A1 (ja) | 2011-06-23 |
US20120305302A1 (en) | 2012-12-06 |
CN102687211B (zh) | 2016-08-10 |
DE112010004864T5 (de) | 2013-01-17 |
US8895869B2 (en) | 2014-11-25 |
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