JP2011129696A - 電子部品の実装構造 - Google Patents
電子部品の実装構造 Download PDFInfo
- Publication number
- JP2011129696A JP2011129696A JP2009286587A JP2009286587A JP2011129696A JP 2011129696 A JP2011129696 A JP 2011129696A JP 2009286587 A JP2009286587 A JP 2009286587A JP 2009286587 A JP2009286587 A JP 2009286587A JP 2011129696 A JP2011129696 A JP 2011129696A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting structure
- electrode
- conductive adhesive
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 5
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- -1 imidazole compound Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】電子部品の端子電極35a,35bとしての金属層の表面に、イミダゾール系プレフラックスにより電極保護膜を形成する。そして、この保護膜が形成された電子部品の端子電極を、回路基板の実装用ランド40a,40bに供給した導電性接着剤33a,33bにより固着させる。
【選択図】図3
Description
例えば、前記電子部品は、絶縁性基板と、その絶縁性基板上に形成され所定の電気的特性を発現する電気素子と、その電気素子と接続された内部電極と、前記電気素子を覆う素子保護膜とを備え、前記端子電極と前記内部電極とが電気的に接続されていることを特徴とする。また、例えば、前記金属層は電解メッキにより形成されていることを特徴とする。さらには、例えば、前記電気素子は抵抗体であり、前記電子部品は抵抗器であることを特徴とする。
3a,3b 下内部電極
4 抵抗体
5 一次保護膜
6 トリミング痕
7 二次保護膜
8a,8b 内部端面電極
10a,10b 一次端子電極
12a,12b 二次端子電極
13a,13b 電極保護膜
30 電子部品
31 回路基板
33a,33b 導電性接着剤
35a,35b 端子電極
40a,40b 実装用ランド
41a,41b 配線パターン
Claims (4)
- 実装用ランドと配線パターンが形成された回路基板に、導電フィラーを含有した樹脂からなる導電性接着剤を供給し、その導電性接着剤によって前記実装用ランドに電子部品の端子電極を接続した構成をとる電子部品の実装構造であって、
前記端子電極は、銅からなる金属層と、イミダゾール系プレフラックスにより前記金属層の表面に形成された電極保護膜とを備えることを特徴とする電子部品の実装構造。 - 前記電子部品は、絶縁性基板と、その絶縁性基板上に形成され所定の電気的特性を発現する電気素子と、その電気素子と接続された内部電極と、前記電気素子を覆う素子保護膜とを備え、前記端子電極と前記内部電極とが電気的に接続されていることを特徴とする請求項1に記載の電子部品の実装構造。
- 前記金属層は電解メッキにより形成されていることを特徴とする請求項1または2に記載の電子部品の実装構造。
- 前記電気素子は抵抗体であり、前記電子部品は抵抗器であることを特徴とする請求項1乃至3のいずれかに記載の電子部品の実装構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009286587A JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
US13/517,044 US8895869B2 (en) | 2009-12-17 | 2010-11-09 | Mounting structure of electronic component |
DE112010004864T DE112010004864T5 (de) | 2009-12-17 | 2010-11-09 | Montagestruktur für elektronische Bauteile |
PCT/JP2010/069895 WO2011074351A1 (ja) | 2009-12-17 | 2010-11-09 | 電子部品の実装構造 |
CN201080056663.5A CN102687211B (zh) | 2009-12-17 | 2010-11-09 | 电子部件的安装构造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009286587A JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011129696A true JP2011129696A (ja) | 2011-06-30 |
JP5457814B2 JP5457814B2 (ja) | 2014-04-02 |
Family
ID=44167116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009286587A Expired - Fee Related JP5457814B2 (ja) | 2009-12-17 | 2009-12-17 | 電子部品の実装構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8895869B2 (ja) |
JP (1) | JP5457814B2 (ja) |
CN (1) | CN102687211B (ja) |
DE (1) | DE112010004864T5 (ja) |
WO (1) | WO2011074351A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180054273A (ko) * | 2016-11-15 | 2018-05-24 | 삼성전기주식회사 | 칩 저항 소자 및 칩 저항 소자 어셈블리 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5278709B2 (ja) * | 2009-12-04 | 2013-09-04 | 株式会社村田製作所 | 導電性樹脂組成物およびチップ型電子部品 |
FR3011713B1 (fr) * | 2013-10-09 | 2017-06-23 | Valeo Systemes De Controle Moteur | Module electrique, systeme electrique comportant un tel module electrique, procedes de fabrication correspondants |
JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
US10032583B2 (en) * | 2016-02-17 | 2018-07-24 | Dexerials Corporation | Protective circuit substrate |
US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
CN111710488B (zh) * | 2020-06-21 | 2021-10-22 | 广东风华邦科电子有限公司 | 一种片式精密电阻器的制备方法 |
CN112103458B (zh) * | 2020-09-23 | 2022-11-11 | 长春富超威硕科技有限公司 | 防氧化快速接线电瓶 |
CN117393253A (zh) | 2022-07-04 | 2024-01-12 | 国巨电子(中国)有限公司 | 抗浪涌电阻器及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0336166U (ja) * | 1989-08-18 | 1991-04-09 | ||
JPH08330105A (ja) * | 1995-05-31 | 1996-12-13 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH1084177A (ja) * | 1996-09-09 | 1998-03-31 | Matsushita Electric Ind Co Ltd | 回路基板およびその製造方法 |
JP2002343668A (ja) * | 2001-05-15 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 電子部品と回路基板および電子部品の実装体 |
JP2003309373A (ja) * | 2002-04-18 | 2003-10-31 | Sony Corp | 電子部品、部品内蔵基板および部品内蔵基板の製造方法 |
JP2009099913A (ja) * | 2007-10-19 | 2009-05-07 | Nec Tokin Corp | 多端子型固体電解コンデンサ |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0741146Y2 (ja) * | 1989-06-21 | 1995-09-20 | ティーディーケイ株式会社 | セラミック電子部品 |
JPH0763105B2 (ja) * | 1993-02-12 | 1995-07-05 | 日本電気株式会社 | 印刷配線板の製造方法 |
DE10035172B4 (de) * | 2000-07-19 | 2004-09-16 | Epcos Ag | Keramikmasse und Kondensator mit der Keramikmasse |
US7258819B2 (en) * | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
JP3845030B2 (ja) * | 2002-02-25 | 2006-11-15 | コーア株式会社 | チップ抵抗器の製造方法 |
JP4135565B2 (ja) * | 2003-06-06 | 2008-08-20 | 松下電器産業株式会社 | 電子回路装置およびその製造方法 |
TWI230995B (en) * | 2004-05-28 | 2005-04-11 | Via Tech Inc | Electronic package with passive components |
JP4295202B2 (ja) * | 2004-11-30 | 2009-07-15 | 太陽社電気株式会社 | チップ部品及びチップ部品の製造方法 |
JP4883996B2 (ja) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | 水溶性プレフラックス及びその利用 |
JP5036216B2 (ja) * | 2006-05-19 | 2012-09-26 | 四国化成工業株式会社 | 金属の表面処理剤およびその利用 |
JP4600687B2 (ja) * | 2007-03-29 | 2010-12-15 | Tdk株式会社 | 電子部品およびその製造方法 |
JP2010003800A (ja) * | 2008-06-19 | 2010-01-07 | Murata Mfg Co Ltd | チップ部品及びその製造方法並びに部品内蔵モジュール及びその製造方法 |
-
2009
- 2009-12-17 JP JP2009286587A patent/JP5457814B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-09 WO PCT/JP2010/069895 patent/WO2011074351A1/ja active Application Filing
- 2010-11-09 DE DE112010004864T patent/DE112010004864T5/de not_active Withdrawn
- 2010-11-09 US US13/517,044 patent/US8895869B2/en active Active
- 2010-11-09 CN CN201080056663.5A patent/CN102687211B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0336166U (ja) * | 1989-08-18 | 1991-04-09 | ||
JPH08330105A (ja) * | 1995-05-31 | 1996-12-13 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH1084177A (ja) * | 1996-09-09 | 1998-03-31 | Matsushita Electric Ind Co Ltd | 回路基板およびその製造方法 |
JP2002343668A (ja) * | 2001-05-15 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 電子部品と回路基板および電子部品の実装体 |
JP2003309373A (ja) * | 2002-04-18 | 2003-10-31 | Sony Corp | 電子部品、部品内蔵基板および部品内蔵基板の製造方法 |
JP2009099913A (ja) * | 2007-10-19 | 2009-05-07 | Nec Tokin Corp | 多端子型固体電解コンデンサ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180054273A (ko) * | 2016-11-15 | 2018-05-24 | 삼성전기주식회사 | 칩 저항 소자 및 칩 저항 소자 어셈블리 |
KR102527723B1 (ko) * | 2016-11-15 | 2023-05-02 | 삼성전기주식회사 | 칩 저항 소자 및 칩 저항 소자 어셈블리 |
Also Published As
Publication number | Publication date |
---|---|
WO2011074351A1 (ja) | 2011-06-23 |
CN102687211A (zh) | 2012-09-19 |
DE112010004864T5 (de) | 2013-01-17 |
CN102687211B (zh) | 2016-08-10 |
US20120305302A1 (en) | 2012-12-06 |
JP5457814B2 (ja) | 2014-04-02 |
US8895869B2 (en) | 2014-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5457814B2 (ja) | 電子部品の実装構造 | |
WO2013146671A1 (ja) | 抵抗器およびその実装構造 | |
US9589711B2 (en) | Resistor and manufacturing method thereof | |
JP2018019061A (ja) | コイル部品及びその製造方法 | |
US20160372293A1 (en) | Fuse in chip design | |
US8363382B2 (en) | Structure of multilayer ceramic device | |
JP4431052B2 (ja) | 抵抗器の製造方法 | |
CN105702432B (zh) | 电子组件以及具有该电子组件的板 | |
JP2004200373A (ja) | 電子部品および製造方法 | |
JP2001230151A (ja) | リードレスチップ部品 | |
JP2005191206A (ja) | 抵抗器およびその製造方法 | |
JP5018752B2 (ja) | 導電材料、及び導電材料の製造方法 | |
JP5252050B2 (ja) | 回路基板、及び回路基板の製造方法 | |
JP2001155955A (ja) | 外部端子電極具備電子部品及びその搭載電子用品 | |
JP4295202B2 (ja) | チップ部品及びチップ部品の製造方法 | |
US20230144364A1 (en) | Electronic component | |
US12027291B2 (en) | Chip component | |
JP6260169B2 (ja) | セラミック電子部品 | |
US20220392673A1 (en) | Chip component | |
JP5257546B2 (ja) | 電子機器の製造方法 | |
US20240153678A1 (en) | Chip component and chip component production method | |
CN202008888U (zh) | 一种层积式陶瓷元件 | |
JP4182489B2 (ja) | 外部接続電極付電子部品及び回路モジュール | |
JP5435095B2 (ja) | 回路基板、及び回路基板の製造方法 | |
JP5257539B2 (ja) | 回路基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121204 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131105 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131217 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140110 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5457814 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |