JP6452001B2 - 電子装置、及び電子装置の製造方法 - Google Patents
電子装置、及び電子装置の製造方法 Download PDFInfo
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Description
さらに、フレキシブル基板とリジッド基板とは導電性接合剤を介して接合することができることから、別途仮止め用の接着剤を要することなくリジッド基板とフレキシブル基板とを所定位置に容易に固定することが可能となる。
厚み25μmのポリイミド樹脂の表裏両面に厚みが18μmの銅箔が貼着された長さ8.0mm、幅6.2mmのフレキシブル母体を用意した。
厚み18μmの銅箔が両主面全域に形成された長さ8.0mm、幅6.2mm、厚み0.6mmのガラスエポキシ樹脂を主体としたリジッド母体を用意した。
Ag含有量が3.0wt%、Cu含有量が0.5wt%のSn−Ag−Cu系はんだペーストを使用し、該はんだペーストをスクリーン印刷によりリジッド基板の所定箇所に塗布した後、最高温度235〜250℃に調整されたリフロー炉を通過させてリフロー加熱を行い、これによりはんだペーストを加熱硬化させ、中間接続層を作製した。
長さ5.7mm、幅5.0mm、高さ2.7mmの積層セラミックコンデンサを用意した。
上述のようにして作製された試料番号1〜3の各試料10個について、ヒートサイクル試験を行い、光学顕微鏡で試験後の試料を観察し、信頼性を評価した。
ここで、Lは、上述したクラック長さ(mm)、Rは、残存部長さ(mm)である。
3 電子部品
4 中間接続層
5a、5b はんだ(導電性接合剤)
8a、8b 第1及び第2の導体部(導体部)
10a、10b はんだ(導電性接合剤)
11 リジッド基板
12 フレキシブル基板
13 はんだ(導電性接合剤)
14 フレキシブル母体
15a、15b 第1及び第2の貫通孔(貫通孔)
16a、16b 窓部
17a、17b 第3及び第4の導体部(導体部)
20 ヒューズ部
22 リジッド母体
23a〜23c 第5〜第7の導体部(導体部)
24 開口部
25a、25b 金属皮膜
27a、27b 第8及び第9の導体部(導体部)
Claims (15)
- 配線基板と電子部品との間に中間接続層が介在され、前記配線基板と前記電子部品とが電気的に接続された電子装置において、
前記中間接続層は、剛性材料を主体とするリジッド基板と、屈曲性材料を主体とするフレキシブル基板とを備え、
前記フレキシブル基板及び前記リジッド基板のそれぞれの両主面には互いに電気的に絶縁された複数の導体部が形成されると共に、
前記リジッド基板は、該リジッド基板に設けられた導体部間に開口部が設けられ、
前記フレキシブル基板は、前記リジッド基板の対向面側に形成された前記導体部のうちのいずれか一の導体部は、狭窄状のヒューズ部を有すると共に、該ヒューズ部は前記開口部に対向する位置に配され、かつ前記フレキシブル基板に形成された前記導体部の内部に貫通孔が設けられると共に、導電性接合剤が前記貫通孔に充填され、
前記フレキシブル基板と前記リジッド基板とが、前記導電性接合剤を介して電気的に接続されていることを特徴とする電子装置。 - 前記電子部品は、前記フレキシブル基板上に実装され、前記リジッド基板は、前記配線基板に電気的に接続されていることを特徴とする請求項1記載の電子装置。
- 前記フレキシブル基板は、前記ヒューズ部の両隣に窓部が形成されていることを特徴とする請求項1又は請求項2記載の電子装置。
- 前記リジッド基板は、一方の主面に形成された前記導体部と他方の主面に形成された前記導体部とが互いに直交状に形成されていることを特徴とする請求項1乃至請求項3のいずれかに記載の電子装置。
- 前記電子部品の対向面に形成された前記フレキシブル基板上の一対の前記導体部は、導体部間隔Aを有し、
前記リジッド基板が前記配線基板に接合されると共に、前記リジッド基板と前記配線基板との側面方向における接合距離Bが、前記導体部間隔Aよりも小さいことを特徴とする請求項1乃至請求項4のいずれかに記載の電子装置。 - 前記フレキシブル基板は、薄層化されていることを特徴とする請求項1乃至請求項5のいずれかに記載の電子装置。
- 金属皮膜が、前記中間接続層の側面に形成されていることを特徴とする請求項1乃至請求項6のいずれかに記載の電子装置。
- 前記フレキシブル基板は、耐熱性樹脂材料を主体としていることを特徴とする請求項1乃至請求項7のいずれかに記載の電子装置。
- 前記導電性接合剤は、はんだ系材料で形成されていることを特徴とする請求項1乃至請求項8のいずれかに記載の電子装置。
- 配線基板と電子部品との間に中間接続層を介在させた電子装置の製造方法において、
剛性材料を主体とするリジッド母体と、屈曲性材料を主体とするフレキシブル母体とを準備する母体準備工程と、
前記フレキシブル母体の両主面に互いに電気的に絶縁された複数の導体部を形成すると共に、前記複数の導体部のうちのいずれか一の導体部がヒューズ部を有するように形成し、前記導体部の内部に貫通孔を形成するフレキシブル基板作製工程と、
前記リジッド母体の両主面に互いに電気的に絶縁された複数の導体部を形成し、さらに前記導体部間に開口部を形成するリジッド基板作製工程と、
前記リジッド基板上に導電性接合剤を塗布する塗布工程と、
前記ヒューズ部が前記開口部と対向するように前記フレキシブル基板と前記リジッド基板とを配し、前記導電性接合剤を前記貫通孔に充填しかつ前記フレキシブル基板と前記リジッド基板とを前記導電性接合剤を介して接合し、前記中間接続層を形成する中間接続層形成工程とを含んでいることを特徴とする電子装置の製造方法。 - 前記電子部品を前記フレキシブル基板上に実装し、前記リジッド基板を前記配線基板に電気的に接続することを特徴とする請求項10記載の電子装置の製造方法。
- 前記フレキシブル基板作製工程は、前記ヒューズ部の両隣に窓部を形成することを特徴とする請求項10又は請求項11記載の電子装置の製造方法。
- 前記塗布工程は、印刷法を使用して前記導電性接合剤を前記リジッド基板に塗布することを特徴とする請求項10乃至請求項12のいずれかに記載の電子装置の製造方法。
- 前記リジッド基板作製工程は、前記リジッド母体の側面に金属皮膜を形成する工程を含むことを特徴とする請求項10乃至又は請求項13のいずれかに記載の電子装置の製造方法。
- 前記導電性接合剤は、はんだ系材料であることを特徴とする請求項10乃至請求項14のいずれかに記載の電子装置の製造方法。
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