KR20030061353A - 저저항 중합체 매트릭스 퓨즈장치 및 그 제조방법 - Google Patents
저저항 중합체 매트릭스 퓨즈장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR20030061353A KR20030061353A KR10-2003-0001633A KR20030001633A KR20030061353A KR 20030061353 A KR20030061353 A KR 20030061353A KR 20030001633 A KR20030001633 A KR 20030001633A KR 20030061353 A KR20030061353 A KR 20030061353A
- Authority
- KR
- South Korea
- Prior art keywords
- fuse
- layer
- fuse element
- intermediate insulating
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 58
- 229920000642 polymer Polymers 0.000 title description 4
- 239000011159 matrix material Substances 0.000 title description 3
- 239000010410 layer Substances 0.000 claims description 338
- 239000011888 foil Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 42
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000011229 interlayer Substances 0.000 description 26
- 238000009413 insulation Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 239000010949 copper Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000011135 tin Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- -1 Pyrolux Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010923 batch production Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 235000002918 Fraxinus excelsior Nutrition 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002956 ash Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
- H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
Landscapes
- Fuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34809802P | 2002-01-10 | 2002-01-10 | |
| US60/348,098 | 2002-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030061353A true KR20030061353A (ko) | 2003-07-18 |
Family
ID=27613225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0001633A Withdrawn KR20030061353A (ko) | 2002-01-10 | 2003-01-10 | 저저항 중합체 매트릭스 퓨즈장치 및 그 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7570148B2 (enExample) |
| EP (1) | EP1327999A3 (enExample) |
| JP (1) | JP2003263949A (enExample) |
| KR (1) | KR20030061353A (enExample) |
| CN (1) | CN1276454C (enExample) |
| TW (1) | TWI274363B (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7436284B2 (en) * | 2002-01-10 | 2008-10-14 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| US7385475B2 (en) * | 2002-01-10 | 2008-06-10 | Cooper Technologies Company | Low resistance polymer matrix fuse apparatus and method |
| US7494596B2 (en) * | 2003-03-21 | 2009-02-24 | Hewlett-Packard Development Company, L.P. | Measurement of etching |
| CN1868241A (zh) * | 2003-10-17 | 2006-11-22 | 皇家飞利浦电子股份有限公司 | 包含熔丝的印刷电路板 |
| US7029228B2 (en) | 2003-12-04 | 2006-04-18 | General Electric Company | Method and apparatus for convective cooling of side-walls of turbine nozzle segments |
| WO2005086196A1 (en) * | 2004-03-03 | 2005-09-15 | 3M Innovative Properties Company | Flexible fuse |
| CN101401181B (zh) * | 2006-03-16 | 2011-06-15 | 松下电器产业株式会社 | 表面安装型电流熔断器 |
| ITMI20061663A1 (it) * | 2006-08-31 | 2008-03-01 | I R E Industria Resistenza Elettriche Srl | Resistore con punto critico controllato,specialmente per applicazioni veicolari |
| WO2009006318A1 (en) | 2007-06-29 | 2009-01-08 | Artificial Muscle, Inc. | Electroactive polymer transducers for sensory feedback applications |
| JP4510858B2 (ja) * | 2007-08-08 | 2010-07-28 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
| US9190235B2 (en) * | 2007-12-29 | 2015-11-17 | Cooper Technologies Company | Manufacturability of SMD and through-hole fuses using laser process |
| US8203420B2 (en) * | 2009-06-26 | 2012-06-19 | Cooper Technologies Company | Subminiature fuse with surface mount end caps and improved connectivity |
| JP5260592B2 (ja) * | 2010-04-08 | 2013-08-14 | デクセリアルズ株式会社 | 保護素子、バッテリ制御装置、及びバッテリパック |
| ES2563170T3 (es) * | 2010-07-16 | 2016-03-11 | Schurter Ag | Elemento de fusible |
| DE102011054485A1 (de) | 2010-10-14 | 2012-04-19 | Avx Corporation | Niedrigstrom-Sicherung |
| US9847203B2 (en) * | 2010-10-14 | 2017-12-19 | Avx Corporation | Low current fuse |
| JP2014513510A (ja) | 2011-03-01 | 2014-05-29 | バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 変形可能なポリマー装置及び変形可能なポリマーフィルムを作るための自動化された製造プロセス |
| EP2695170A4 (en) * | 2011-04-07 | 2015-05-27 | Parker Hannifin Corp | CONDUCTIVE POLYMER INSURANCE |
| WO2013142552A1 (en) | 2012-03-21 | 2013-09-26 | Bayer Materialscience Ag | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
| US9786834B2 (en) | 2012-04-12 | 2017-10-10 | Parker-Hannifin Corporation | EAP transducers with improved performance |
| US9761790B2 (en) | 2012-06-18 | 2017-09-12 | Parker-Hannifin Corporation | Stretch frame for stretching process |
| JP5979654B2 (ja) * | 2012-09-28 | 2016-08-24 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
| US9590193B2 (en) | 2012-10-24 | 2017-03-07 | Parker-Hannifin Corporation | Polymer diode |
| JP6294165B2 (ja) * | 2014-06-19 | 2018-03-14 | Koa株式会社 | チップ型ヒューズ |
| CN104157518B (zh) * | 2014-08-22 | 2016-09-21 | Aem科技(苏州)股份有限公司 | 一种中空结构熔断器的制造方法 |
| JP2017073373A (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| WO2017061458A1 (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
| EP3179495B1 (en) * | 2015-12-09 | 2018-05-02 | ABB Schweiz AG | Power capacitor unit for high pressure applications |
| US10141150B2 (en) * | 2016-02-17 | 2018-11-27 | Littelfuse, Inc. | High current one-piece fuse element and split body |
| CN105551905B (zh) * | 2016-02-18 | 2017-11-21 | Aem科技(苏州)股份有限公司 | 一种悬空熔丝型表面贴装熔断器及其制备方法 |
| JP6452001B2 (ja) * | 2016-06-08 | 2019-01-16 | 株式会社村田製作所 | 電子装置、及び電子装置の製造方法 |
| AU2018313692B2 (en) | 2017-08-07 | 2023-06-01 | Depuy Synthes Products, Inc | Folded MRI safe coil assembly |
| WO2020135914A1 (de) * | 2018-12-27 | 2020-07-02 | Schurter Ag | Schmelzsicherung |
| JP7368144B2 (ja) * | 2019-08-27 | 2023-10-24 | Koa株式会社 | チップ型電流ヒューズ |
| US11217415B2 (en) * | 2019-09-25 | 2022-01-04 | Littelfuse, Inc. | High breaking capacity chip fuse |
| US11807770B2 (en) * | 2020-06-15 | 2023-11-07 | Littelfuse, Inc. | Thin film coating packaging for device having meltable and wetting links |
| JP7501425B2 (ja) * | 2021-03-30 | 2024-06-18 | 株式会社オートネットワーク技術研究所 | ヒューズ素子 |
| JP7729689B2 (ja) | 2021-10-28 | 2025-08-26 | エルジー エナジー ソリューション リミテッド | パターンヒューズ及びその製造方法 |
| US12002643B2 (en) * | 2021-11-30 | 2024-06-04 | Eaton Intelligent Power Limited | Ceramic printed fuse fabrication |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3500276A (en) * | 1967-10-25 | 1970-03-10 | Texas Instruments Inc | Electrical fuse and heater units |
| US3585556A (en) * | 1969-07-22 | 1971-06-15 | Ashok R Hingorany | Electrical fuse and heater units |
| US3715698A (en) * | 1971-02-16 | 1973-02-06 | Westinghouse Electric Corp | Current limiting fuse |
| US4296398A (en) * | 1978-12-18 | 1981-10-20 | Mcgalliard James D | Printed circuit fuse assembly |
| US4612529A (en) * | 1985-03-25 | 1986-09-16 | Cooper Industries, Inc. | Subminiature fuse |
| US4924203A (en) * | 1987-03-24 | 1990-05-08 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
| US4763228A (en) * | 1987-11-20 | 1988-08-09 | Union Carbide Corporation | Fuse assembly for solid electrolytic capacitor |
| US4814946A (en) * | 1987-11-20 | 1989-03-21 | Kemet Electronics Corporation | Fuse assembly for solid electrolytic capacitor |
| NL8802872A (nl) * | 1988-11-21 | 1990-06-18 | Littelfuse Tracor | Smeltveiligheid. |
| US4988969A (en) * | 1990-04-23 | 1991-01-29 | Cooper Industries, Inc. | Higher current carrying capacity 250V subminiature fuse |
| JPH04275018A (ja) | 1991-02-27 | 1992-09-30 | Mitsubishi Electric Corp | 変電所事故区間検出装置 |
| US5196819A (en) * | 1991-02-28 | 1993-03-23 | Rock Ltd. Partnership | Printed circuits containing fuse elements and the method of making this circuit |
| JPH052360U (ja) * | 1991-06-25 | 1993-01-14 | 矢崎総業株式会社 | 圧接ヒユーズ |
| US5153553A (en) * | 1991-11-08 | 1992-10-06 | Illinois Tool Works, Inc. | Fuse structure |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
| US5357234A (en) * | 1993-04-23 | 1994-10-18 | Gould Electronics Inc. | Current limiting fuse |
| US5296832A (en) * | 1993-04-23 | 1994-03-22 | Gould Inc. | Current limiting fuse |
| US5294905A (en) * | 1993-04-23 | 1994-03-15 | Gould Inc. | Current limiting fuse |
| JP2557019B2 (ja) * | 1993-10-01 | 1996-11-27 | エス・オー・シー株式会社 | 超小型チップヒューズおよびその製造方法 |
| US5432378A (en) * | 1993-12-15 | 1995-07-11 | Cooper Industries, Inc. | Subminiature surface mounted circuit protector |
| JPH07182600A (ja) | 1993-12-22 | 1995-07-21 | Nissan Motor Co Ltd | 車両用距離検出装置 |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
| US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
| US5712610C1 (en) * | 1994-08-19 | 2002-06-25 | Sony Chemicals Corp | Protective device |
| US5726621A (en) * | 1994-09-12 | 1998-03-10 | Cooper Industries, Inc. | Ceramic chip fuses with multiple current carrying elements and a method for making the same |
| US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
| US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
| JPH10269927A (ja) | 1997-03-28 | 1998-10-09 | Hitachi Chem Co Ltd | チップフューズおよびその製造法 |
| US5914649A (en) * | 1997-03-28 | 1999-06-22 | Hitachi Chemical Company, Ltd. | Chip fuse and process for production thereof |
| US5821849A (en) * | 1997-07-17 | 1998-10-13 | Littelfuse, Inc. | Flexible blown fuse indicator |
| US5923239A (en) * | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| US5886613A (en) * | 1998-06-16 | 1999-03-23 | Cooper Technologies Company | Indicating fuse with protective shield |
| US6078245A (en) * | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
| JP2000331590A (ja) | 1999-03-18 | 2000-11-30 | Koa Corp | 回路保護素子及びその製造方法 |
| US20030048620A1 (en) * | 2000-03-14 | 2003-03-13 | Kohshi Nishimura | Printed-circuit board with fuse |
-
2003
- 2003-01-09 US US10/339,114 patent/US7570148B2/en not_active Expired - Fee Related
- 2003-01-10 CN CNB031217702A patent/CN1276454C/zh not_active Expired - Fee Related
- 2003-01-10 TW TW092100511A patent/TWI274363B/zh not_active IP Right Cessation
- 2003-01-10 EP EP03100029A patent/EP1327999A3/en not_active Withdrawn
- 2003-01-10 KR KR10-2003-0001633A patent/KR20030061353A/ko not_active Withdrawn
- 2003-01-10 JP JP2003004659A patent/JP2003263949A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US7570148B2 (en) | 2009-08-04 |
| CN1276454C (zh) | 2006-09-20 |
| HK1059843A1 (en) | 2004-07-16 |
| JP2003263949A (ja) | 2003-09-19 |
| EP1327999A2 (en) | 2003-07-16 |
| CN1447365A (zh) | 2003-10-08 |
| US20030142453A1 (en) | 2003-07-31 |
| EP1327999A3 (en) | 2004-05-19 |
| TWI274363B (en) | 2007-02-21 |
| TW200402077A (en) | 2004-02-01 |
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