JP2003263949A5 - - Google Patents

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Publication number
JP2003263949A5
JP2003263949A5 JP2003004659A JP2003004659A JP2003263949A5 JP 2003263949 A5 JP2003263949 A5 JP 2003263949A5 JP 2003004659 A JP2003004659 A JP 2003004659A JP 2003004659 A JP2003004659 A JP 2003004659A JP 2003263949 A5 JP2003263949 A5 JP 2003263949A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003004659A
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Japanese (ja)
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JP2003263949A (ja
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Publication date
Application filed filed Critical
Publication of JP2003263949A publication Critical patent/JP2003263949A/ja
Publication of JP2003263949A5 publication Critical patent/JP2003263949A5/ja
Pending legal-status Critical Current

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JP2003004659A 2002-01-10 2003-01-10 低抵抗ポリマーマトリクスヒューズ装置および方法 Pending JP2003263949A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34809802P 2002-01-10 2002-01-10
US60/348098 2002-01-10

Publications (2)

Publication Number Publication Date
JP2003263949A JP2003263949A (ja) 2003-09-19
JP2003263949A5 true JP2003263949A5 (enExample) 2006-02-23

Family

ID=27613225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003004659A Pending JP2003263949A (ja) 2002-01-10 2003-01-10 低抵抗ポリマーマトリクスヒューズ装置および方法

Country Status (6)

Country Link
US (1) US7570148B2 (enExample)
EP (1) EP1327999A3 (enExample)
JP (1) JP2003263949A (enExample)
KR (1) KR20030061353A (enExample)
CN (1) CN1276454C (enExample)
TW (1) TWI274363B (enExample)

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US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
US8203420B2 (en) * 2009-06-26 2012-06-19 Cooper Technologies Company Subminiature fuse with surface mount end caps and improved connectivity
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US9553254B2 (en) 2011-03-01 2017-01-24 Parker-Hannifin Corporation Automated manufacturing processes for producing deformable polymer devices and films
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JP6294165B2 (ja) * 2014-06-19 2018-03-14 Koa株式会社 チップ型ヒューズ
CN104157518B (zh) * 2014-08-22 2016-09-21 Aem科技(苏州)股份有限公司 一种中空结构熔断器的制造方法
JP2017073373A (ja) * 2015-10-09 2017-04-13 デクセリアルズ株式会社 ヒューズ素子
WO2017061458A1 (ja) * 2015-10-09 2017-04-13 デクセリアルズ株式会社 ヒューズ素子
EP3179495B1 (en) * 2015-12-09 2018-05-02 ABB Schweiz AG Power capacitor unit for high pressure applications
US10141150B2 (en) * 2016-02-17 2018-11-27 Littelfuse, Inc. High current one-piece fuse element and split body
CN105551905B (zh) * 2016-02-18 2017-11-21 Aem科技(苏州)股份有限公司 一种悬空熔丝型表面贴装熔断器及其制备方法
JP6452001B2 (ja) * 2016-06-08 2019-01-16 株式会社村田製作所 電子装置、及び電子装置の製造方法
WO2019032358A1 (en) 2017-08-07 2019-02-14 Deputy Synthes Products, Inc MOLDED SECURE REINFORCED SPOOL ASSEMBLY
WO2020135914A1 (de) * 2018-12-27 2020-07-02 Schurter Ag Schmelzsicherung
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
US11217415B2 (en) * 2019-09-25 2022-01-04 Littelfuse, Inc. High breaking capacity chip fuse
US11807770B2 (en) * 2020-06-15 2023-11-07 Littelfuse, Inc. Thin film coating packaging for device having meltable and wetting links
JP7501425B2 (ja) * 2021-03-30 2024-06-18 株式会社オートネットワーク技術研究所 ヒューズ素子
WO2023075200A1 (ko) 2021-10-28 2023-05-04 주식회사 엘지에너지솔루션 패턴 퓨즈 및 이의 제조방법
US12002643B2 (en) * 2021-11-30 2024-06-04 Eaton Intelligent Power Limited Ceramic printed fuse fabrication

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