JP1730204S - Target Profile for Physical Vapor Deposition Chamber Targets - Google Patents

Target Profile for Physical Vapor Deposition Chamber Targets

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Publication number
JP1730204S
JP1730204S JP2022009480F JP2022009480F JP1730204S JP 1730204 S JP1730204 S JP 1730204S JP 2022009480 F JP2022009480 F JP 2022009480F JP 2022009480 F JP2022009480 F JP 2022009480F JP 1730204 S JP1730204 S JP 1730204S
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targets
vapor deposition
physical vapor
deposition chamber
target profile
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JP2022009480F 2021-05-07 2021-11-08 Target Profile for Physical Vapor Deposition Chamber Targets Active JP1730204S (en)

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US29/782,632 USD1007449S1 (en) 2021-05-07 2021-05-07 Target profile for a physical vapor deposition chamber target

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JP1730204S true JP1730204S (en) 2022-11-18

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JP (2) JP1718363S (en)
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USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

Family Cites Families (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
AU129071S (en) * 1996-06-07 1997-01-14 Riteflite Pty Ltd Target
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
USD423026S (en) 1997-08-20 2000-04-18 Tokyo Electron Limited Quartz cover
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (en) 1999-11-09 2004-08-11 信越化学工業株式会社 Silicon focus ring and manufacturing method thereof
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
USD446231S1 (en) 2000-08-21 2001-08-07 Komatsu Industries Corporation Nozzle for a plasma arc torch
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
EP1573084B1 (en) 2002-12-16 2006-09-20 iFire Technology Corp. Composite sputter target and phosphor deposition method
USD496951S1 (en) 2003-01-30 2004-10-05 Thermal Dynamics Corporation Mechanized cap for a plasma arc torch
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
JP4744855B2 (en) 2003-12-26 2011-08-10 日本碍子株式会社 Electrostatic chuck
US7648579B2 (en) 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD559066S1 (en) 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD572733S1 (en) 2005-07-29 2008-07-08 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571833S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of plasma processing apparatus
USD571383S1 (en) 2005-07-29 2008-06-17 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD571831S1 (en) 2005-07-29 2008-06-24 Tokyo Electron Limited Top panel for microwave introduction window of a plasma processing apparatus
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
USD545852S1 (en) 2006-03-30 2007-07-03 Dave Hawley Plasma gun with angled feed couplings
USD570310S1 (en) 2006-08-01 2008-06-03 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
USD582949S1 (en) 2006-12-15 2008-12-16 Tokyo Electron Limited Cover for a heater stage of a plasma processing apparatus
US20080173541A1 (en) 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
KR20200067957A (en) 2008-04-16 2020-06-12 어플라이드 머티어리얼스, 인코포레이티드 Wafer processing deposition shielding components
KR101337306B1 (en) 2008-04-21 2013-12-09 허니웰 인터내셔널 인코포레이티드 Design and Use of DC Magnetron Sputtering Systems
USD614593S1 (en) 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US8371904B2 (en) 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD616389S1 (en) 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (en) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
KR101892911B1 (en) 2010-08-06 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 Electrostatic chuck and methods of use thereof
TWD146490S (en) 2011-01-12 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD678745S1 (en) 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
JP1438319S (en) 2011-09-20 2015-04-06
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD691974S1 (en) 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
KR20130131120A (en) 2012-05-23 2013-12-03 삼성전자주식회사 A flexible membrane for polishing head
JP5875950B2 (en) 2012-06-29 2016-03-02 株式会社荏原製作所 Substrate holding device and polishing device
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US9475996B2 (en) 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
CN105008582A (en) * 2013-01-04 2015-10-28 东曹Smd有限公司 Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
FR3002241B1 (en) 2013-02-21 2015-11-20 Altatech Semiconductor CHEMICAL VAPOR DEPOSITION DEVICE
FR3002242B1 (en) 2013-02-21 2015-04-03 Altatech Semiconductor CHEMICAL VAPOR DEPOSITION DEVICE
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD169790S (en) 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
USD754468S1 (en) * 2013-07-23 2016-04-26 Michael F. Nason Disposable splatter shield
USD716742S1 (en) 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
USD741921S1 (en) 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
WO2016018505A1 (en) 2014-07-29 2016-02-04 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1545222S (en) 2015-06-10 2016-03-07
JP1546800S (en) 2015-06-12 2016-03-28
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1549882S (en) 2015-08-18 2016-05-23
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD830434S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178699S (en) * 2016-01-08 2016-10-01 Asm Ip Holding Bv Gas dispersing plate for semiconductor manufacturing apparatus
TWD178424S (en) 2016-01-08 2016-09-21 Asm Ip Holding Bv Gas flow control plate for semiconductor manufacturing apparatus
USD790039S1 (en) 2016-04-08 2017-06-20 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD794753S1 (en) 2016-04-08 2017-08-15 Applied Materials, Inc. Showerhead for a semiconductor processing chamber
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD804230S1 (en) * 2016-06-23 2017-12-05 Cbd Consolidated Llc Bench top gripping device
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
US10662520B2 (en) 2017-03-29 2020-05-26 Applied Materials, Inc. Method for recycling substrate process components
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10811232B2 (en) 2017-08-08 2020-10-20 Applied Materials, Inc. Multi-plate faceplate for a processing chamber
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD197827S (en) 2017-12-19 2019-06-01 日商荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD846514S1 (en) 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD891382S1 (en) 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD223375S (en) * 2021-03-29 2023-02-01 大陸商北京北方華創微電子裝備有限公司 Electrostatic chuck
JP1716558S (en) 2021-11-25 2022-06-02 Individual wrapping bag wrapping bag
JP1716516S (en) 2021-11-25 2022-06-02 Packaging bag

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JP1718363S (en) 2022-06-28
USD1007449S1 (en) 2023-12-12
TWD226530S (en) 2023-07-21

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