IL156619A0 - Semiconductor device and its manufacturing method - Google Patents
Semiconductor device and its manufacturing methodInfo
- Publication number
- IL156619A0 IL156619A0 IL15661901A IL15661901A IL156619A0 IL 156619 A0 IL156619 A0 IL 156619A0 IL 15661901 A IL15661901 A IL 15661901A IL 15661901 A IL15661901 A IL 15661901A IL 156619 A0 IL156619 A0 IL 156619A0
- Authority
- IL
- Israel
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
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- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28202—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
- H10B41/42—Simultaneous manufacture of periphery and memory cells
- H10B41/49—Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Non-Volatile Memory (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2000402834 | 2000-12-28 | ||
JP2001094245A JP4713752B2 (ja) | 2000-12-28 | 2001-03-28 | 半導体装置およびその製造方法 |
PCT/JP2001/011597 WO2002054473A1 (fr) | 2000-12-28 | 2001-12-27 | Dispositif à semi-conducteurs et son procédé de fabrication |
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IL156619A0 true IL156619A0 (en) | 2004-01-04 |
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IL15661901A IL156619A0 (en) | 2000-12-28 | 2001-12-27 | Semiconductor device and its manufacturing method |
IL181060A IL181060A (en) | 2000-12-28 | 2007-01-30 | Method for manufacturing a semiconductor device |
Family Applications After (1)
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IL181060A IL181060A (en) | 2000-12-28 | 2007-01-30 | Method for manufacturing a semiconductor device |
Country Status (10)
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US (2) | US6975018B2 (ja) |
EP (1) | EP1347506A4 (ja) |
JP (1) | JP4713752B2 (ja) |
KR (2) | KR100797432B1 (ja) |
CN (1) | CN100352016C (ja) |
AU (1) | AU2002217545B2 (ja) |
CA (1) | CA2433565C (ja) |
IL (2) | IL156619A0 (ja) |
TW (2) | TW587273B (ja) |
WO (1) | WO2002054473A1 (ja) |
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EP1879213B1 (en) * | 1999-05-26 | 2012-03-14 | Tokyo Electron Limited | Plasma processing apparatus |
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JP4048048B2 (ja) * | 2001-12-18 | 2008-02-13 | 東京エレクトロン株式会社 | 基板処理方法 |
US7517751B2 (en) | 2001-12-18 | 2009-04-14 | Tokyo Electron Limited | Substrate treating method |
JP4164324B2 (ja) * | 2002-09-19 | 2008-10-15 | スパンション エルエルシー | 半導体装置の製造方法 |
JP4320167B2 (ja) | 2002-12-12 | 2009-08-26 | 忠弘 大見 | 半導体素子及びシリコン酸化窒化膜の製造方法 |
CN100429753C (zh) | 2003-02-06 | 2008-10-29 | 东京毅力科创株式会社 | 等离子体处理方法、半导体基板以及等离子体处理装置 |
JP2004265916A (ja) * | 2003-02-06 | 2004-09-24 | Tokyo Electron Ltd | 基板のプラズマ酸化処理方法 |
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JP4723797B2 (ja) * | 2003-06-13 | 2011-07-13 | 財団法人国際科学振興財団 | Cmosトランジスタ |
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-
2001
- 2001-03-28 JP JP2001094245A patent/JP4713752B2/ja not_active Expired - Fee Related
- 2001-12-27 IL IL15661901A patent/IL156619A0/xx not_active IP Right Cessation
- 2001-12-27 CA CA002433565A patent/CA2433565C/en not_active Expired - Fee Related
- 2001-12-27 US US10/452,000 patent/US6975018B2/en not_active Expired - Lifetime
- 2001-12-27 WO PCT/JP2001/011597 patent/WO2002054473A1/ja active Application Filing
- 2001-12-27 KR KR1020067011455A patent/KR100797432B1/ko not_active IP Right Cessation
- 2001-12-27 CN CNB018215378A patent/CN100352016C/zh not_active Expired - Fee Related
- 2001-12-27 TW TW090132522A patent/TW587273B/zh not_active IP Right Cessation
- 2001-12-27 EP EP01272543A patent/EP1347506A4/en not_active Withdrawn
- 2001-12-27 AU AU2002217545A patent/AU2002217545B2/en not_active Ceased
- 2001-12-27 TW TW092125032A patent/TWI249182B/zh not_active IP Right Cessation
- 2001-12-27 KR KR1020037008861A patent/KR100662310B1/ko not_active IP Right Cessation
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2005
- 2005-08-01 US US11/193,390 patent/US20050272266A1/en not_active Abandoned
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2007
- 2007-01-30 IL IL181060A patent/IL181060A/en not_active IP Right Cessation
Also Published As
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CN100352016C (zh) | 2007-11-28 |
CA2433565A1 (en) | 2002-07-11 |
US20040102052A1 (en) | 2004-05-27 |
EP1347506A1 (en) | 2003-09-24 |
JP2002261091A (ja) | 2002-09-13 |
KR100662310B1 (ko) | 2006-12-28 |
KR20030068570A (ko) | 2003-08-21 |
CN1592957A (zh) | 2005-03-09 |
KR100797432B1 (ko) | 2008-01-23 |
KR20060083232A (ko) | 2006-07-20 |
IL181060A (en) | 2011-03-31 |
US6975018B2 (en) | 2005-12-13 |
JP4713752B2 (ja) | 2011-06-29 |
AU2002217545B2 (en) | 2005-03-17 |
IL181060A0 (en) | 2007-07-04 |
TWI249182B (en) | 2006-02-11 |
CA2433565C (en) | 2008-04-08 |
TW200404332A (en) | 2004-03-16 |
TW587273B (en) | 2004-05-11 |
US20050272266A1 (en) | 2005-12-08 |
WO2002054473A1 (fr) | 2002-07-11 |
EP1347506A4 (en) | 2005-04-20 |
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