IL139546A - Silicate-containing alkaline compositions for cleaning microelectronic substrates - Google Patents
Silicate-containing alkaline compositions for cleaning microelectronic substratesInfo
- Publication number
- IL139546A IL139546A IL13954699A IL13954699A IL139546A IL 139546 A IL139546 A IL 139546A IL 13954699 A IL13954699 A IL 13954699A IL 13954699 A IL13954699 A IL 13954699A IL 139546 A IL139546 A IL 139546A
- Authority
- IL
- Israel
- Prior art keywords
- optionally
- weight
- water
- silicate
- alkaline compositions
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 title abstract 2
- 238000004140 cleaning Methods 0.000 title abstract 2
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000002738 chelating agent Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/08—Silicates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/364—Organic compounds containing phosphorus containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/22—Light metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8586198P | 1998-05-18 | 1998-05-18 | |
US11508499P | 1999-01-07 | 1999-01-07 | |
PCT/US1999/010875 WO1999060448A1 (fr) | 1998-05-18 | 1999-05-17 | Compositions alcalines a base de silicate pour le nettoyage de substrats en micro-electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
IL139546A0 IL139546A0 (en) | 2002-02-10 |
IL139546A true IL139546A (en) | 2005-08-31 |
Family
ID=26773172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL13954699A IL139546A (en) | 1998-05-18 | 1999-05-17 | Silicate-containing alkaline compositions for cleaning microelectronic substrates |
Country Status (17)
Country | Link |
---|---|
US (2) | US6465403B1 (fr) |
EP (1) | EP1105778B1 (fr) |
KR (1) | KR100610387B1 (fr) |
CN (1) | CN100370360C (fr) |
AT (1) | ATE436043T1 (fr) |
AU (1) | AU4189599A (fr) |
CA (1) | CA2330747C (fr) |
DE (1) | DE69941088D1 (fr) |
DK (1) | DK1105778T3 (fr) |
ES (1) | ES2328309T3 (fr) |
HK (1) | HK1039806B (fr) |
IL (1) | IL139546A (fr) |
MX (1) | MXPA00011391A (fr) |
MY (1) | MY121446A (fr) |
PT (1) | PT1105778E (fr) |
TW (1) | TWI226520B (fr) |
WO (1) | WO1999060448A1 (fr) |
Families Citing this family (153)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6755989B2 (en) * | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
DE69941088D1 (de) | 1998-05-18 | 2009-08-20 | Mallinckrodt Baker Inc | Alkalische, silikat enthaltende reinigungslösungen für mikroelektronische substrate |
US6348239B1 (en) * | 2000-04-28 | 2002-02-19 | Simon Fraser University | Method for depositing metal and metal oxide films and patterned films |
US7579308B2 (en) * | 1998-07-06 | 2009-08-25 | Ekc/Dupont Electronics Technologies | Compositions and processes for photoresist stripping and residue removal in wafer level packaging |
US7135445B2 (en) * | 2001-12-04 | 2006-11-14 | Ekc Technology, Inc. | Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials |
US6436300B2 (en) * | 1998-07-30 | 2002-08-20 | Motorola, Inc. | Method of manufacturing electronic components |
US7064070B2 (en) * | 1998-09-28 | 2006-06-20 | Tokyo Electron Limited | Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process |
TW467953B (en) * | 1998-11-12 | 2001-12-11 | Mitsubishi Gas Chemical Co | New detergent and cleaning method of using it |
US7129199B2 (en) | 2002-08-12 | 2006-10-31 | Air Products And Chemicals, Inc. | Process solutions containing surfactants |
US7208049B2 (en) * | 2003-10-20 | 2007-04-24 | Air Products And Chemicals, Inc. | Process solutions containing surfactants used as post-chemical mechanical planarization treatment |
US7521405B2 (en) | 2002-08-12 | 2009-04-21 | Air Products And Chemicals, Inc. | Process solutions containing surfactants |
US20040029395A1 (en) * | 2002-08-12 | 2004-02-12 | Peng Zhang | Process solutions containing acetylenic diol surfactants |
US7348300B2 (en) * | 1999-05-04 | 2008-03-25 | Air Products And Chemicals, Inc. | Acetylenic diol ethylene oxide/propylene oxide adducts and processes for their manufacture |
US6492308B1 (en) * | 1999-11-16 | 2002-12-10 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
TW558736B (en) | 2000-02-26 | 2003-10-21 | Shipley Co Llc | Method of reducing defects |
MY129673A (en) | 2000-03-20 | 2007-04-30 | Avantor Performance Mat Inc | Method and composition for removing sodium-containing material from microcircuit substrates |
US6899818B2 (en) * | 2000-03-20 | 2005-05-31 | Mallinckrodt Inc. | Method and composition for removing sodium-containing material from microcircuit substrates |
BR0003706A (pt) * | 2000-05-30 | 2002-02-13 | Tecsis Tecnologia E Sist S Ava | Pá para ventilador axial de baixo ruìdo e alta eficiência |
KR100363271B1 (ko) * | 2000-06-12 | 2002-12-05 | 주식회사 동진쎄미켐 | 포토레지스트 리무버 조성물 |
EP1310989B1 (fr) * | 2000-06-16 | 2005-12-14 | Kao Corporation | Composition detergente |
US6310019B1 (en) * | 2000-07-05 | 2001-10-30 | Wako Pure Chemical Industries, Ltd. | Cleaning agent for a semi-conductor substrate |
US6498131B1 (en) * | 2000-08-07 | 2002-12-24 | Ekc Technology, Inc. | Composition for cleaning chemical mechanical planarization apparatus |
US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
TW554258B (en) * | 2000-11-30 | 2003-09-21 | Tosoh Corp | Resist stripper |
JP4572466B2 (ja) * | 2000-12-27 | 2010-11-04 | 東ソー株式会社 | レジスト剥離剤 |
JP2002318455A (ja) * | 2001-04-23 | 2002-10-31 | Tosoh Corp | 安定化方法 |
JP4015823B2 (ja) | 2001-05-14 | 2007-11-28 | 株式会社東芝 | アルカリ現像液の製造方法,アルカリ現像液,パターン形成方法,レジスト膜の剥離方法,及び薬液塗布装置 |
MY139607A (en) | 2001-07-09 | 2009-10-30 | Avantor Performance Mat Inc | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
MY131912A (en) * | 2001-07-09 | 2007-09-28 | Avantor Performance Mat Inc | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
MY143399A (en) | 2001-07-09 | 2011-05-13 | Avantor Performance Mat Inc | Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning |
TWI276682B (en) * | 2001-11-16 | 2007-03-21 | Mitsubishi Chem Corp | Substrate surface cleaning liquid mediums and cleaning method |
KR100449054B1 (ko) * | 2001-12-22 | 2004-09-16 | 주식회사 동진쎄미켐 | 선택비를 향상시킨 화학 기계적 연마 슬러리 조성물 및이를 이용한 반도체 소자의 평탄화 방법 |
US20030148624A1 (en) * | 2002-01-31 | 2003-08-07 | Kazuto Ikemoto | Method for removing resists |
AU2003225178A1 (en) * | 2002-04-24 | 2003-11-10 | Ekc Technology, Inc. | Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces |
BR0311827A (pt) * | 2002-06-07 | 2005-03-29 | Mallinckrodt Baker Inc | Composições de limpeza microeletrÈnicas contendo oxidantes e solventes orgânicos |
US7393819B2 (en) | 2002-07-08 | 2008-07-01 | Mallinckrodt Baker, Inc. | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
JP4086567B2 (ja) * | 2002-07-10 | 2008-05-14 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
US6905974B2 (en) * | 2002-08-08 | 2005-06-14 | Micron Technology, Inc. | Methods using a peroxide-generating compound to remove group VIII metal-containing residue |
US7077975B2 (en) * | 2002-08-08 | 2006-07-18 | Micron Technology, Inc. | Methods and compositions for removing group VIII metal-containing materials from surfaces |
JP4282054B2 (ja) * | 2002-09-09 | 2009-06-17 | 東京応化工業株式会社 | デュアルダマシン構造形成プロセスに用いられる洗浄液および基板の処理方法 |
KR20050084917A (ko) * | 2002-10-22 | 2005-08-29 | 이케이씨 테크놀로지, 인코포레이티드 | 반도체 장치 세정용 수성 인산 조성물 |
US7524771B2 (en) * | 2002-10-29 | 2009-04-28 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing method using alkaline solution and acid solution |
US7276454B2 (en) * | 2002-11-02 | 2007-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
ATE521692T1 (de) * | 2002-11-05 | 2011-09-15 | Basf Se | Halbleiteroberflächenbehandlung und dabei verwendete mischung |
JP4752270B2 (ja) * | 2002-11-08 | 2011-08-17 | 和光純薬工業株式会社 | 洗浄液及びそれを用いた洗浄方法 |
US8236485B2 (en) | 2002-12-20 | 2012-08-07 | Advanced Technology Materials, Inc. | Photoresist removal |
KR100835606B1 (ko) * | 2002-12-30 | 2008-06-09 | 엘지디스플레이 주식회사 | 구리용 레지스트 제거용 조성물 |
US7235517B2 (en) * | 2002-12-31 | 2007-06-26 | 3M Innovative Properties Company | Degreasing compositions |
US20040157759A1 (en) * | 2003-02-07 | 2004-08-12 | Buckeye International, Inc. | Stripper formulations and process |
KR100634164B1 (ko) * | 2003-03-13 | 2006-10-16 | 삼성전자주식회사 | 반도체 제조 공정에 사용되는 세정액 |
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- 1999-05-17 DE DE69941088T patent/DE69941088D1/de not_active Expired - Lifetime
- 1999-05-17 US US09/701,114 patent/US6465403B1/en not_active Expired - Lifetime
- 1999-05-17 AT AT99925649T patent/ATE436043T1/de active
- 1999-05-17 KR KR1020007012953A patent/KR100610387B1/ko not_active IP Right Cessation
- 1999-05-17 WO PCT/US1999/010875 patent/WO1999060448A1/fr active IP Right Grant
- 1999-05-17 PT PT99925649T patent/PT1105778E/pt unknown
- 1999-05-17 EP EP99925649A patent/EP1105778B1/fr not_active Expired - Lifetime
- 1999-05-17 MX MXPA00011391A patent/MXPA00011391A/es not_active IP Right Cessation
- 1999-05-17 CA CA2330747A patent/CA2330747C/fr not_active Expired - Fee Related
- 1999-05-17 ES ES99925649T patent/ES2328309T3/es not_active Expired - Lifetime
- 1999-05-17 AU AU41895/99A patent/AU4189599A/en not_active Abandoned
- 1999-05-17 DK DK99925649T patent/DK1105778T3/da active
- 1999-05-17 CN CNB998088013A patent/CN100370360C/zh not_active Expired - Lifetime
- 1999-05-17 IL IL13954699A patent/IL139546A/xx not_active IP Right Cessation
- 1999-05-18 TW TW088108110A patent/TWI226520B/zh not_active IP Right Cessation
- 1999-05-18 MY MYPI99001939A patent/MY121446A/en unknown
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2000
- 2000-10-16 US US09/688,559 patent/US6585825B1/en not_active Expired - Lifetime
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IL139546A0 (en) | 2002-02-10 |
AU4189599A (en) | 1999-12-06 |
CN100370360C (zh) | 2008-02-20 |
DE69941088D1 (de) | 2009-08-20 |
KR20010034866A (ko) | 2001-04-25 |
KR100610387B1 (ko) | 2006-08-09 |
PT1105778E (pt) | 2009-09-23 |
CA2330747C (fr) | 2010-07-27 |
MXPA00011391A (es) | 2005-06-20 |
ES2328309T3 (es) | 2009-11-11 |
TWI226520B (en) | 2005-01-11 |
US6585825B1 (en) | 2003-07-01 |
US6465403B1 (en) | 2002-10-15 |
CA2330747A1 (fr) | 1999-11-25 |
DK1105778T3 (da) | 2009-10-19 |
WO1999060448A8 (fr) | 1999-12-29 |
EP1105778B1 (fr) | 2009-07-08 |
WO1999060448A1 (fr) | 1999-11-25 |
HK1039806B (zh) | 2008-12-19 |
CN1309785A (zh) | 2001-08-22 |
EP1105778A1 (fr) | 2001-06-13 |
HK1039806A1 (en) | 2002-05-10 |
MY121446A (en) | 2006-01-28 |
ATE436043T1 (de) | 2009-07-15 |
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