HK1147567A1 - Substrate processing method, exposure apparatus and method for manufacturing device - Google Patents

Substrate processing method, exposure apparatus and method for manufacturing device

Info

Publication number
HK1147567A1
HK1147567A1 HK11101666.8A HK11101666A HK1147567A1 HK 1147567 A1 HK1147567 A1 HK 1147567A1 HK 11101666 A HK11101666 A HK 11101666A HK 1147567 A1 HK1147567 A1 HK 1147567A1
Authority
HK
Hong Kong
Prior art keywords
substrate processing
exposure apparatus
substrate
processing method
manufacturing device
Prior art date
Application number
HK11101666.8A
Other languages
English (en)
Inventor
Katsushi Nakano
Masahiko Okumura
Tarou Sugihara
Takeyuki Mizutani
Tomoharu Fujiwara
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1147567A1 publication Critical patent/HK1147567A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK11101666.8A 2004-10-26 2011-02-18 Substrate processing method, exposure apparatus and method for manufacturing device HK1147567A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004310993 2004-10-26

Publications (1)

Publication Number Publication Date
HK1147567A1 true HK1147567A1 (en) 2011-08-12

Family

ID=36227803

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11101666.8A HK1147567A1 (en) 2004-10-26 2011-02-18 Substrate processing method, exposure apparatus and method for manufacturing device

Country Status (8)

Country Link
US (3) US8040489B2 (de)
EP (1) EP1814144B1 (de)
JP (2) JP4665712B2 (de)
KR (2) KR101285951B1 (de)
CN (2) CN101044594B (de)
HK (1) HK1147567A1 (de)
TW (1) TWI436403B (de)
WO (1) WO2006046562A1 (de)

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NL2008845A (en) * 2011-05-24 2012-11-27 Asml Netherlands Bv Lithographic apparatus and component.
KR102625921B1 (ko) * 2015-05-28 2024-01-16 가부시키가이샤 니콘 물체 유지 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
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CN107561747A (zh) * 2017-10-12 2018-01-09 惠科股份有限公司 一种显示基板的预烘烤装置及预烘烤系统
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KR20070068341A (ko) 2007-06-29
US20080143980A1 (en) 2008-06-19
CN101866113A (zh) 2010-10-20
JP2010177693A (ja) 2010-08-12
US20120008112A1 (en) 2012-01-12
KR101236120B1 (ko) 2013-02-28
EP1814144A4 (de) 2010-01-06
US20080246931A1 (en) 2008-10-09
CN101044594B (zh) 2010-05-12
TW200631073A (en) 2006-09-01
KR20120075497A (ko) 2012-07-06
US8941808B2 (en) 2015-01-27
JP5408006B2 (ja) 2014-02-05
US8040489B2 (en) 2011-10-18
KR101285951B1 (ko) 2013-07-12
EP1814144A1 (de) 2007-08-01
CN101866113B (zh) 2013-04-24
CN101044594A (zh) 2007-09-26
JP2006156974A (ja) 2006-06-15
EP1814144B1 (de) 2012-06-06
WO2006046562A1 (ja) 2006-05-04
TWI436403B (zh) 2014-05-01
JP4665712B2 (ja) 2011-04-06

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