HK1116208A1 - Silicone composition for encapsulating luminescent element and luminescent device - Google Patents
Silicone composition for encapsulating luminescent element and luminescent deviceInfo
- Publication number
- HK1116208A1 HK1116208A1 HK08106451A HK08106451A HK1116208A1 HK 1116208 A1 HK1116208 A1 HK 1116208A1 HK 08106451 A HK08106451 A HK 08106451A HK 08106451 A HK08106451 A HK 08106451A HK 1116208 A1 HK1116208 A1 HK 1116208A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sio
- vinyl group
- bonded
- silicon atom
- amount
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 3
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 2
- 229910004283 SiO 4 Inorganic materials 0.000 abstract 1
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 230000003197 catalytic effect Effects 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005015263 | 2005-01-24 | ||
PCT/JP2005/013451 WO2006077667A1 (ja) | 2005-01-24 | 2005-07-22 | 発光素子封止用シリコーン組成物及び発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1116208A1 true HK1116208A1 (en) | 2008-12-19 |
Family
ID=36692063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08106451A HK1116208A1 (en) | 2005-01-24 | 2008-06-11 | Silicone composition for encapsulating luminescent element and luminescent device |
Country Status (8)
Country | Link |
---|---|
US (2) | US8293849B2 (ja) |
EP (2) | EP1845133B1 (ja) |
JP (2) | JP5705396B2 (ja) |
KR (1) | KR101158955B1 (ja) |
CN (1) | CN101107324B (ja) |
HK (1) | HK1116208A1 (ja) |
TW (1) | TWI277635B (ja) |
WO (1) | WO2006077667A1 (ja) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5247979B2 (ja) * | 2005-06-01 | 2013-07-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 透明な硬化物を与えるポリオルガノシロキサン組成物 |
JP2007063538A (ja) * | 2005-08-03 | 2007-03-15 | Shin Etsu Chem Co Ltd | 発光ダイオード用付加硬化型シリコーン樹脂組成物 |
JP2007246880A (ja) * | 2006-02-20 | 2007-09-27 | Matsushita Electric Works Ltd | 半導体光装置及び透明光学部材 |
US8129480B2 (en) * | 2006-10-19 | 2012-03-06 | Momentive Performance Materials Japan Llc | Curable polyorganosiloxane composition |
JP2008115302A (ja) * | 2006-11-06 | 2008-05-22 | Kaneka Corp | シリコーン系重合体粒子を含有する光学材料用シリコーン系組成物 |
JP5210881B2 (ja) * | 2006-11-27 | 2013-06-12 | パナソニック株式会社 | 半導体光装置及び透明光学部材 |
WO2008065787A1 (en) * | 2006-11-27 | 2008-06-05 | Panasonic Electric Works Co., Ltd. | Optical semiconductor device and transparent optical member |
JP5210880B2 (ja) * | 2006-11-27 | 2013-06-12 | パナソニック株式会社 | 半導体光装置及び透明光学部材 |
WO2008065786A1 (fr) * | 2006-11-27 | 2008-06-05 | Panasonic Electric Works Co., Ltd. | Dispositif optique à semiconducteur et élément optique transparent |
CN101663358B (zh) * | 2007-02-07 | 2016-10-26 | 道康宁东丽株式会社 | 海绵形成用液体硅橡胶组合物以及由其制得的硅橡胶海绵 |
JP2008222828A (ja) * | 2007-03-12 | 2008-09-25 | Momentive Performance Materials Japan Kk | 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置 |
TWI458780B (zh) | 2007-07-31 | 2014-11-01 | Dow Corning Toray Co Ltd | 提供高透明矽酮硬化物之硬化性矽酮組合物 |
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US20100289055A1 (en) * | 2009-05-14 | 2010-11-18 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Silicone leaded chip carrier |
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JP7014745B2 (ja) * | 2019-01-29 | 2022-02-01 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物及び光学素子 |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62232460A (ja) | 1986-04-01 | 1987-10-12 | Toray Silicone Co Ltd | 熱硬化性樹脂組成物 |
JP3270489B2 (ja) | 1991-01-30 | 2002-04-02 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物 |
US5717010A (en) * | 1992-01-23 | 1998-02-10 | General Electric Company | Low compression set silicone elastomers |
WO1994006862A1 (en) | 1992-09-21 | 1994-03-31 | Thermoset Plastics, Inc. | Thermoplastic modified, thermosetting polyester encapsulants for microelectronics |
GB9317813D0 (en) * | 1993-08-27 | 1993-10-13 | Dow Corning Sa | Silicone emulsion compositions |
JP3553632B2 (ja) * | 1994-03-16 | 2004-08-11 | ダウ コーニング アジア株式会社 | 硬化性オルガノポリシロキサン組成物 |
JP3615784B2 (ja) | 1994-04-21 | 2005-02-02 | ダウ コーニング アジア株式会社 | 光学素子用樹脂組成物及び光学素子 |
JPH1112470A (ja) * | 1997-06-25 | 1999-01-19 | Toray Dow Corning Silicone Co Ltd | 高電圧電気絶縁部品用液状シリコーンゴム組成物 |
US6124407A (en) * | 1998-10-28 | 2000-09-26 | Dow Corning Corporation | Silicone composition, method for the preparation thereof, and silicone elastomer |
US6262188B1 (en) | 1998-12-23 | 2001-07-17 | General Electric Company | Functionalized MQ resin as an adhesion enhancing additive |
JP3523098B2 (ja) | 1998-12-28 | 2004-04-26 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物 |
JP3595731B2 (ja) * | 1999-06-21 | 2004-12-02 | 信越化学工業株式会社 | 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置 |
JP2003515770A (ja) * | 1999-11-30 | 2003-05-07 | コーニング・オー・テー・イー・エス・ペー・アー | 光学装置の光ファイバ部品を固定する方法、これにより得られた光学装置、およびこの光学装置で用いられるポリマ組成物 |
WO2001081475A1 (fr) * | 2000-04-21 | 2001-11-01 | Kaneka Corporation | Composition durcissable, composition pour un materiau optique, materiau optique, affichage a cristaux liquides, film conducteur transparent et procede de production associe |
JP3910080B2 (ja) | 2001-02-23 | 2007-04-25 | 株式会社カネカ | 発光ダイオード |
JP4880837B2 (ja) * | 2001-09-05 | 2012-02-22 | 株式会社カネカ | 硬化性組成物および硬化物 |
JP2004002810A (ja) * | 2002-04-18 | 2004-01-08 | Kanegafuchi Chem Ind Co Ltd | 光学材料用硬化性組成物、光学用材料、光学用材料の製造方法および光学材料を用いた発光ダイオード |
JP4360595B2 (ja) * | 2002-10-18 | 2009-11-11 | ペルノックス株式会社 | 光電変換装置 |
JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
US20040138396A1 (en) | 2003-01-13 | 2004-07-15 | Gabriel Karim M. | Resins and diluents for use in single component low volatile organic |
US7160972B2 (en) * | 2003-02-19 | 2007-01-09 | Nusil Technology Llc | Optically clear high temperature resistant silicone polymers of high refractive index |
JP4766222B2 (ja) | 2003-03-12 | 2011-09-07 | 信越化学工業株式会社 | 発光半導体被覆保護材及び発光半導体装置 |
TW200427111A (en) * | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
JP2004323764A (ja) * | 2003-04-28 | 2004-11-18 | Ge Toshiba Silicones Co Ltd | 接着性ポリオルガノシロキサン組成物 |
JP2004359756A (ja) * | 2003-06-03 | 2004-12-24 | Wacker Asahikasei Silicone Co Ltd | Led用封止剤組成物 |
JP2005008657A (ja) * | 2003-06-16 | 2005-01-13 | Ge Toshiba Silicones Co Ltd | 低透湿性ポリオルガノシロキサン組成物 |
JP4586967B2 (ja) * | 2003-07-09 | 2010-11-24 | 信越化学工業株式会社 | 発光半導体被覆保護材及び発光半導体装置 |
TWI373150B (en) * | 2003-07-09 | 2012-09-21 | Shinetsu Chemical Co | Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device |
US7287573B2 (en) * | 2003-09-30 | 2007-10-30 | General Electric Company | Silicone binders for investment casting |
KR100603247B1 (ko) * | 2003-12-31 | 2006-07-20 | 동부일렉트로닉스 주식회사 | 시모스 이미지 센서 및 그 제조방법 |
JP2006137895A (ja) * | 2004-11-15 | 2006-06-01 | Ge Toshiba Silicones Co Ltd | 光学材料用ポリオルガノシロキサン組成物 |
-
2005
- 2005-07-22 KR KR1020077016713A patent/KR101158955B1/ko active IP Right Grant
- 2005-07-22 CN CN2005800471634A patent/CN101107324B/zh active Active
- 2005-07-22 US US11/795,603 patent/US8293849B2/en active Active
- 2005-07-22 EP EP05766435.1A patent/EP1845133B1/en not_active Revoked
- 2005-07-22 JP JP2006553818A patent/JP5705396B2/ja active Active
- 2005-07-22 WO PCT/JP2005/013451 patent/WO2006077667A1/ja active Application Filing
- 2005-07-22 EP EP15179426.0A patent/EP2955206A1/en not_active Withdrawn
- 2005-07-26 TW TW94125303A patent/TWI277635B/zh not_active IP Right Cessation
-
2008
- 2008-06-11 HK HK08106451A patent/HK1116208A1/xx not_active IP Right Cessation
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2012
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Also Published As
Publication number | Publication date |
---|---|
KR20070097075A (ko) | 2007-10-02 |
CN101107324B (zh) | 2012-02-01 |
US20120306363A1 (en) | 2012-12-06 |
KR101158955B1 (ko) | 2012-06-21 |
EP1845133A4 (en) | 2011-11-30 |
US8637628B2 (en) | 2014-01-28 |
WO2006077667A1 (ja) | 2006-07-27 |
CN101107324A (zh) | 2008-01-16 |
EP2955206A1 (en) | 2015-12-16 |
JP5638714B2 (ja) | 2014-12-10 |
EP1845133B1 (en) | 2015-10-14 |
TW200626677A (en) | 2006-08-01 |
US20080160322A1 (en) | 2008-07-03 |
JPWO2006077667A1 (ja) | 2008-06-19 |
JP5705396B2 (ja) | 2015-04-22 |
US8293849B2 (en) | 2012-10-23 |
EP1845133A1 (en) | 2007-10-17 |
TWI277635B (en) | 2007-04-01 |
JP2014168060A (ja) | 2014-09-11 |
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