HK1057654A1 - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
HK1057654A1
HK1057654A1 HK04100396A HK04100396A HK1057654A1 HK 1057654 A1 HK1057654 A1 HK 1057654A1 HK 04100396 A HK04100396 A HK 04100396A HK 04100396 A HK04100396 A HK 04100396A HK 1057654 A1 HK1057654 A1 HK 1057654A1
Authority
HK
Hong Kong
Prior art keywords
lead frame
semiconductor laser
width
resin
laser device
Prior art date
Application number
HK04100396A
Other languages
English (en)
Inventor
Shoji Honda
Yasuhiro Watanabe
Yasuyuki Bessho
Kentarou Tanaka
Original Assignee
Sanyo Electric Co
Tokyo Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000216162A external-priority patent/JP3723424B2/ja
Priority claimed from JP2000219167A external-priority patent/JP3973348B2/ja
Priority claimed from JP2000225603A external-priority patent/JP3723425B2/ja
Priority claimed from JP2000225602A external-priority patent/JP3806586B2/ja
Priority claimed from JP2000229298A external-priority patent/JP3723426B2/ja
Application filed by Sanyo Electric Co, Tokyo Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of HK1057654A1 publication Critical patent/HK1057654A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
HK04100396A 2000-07-17 2004-01-19 Semiconductor laser device HK1057654A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000216162A JP3723424B2 (ja) 2000-07-17 2000-07-17 レーザ装置
JP2000219167A JP3973348B2 (ja) 2000-07-19 2000-07-19 レーザ装置及びその製造方法
JP2000225603A JP3723425B2 (ja) 2000-07-26 2000-07-26 半導体レーザ装置
JP2000225602A JP3806586B2 (ja) 2000-07-26 2000-07-26 半導体レーザ装置
JP2000229298A JP3723426B2 (ja) 2000-07-28 2000-07-28 半導体レーザ装置
PCT/JP2001/005340 WO2002007275A1 (fr) 2000-07-17 2001-06-21 Dispositif laser a semi-conducteur

Publications (1)

Publication Number Publication Date
HK1057654A1 true HK1057654A1 (en) 2004-04-08

Family

ID=27531607

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04100396A HK1057654A1 (en) 2000-07-17 2004-01-19 Semiconductor laser device

Country Status (7)

Country Link
US (1) US6885076B2 (xx)
EP (1) EP1313184B1 (xx)
KR (1) KR100542336B1 (xx)
CN (1) CN1258252C (xx)
DE (1) DE60129991T2 (xx)
HK (1) HK1057654A1 (xx)
WO (1) WO2002007275A1 (xx)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623379B2 (en) 2000-03-02 2014-01-07 Emory University Compositions and methods for generating an immune response
JP3737769B2 (ja) 2002-03-28 2006-01-25 株式会社東芝 半導体レーザ装置
DE10221857A1 (de) 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
US6683370B1 (en) * 2003-04-15 2004-01-27 Motorola, Inc. Semiconductor component and method of manufacturing same
JP4031748B2 (ja) * 2003-10-06 2008-01-09 ローム株式会社 半導体レーザ
JP4372508B2 (ja) * 2003-10-06 2009-11-25 ローム株式会社 リードフレームの製造方法およびそれを用いた半導体装置の製造方法、ならびに半導体装置ならびにそれを備えた携帯機器および電子装置
WO2005039000A1 (ja) 2003-10-15 2005-04-28 Sanyo Electric Co., Ltd 半導体レーザ装置
JP4033883B2 (ja) * 2003-10-15 2008-01-16 三洋電機株式会社 ２ビーム半導体レーザ装置
JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
JP2006024812A (ja) * 2004-07-09 2006-01-26 Sony Corp 半導体素子搭載のリードフレームとそれを用いた半導体装置
US9453239B2 (en) 2004-08-27 2016-09-27 Emory University Recombinant MVA viruses expressing clade A/G, clade B, and clade C modified HIV env, gag and pol genes
US7211882B2 (en) * 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
CN100391063C (zh) * 2005-06-06 2008-05-28 东贝光电科技股份有限公司 激光二极管的制法及其结构
US7693204B2 (en) 2006-02-03 2010-04-06 Ricoh Company, Ltd. Surface-emitting laser device and surface-emitting laser array including same
EP1980001B1 (en) 2006-02-03 2018-04-04 Ricoh Company, Ltd. Surface-emitting laser device
JP4970924B2 (ja) * 2006-03-28 2012-07-11 三菱電機株式会社 光素子用パッケージとこれを用いた光半導体装置
JP5122172B2 (ja) * 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
JP4310352B2 (ja) * 2007-06-05 2009-08-05 シャープ株式会社 発光デバイスおよび発光デバイスの製造方法
EP2220231B1 (en) 2007-11-12 2017-10-11 North Carolina State University Alteration of tobacco alkaloid content through modification of specific cytochrome p450 genes
JP5206399B2 (ja) * 2008-12-25 2013-06-12 三菱電機株式会社 レーザ装置及びその製造方法
US8829685B2 (en) * 2009-03-31 2014-09-09 Semiconductor Components Industries, Llc Circuit device having funnel shaped lead and method for manufacturing the same
JP2011077458A (ja) * 2009-10-01 2011-04-14 Panasonic Corp レーザー装置
US20110280267A1 (en) * 2010-05-14 2011-11-17 Sanyo Electric Co., Ltd. Semiconductor laser apparatus and optical apparatus
KR200479264Y1 (ko) 2014-12-15 2016-01-08 디피씨 주식회사 변압기용 단자구조체
CN105090782B (zh) * 2015-07-17 2018-07-27 开发晶照明（厦门）有限公司 Led灯丝以及灯丝型led灯泡
JP6976094B2 (ja) * 2017-07-18 2021-12-08 日本特殊陶業株式会社 発光素子搭載用パッケージ
CN109962404A (zh) * 2017-12-26 2019-07-02 西安炬光科技股份有限公司 半导体激光模块
US11081857B2 (en) * 2018-12-06 2021-08-03 Sharp Kabushiki Kaisha Semiconductor laser device and manufacturing method therefor
JP7244630B2 (ja) * 2019-04-25 2023-03-22 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60226153A (ja) * 1984-04-25 1985-11-11 Matsushita Electronics Corp 電力半導体装置用リ−ドフレ−ム
US4713640A (en) 1986-12-22 1987-12-15 Westinghouse Electric Corp. Molded-case circuit breaker with improved contact arm assembly, toggle link means and arc shield component
JPS63168931U (xx) * 1987-04-24 1988-11-02
JPH0254263A (ja) 1988-08-18 1990-02-23 Konica Corp ハロゲン化銀カラー写真感光材料用安定液および該感光材料の処理方法
JPH0254263U (xx) * 1988-10-12 1990-04-19
US5444726A (en) * 1990-11-07 1995-08-22 Fuji Electric Co., Ltd. Semiconductor laser device
JP3059831B2 (ja) 1992-07-31 2000-07-04 三洋電機株式会社 半導体レーザ装置
US5367530A (en) * 1992-05-29 1994-11-22 Sanyo Electric Co., Ltd. Semiconductor laser apparatus
JPH0645703A (ja) * 1992-07-23 1994-02-18 Sanyo Electric Co Ltd 半導体レーザ装置
JPH06196817A (ja) * 1992-12-24 1994-07-15 Sharp Corp 半導体レーザ装置
JPH07321407A (ja) 1993-04-05 1995-12-08 Fuji Electric Co Ltd 樹脂封止形レーザーダイオード装置
US6784511B1 (en) * 1994-01-20 2004-08-31 Fuji Electric Co., Ltd. Resin-sealed laser diode device
JP3524579B2 (ja) * 1994-05-31 2004-05-10 三洋電機株式会社 半導体レーザ装置
JPH0992931A (ja) * 1995-09-26 1997-04-04 Fuji Electric Co Ltd 半導体レーザ装置
JP3082695B2 (ja) * 1997-01-16 2000-08-28 日本電気株式会社 半導体レーザ装置、その製造方法
US6020632A (en) * 1997-02-26 2000-02-01 Motorola, Inc. Electronic component including an adjustable cap
JP3186684B2 (ja) 1997-12-29 2001-07-11 ソニー株式会社 半導体レーザ装置
JPH11307871A (ja) * 1998-04-23 1999-11-05 Nec Corp 半導体レーザ装置
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
JP4010679B2 (ja) * 1998-11-30 2007-11-21 三洋電機株式会社 半導体レーザ装置及びその製造方法

Also Published As

Publication number Publication date
DE60129991D1 (de) 2007-09-27
EP1313184B1 (en) 2007-08-15
US6885076B2 (en) 2005-04-26
EP1313184A4 (en) 2005-12-07
KR20030029107A (ko) 2003-04-11
KR100542336B1 (ko) 2006-01-11
DE60129991T2 (de) 2008-04-30
EP1313184A1 (en) 2003-05-21
WO2002007275A1 (fr) 2002-01-24
CN1258252C (zh) 2006-05-31
US20030178711A1 (en) 2003-09-25
CN1443385A (zh) 2003-09-17

Similar Documents

Publication Publication Date Title
HK1057654A1 (en) Semiconductor laser device
JP4560121B2 (ja) センサー固定装置およびカメラモジュール
JP4218184B2 (ja) 半導体装置の実装構造
JP6049860B2 (ja) イメージセンサ
DK0654819T3 (da) Fremgangsmåde til fremstilling af en anordning til varmeafledning
KR970013389A (ko) 반도체장치
US20020195262A1 (en) Plastic frame for the mounting of an electronic heavy-current control unit
KR19990072584A (ko) 전자기기
JP2016134627A (ja) 制御電子機器
KR970013131A (ko) 고체 촬상 소자 및 그 실장 방법
JP4569589B2 (ja) イメージセンサの放熱構造
US7775708B2 (en) Device for thermal coupling
ATE487262T1 (de) Statorstruktur für einen drehsensor
JP2012156581A (ja) 発熱素子体の放熱構造
JPH1125465A (ja) 半導体レーザ装置
US20150355425A1 (en) Heat dissipation structure and optical transceiver
JP4552760B2 (ja) 表示装置
JP4343614B2 (ja) デジタルカメラ
JP2005017545A (ja) 照明装置及び画像読取装置
FI116789B (fi) Litteän hissimoottorin staattorin kiinnitys
JP6800319B2 (ja) 電力変換装置
JP2002221529A (ja) 回転センサおよびその組み立て方法
JP4198102B2 (ja) 半導体装置、並びに、画像読取ユニット、及び、画像形成装置
JP3632235B2 (ja) モータ
JP2019187202A (ja) モータ装置