HK1032671A1 - Semiconductor device, method of manufacture thereof, circuit board, and electronic device - Google Patents
Semiconductor device, method of manufacture thereof, circuit board, and electronic deviceInfo
- Publication number
- HK1032671A1 HK1032671A1 HK01103203A HK01103203A HK1032671A1 HK 1032671 A1 HK1032671 A1 HK 1032671A1 HK 01103203 A HK01103203 A HK 01103203A HK 01103203 A HK01103203 A HK 01103203A HK 1032671 A1 HK1032671 A1 HK 1032671A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor chip
- semiconductor device
- manufacture
- circuit board
- electronic device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 8
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H05K1/00—Printed circuits
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
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- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49002—Electrical device making
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20124698 | 1998-07-01 | ||
PCT/JP1999/003418 WO2000002244A1 (fr) | 1998-07-01 | 1999-06-25 | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1032671A1 true HK1032671A1 (en) | 2001-07-27 |
Family
ID=16437769
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01103203A HK1032671A1 (en) | 1998-07-01 | 2001-05-07 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
HK01103293A HK1032672A1 (en) | 1998-07-01 | 2001-05-11 | Semiconductor device, method of manufacture, circuit board, and electronic device |
HK01103675A HK1033201A1 (en) | 1998-07-01 | 2001-05-28 | Semiconductor device, method of manufacture thereof, circuit board and electronic device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01103293A HK1032672A1 (en) | 1998-07-01 | 2001-05-11 | Semiconductor device, method of manufacture, circuit board, and electronic device |
HK01103675A HK1033201A1 (en) | 1998-07-01 | 2001-05-28 | Semiconductor device, method of manufacture thereof, circuit board and electronic device |
Country Status (8)
Country | Link |
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US (9) | US6995476B2 (xx) |
JP (3) | JP3702788B2 (xx) |
KR (3) | KR100509874B1 (xx) |
CN (3) | CN1143373C (xx) |
HK (3) | HK1032671A1 (xx) |
SG (1) | SG102032A1 (xx) |
TW (3) | TW454278B (xx) |
WO (3) | WO2000002243A1 (xx) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3815149B2 (ja) * | 1999-11-04 | 2006-08-30 | セイコーエプソン株式会社 | 部品実装方法および電気光学装置の製造方法 |
US6713854B1 (en) | 2000-10-16 | 2004-03-30 | Legacy Electronics, Inc | Electronic circuit module with a carrier having a mounting pad array |
US6487078B2 (en) * | 2000-03-13 | 2002-11-26 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
US7102892B2 (en) * | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
DE10019443A1 (de) * | 2000-04-19 | 2001-10-31 | Texas Instruments Deutschland | Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger |
US6395326B1 (en) * | 2000-05-31 | 2002-05-28 | Advanced Cardiovascular Systems, Inc. | Apparatus and method for depositing a coating onto a surface of a prosthesis |
DE10046296C2 (de) * | 2000-07-17 | 2002-10-10 | Infineon Technologies Ag | Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zu seiner Herstellung |
JP2002076589A (ja) * | 2000-08-31 | 2002-03-15 | Hitachi Ltd | 電子装置及びその製造方法 |
US7337522B2 (en) * | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
JP3653460B2 (ja) * | 2000-10-26 | 2005-05-25 | 三洋電機株式会社 | 半導体モジュールおよびその製造方法 |
AU2002250437A1 (en) * | 2001-03-14 | 2002-09-24 | Legacy Electronics, Inc. | A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
WO2002093637A2 (en) * | 2001-05-17 | 2002-11-21 | Koninklijke Philips Electronics N.V. | Product comprising a substrate and a chip attached to the substrate |
JP2002353369A (ja) * | 2001-05-28 | 2002-12-06 | Sharp Corp | 半導体パッケージおよびその製造方法 |
US20030059520A1 (en) | 2001-09-27 | 2003-03-27 | Yung-Ming Chen | Apparatus for regulating temperature of a composition and a method of coating implantable devices |
JP4137551B2 (ja) * | 2002-08-09 | 2008-08-20 | 日東電工株式会社 | 透明導電性基板用表面保護フィルム及び表面保護フィルム付き透明導電性基板 |
JP2004134646A (ja) * | 2002-10-11 | 2004-04-30 | Seiko Epson Corp | バンプ付き半導体素子の実装構造、バンプ付き半導体素子の実装方法、及び電気光学装置、並びに電子機器 |
US20050012225A1 (en) * | 2002-11-15 | 2005-01-20 | Choi Seung-Yong | Wafer-level chip scale package and method for fabricating and using the same |
US7338557B1 (en) * | 2002-12-17 | 2008-03-04 | Advanced Cardiovascular Systems, Inc. | Nozzle for use in coating a stent |
KR100510518B1 (ko) * | 2003-01-30 | 2005-08-26 | 삼성전자주식회사 | 반도체 장치 및 반도체 장치의 패키지 방법 |
US7087115B1 (en) * | 2003-02-13 | 2006-08-08 | Advanced Cardiovascular Systems, Inc. | Nozzle and method for use in coating a stent |
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