HK1022661A1 - A composition and slurry useful for metal cmp - Google Patents

A composition and slurry useful for metal cmp

Info

Publication number
HK1022661A1
HK1022661A1 HK00101722A HK00101722A HK1022661A1 HK 1022661 A1 HK1022661 A1 HK 1022661A1 HK 00101722 A HK00101722 A HK 00101722A HK 00101722 A HK00101722 A HK 00101722A HK 1022661 A1 HK1022661 A1 HK 1022661A1
Authority
HK
Hong Kong
Prior art keywords
composition
useful
metal cmp
slurry useful
catalyst
Prior art date
Application number
HK00101722A
Other languages
English (en)
Inventor
Steven K Grumbine
Christopher C Streinz
Brian L Mueller
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27419449&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1022661(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/753,482 external-priority patent/US5958288A/en
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of HK1022661A1 publication Critical patent/HK1022661A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Catalysts (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
HK00101722A 1996-11-26 2000-03-21 A composition and slurry useful for metal cmp HK1022661A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/753,482 US5958288A (en) 1996-11-26 1996-11-26 Composition and slurry useful for metal CMP
US08/827,918 US5980775A (en) 1996-11-26 1997-04-08 Composition and slurry useful for metal CMP
US08/891,468 US6068787A (en) 1996-11-26 1997-07-11 Composition and slurry useful for metal CMP
PCT/US1997/022083 WO1998023408A1 (fr) 1996-11-26 1997-11-21 Composition et emulsion utiles dans le polissage chimique et mecanique de metaux

Publications (1)

Publication Number Publication Date
HK1022661A1 true HK1022661A1 (en) 2000-08-18

Family

ID=27419449

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00101722A HK1022661A1 (en) 1996-11-26 2000-03-21 A composition and slurry useful for metal cmp

Country Status (14)

Country Link
US (1) US6068787A (fr)
EP (1) EP0844290B1 (fr)
JP (1) JP3822339B2 (fr)
KR (2) KR100745447B1 (fr)
CN (1) CN1131125C (fr)
AT (1) ATE214417T1 (fr)
AU (1) AU5464298A (fr)
DE (1) DE69710993T2 (fr)
ES (1) ES2174192T3 (fr)
HK (1) HK1022661A1 (fr)
ID (1) ID23676A (fr)
IL (1) IL130138A (fr)
TW (1) TW396201B (fr)
WO (1) WO1998023408A1 (fr)

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CN1242729A (zh) 2000-01-26
KR100745447B1 (ko) 2007-10-16
DE69710993D1 (de) 2002-04-18
KR20060087359A (ko) 2006-08-02
EP0844290B1 (fr) 2002-03-13
JPH10265766A (ja) 1998-10-06
ATE214417T1 (de) 2002-03-15
ID23676A (id) 2000-05-11
ES2174192T3 (es) 2002-11-01
KR19980042755A (ko) 1998-08-17
IL130138A (en) 2003-03-12
CN1131125C (zh) 2003-12-17
WO1998023408A1 (fr) 1998-06-04
JP3822339B2 (ja) 2006-09-20
DE69710993T2 (de) 2002-11-28
IL130138A0 (en) 2001-01-28
TW396201B (en) 2000-07-01
US6068787A (en) 2000-05-30
AU5464298A (en) 1998-06-22

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