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Priority claimed from US08/753,482external-prioritypatent/US5958288A/en
Priority claimed from US08/891,468external-prioritypatent/US6068787A/en
Application filed by Cabot Microelectronics CorpfiledCriticalCabot Microelectronics Corp
Publication of MY117318ApublicationCriticalpatent/MY117318A/en
A CHEMICAL MECHANICAL POLISHING PERCURSOR COMPOSITION COMPRISING AT LEAST ONE CATALYST HAVING MULTIPLE OXIDATION STATES, AND AT LEAST ONE STABILIZER, THE COMPOSITION BEING USEFUL WHEN ADMIXED WITH AN OXIDIZING AGENT PRIOR TO USE TO REMOVE METAL LAYERS FROM A SUBSTRATE. ALSO DISCLOSED IS A CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING AN OXIDIZING AGENT AND AT LEAST ONE CATALYST HAVING MULTIPLE OXIDATION STATES, THE COMPOSITION BEING USEFUL WHEN COMBINED WITH AN ABRASIVE OR AN ABRASIVE PAD TO REMOVE METAL LAYERS FROM A SUBSTRATE.
MYPI97057161996-11-261997-11-26A composition and slurry useful for metal cmp
MY117318A
(en)
Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad