FR2502397A1 - Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique - Google Patents

Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique Download PDF

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Publication number
FR2502397A1
FR2502397A1 FR8204519A FR8204519A FR2502397A1 FR 2502397 A1 FR2502397 A1 FR 2502397A1 FR 8204519 A FR8204519 A FR 8204519A FR 8204519 A FR8204519 A FR 8204519A FR 2502397 A1 FR2502397 A1 FR 2502397A1
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Prior art keywords
wire
capillary tube
contact
ball
electronic microcircuit
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Granted
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FR8204519A
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FR2502397B1 (fr
Inventor
Hermanus Antonius Van De Pas
Huibert Arnoldus Knobbout
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Koninklijke Philips NV
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Philips Gloeilampenfabrieken NV
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Publication of FR2502397B1 publication Critical patent/FR2502397B1/fr
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract

PROCEDE PERMETTANT D'APPLIQUER DES SUREPAISSEURS DE CONTACT 8 A DES PLAGES DE CONTACT 2 D'UN MICROCIRCUIT ELECTRONIQUE 1, UNE BOULE ETANT FORMEE PAR CHAUFFAGE A L'EXTREMITE D'UN FIL METALLIQUE 5 ET APPLIQUEE A UNE PLAGE DE CONTACT 2 DU MICROCIRCUIT ELECTRONIQUE, ALORS QUE, DANS LE FIL, EST REALISE UN AFFAIBLISSEMENT PRES DE LA BOULE ET LE FIL EST ROMPU A L'ENDROIT DE L'AFFAIBLISSEMENT. APPLICATION: MICROCIRCUITS ELECTRONIQUES.

Description

-1-
"PROCEDE PERMETTANT D'APPLIQUER DES SUREPAISSEURS AUX PLAGES
DE CONTACT D'UN MICROCIRCUIT ELECTRONIQUE"
L'invention concerne un procédé permettant d'appli-
quer des surépaisseurs de contact aux plages de contact
d'un microcircuit électronique.
Des éléments semiconducteurs munis de surépaisseurs de contact, appelés parfois des boules de contact, sont connus. D'autres microcircuits électroniques, comme des
dispositifs à bulles magnétiques ou des dispositifs à cris-
taux liquides peuvent être munis de surépaisseurs de con-
tact. Ces surépaisseurs servent à réaliser un contact élec-
trique avec des conducteurs d'un substrat ou avec des con-
ducteurs d'un réseau de conducteur métallique, cas dans lequel il n'est pas nécessaire d'utiliser des fils de connexion. La méthode connue pour obtenir des surépaisseurs
de contact est assez compliquée et requiert plusieurs éta-
pes de fabrication. D'une façon générale, les surépaisseurs sont obtenues à l'aide de techniques galvaniques utilisant au moins une couche métallique, opération pour laquelle on met en oeuvre des techniques de photogravure pour obtenir
le masquage requis.
L'invention vise à fournir un procédé très simplifié pour obtenir des surépaisseurs de contact afin d'éviter la croissance galvanique. Pour atteindre ce but, le procédé conforme à l'invention est caractérisé en ce qu'une boule
est formée, par chauffage, à une extrémité d'un fil métal-
lique, appliquée contre une plage de contact du microcircuit électronique et reliée à cette plage, et en ce que le fil est rompu près de la boule à l'endroit d'un affaiblissement
réalisé dans le fil.
Les surépaisseurs de contact s'obtiennent ainsi d'une façon entièrement mécanique. Des techniques galvaniques et -2-
de photogravure additionnelles sont superflues. L'applica-
tion des boules de contact peut être effectuée d'une façon fortement automatisée. A ce sujet, la technique connue pour
l'application de fils de connexion au cours de la réalisa-
tion de dispositifs semiconducteurs peut être partiellement
mise à profit. Grâce à la méthode simplifiée selon l'inven-
tion, il est possible d'obtenir une économie notable.
Dans une forme de réalisation avantageuse du procédé conforme à l'invention, le fil traverse un tube capillaire et la boule est reliée, à l'aide de la partie inférieure du tube capillaire, à la plage de contact du microcircuit électronique, après quoi le tube capillaire est déplacé par rapport au fil par un déplacement ascendant et latéral sur une faible distance, puis le tube capillaire est descendu et une entaille du fil est réalisée avec la face inférieure
du tube capillaire.
La réalisation rigoureuse de l'affaiblissement du fil
revêt une importance notable pour obtenir une forme appro-
priée de la boule de contact. La partie inférieure du tube capillaire permet d'affaiblir préalablement le fil de façon
à assurer une reproductibilité élevée des boules de contact.
Des moyens de commande modernes, par exemple des micropro-
cesseurs, permettent de déterminer très rigoureusement et
préalablement l'emplacement de cet affaiblissement.
Dans une forme de réalisation avantageuse de l'inven-
tion, le tube capillaire est remonté sur une distance égale à 2 à 3 fois l'épaisseur du fil et déplacé latéralement sur
une distance égale à 1,5 à 2 fois l'épaisseur du fil.
Une autre forme de réalisation de l'invention utilise
un fil présentant une dureté élevée et une structure cris-
talline à grains fins, l'affaiblissement dans le fil étant formé par recristallisation après la formation par chauffage de la boule, la partie de fil confinant à la boule acquérant
une structure cristalline à gros grains.
La description ci-après se référant aux dessins annexés,
le tout donné à titre d'exemple non limitatif, fera bien
comprendre comment l'invention peut être réalisée.
-3- La figure 1 montre l'extrémité inférieure d'un tube capillaire avec un fil à l'extrémité duquel est formée une boule.
La figure 2 montre la boule fixée sur un substrat.
La figure 3 illustre la position dans laquelle le
tube capillaire est remonté et déplacé latéralement.
La figure 4 montre l'aplatissement et l'affaiblisse-
ment de l'extrémité du fil.
La figure 5 montre le substrat muni d'une surépais-
seur de contact après rupture du fil et la figure 6 montre une surépaisseur de contact sur
un substrat obtenue d'une autre façon.
La figure 1 montre un substrat 1 présentant une plage
de contact 2 sur laquelle doit être appliquée une surépais-
seur de contact. Dans la description ci-après, on admet que
le substrat est un élément semiconducteur et que la plage de contact est une zone métallisée qui communique avec une
zone active de l'élément semiconducteur. Toutefois, l'inven-
tion peut également être appliquée à d'autres microcircuits électroniques comme des circuits à bulles magnétiques ou des dispositifs à cristaux liquides ou encore à des supports pour circuits hybrides. Un substrat muni de surépaisseurs de contact peut être fixé aux conducteurs d'un support, la connexion de toutes les surépaisseurs de contact avec les
conducteurs étant effectuée simultanément, les fils d'inter-
connexion étant alors inutiles.
La figure 1 représente l'extrémité d'un tube capil-
laire 3 au-dessus d'un élément semiconducteur 1. Une ouver-
ture 4 du tube capillaire est traversée par un fil 5. A l'extrémité du fil 5 est formée une boule 6. Ceci est obtenu de façon connue en soi, par exemple à l'aide d'une flamme de gaz ou à l'aide d'une décharge électrostatique. Le matériau du fil est en général de l'or ou de l'aluminium, mais il est
également possible d'utiliser d'autres métaux comme le cui-
vre. Le tube capillaire 3 peut être en matériau céramique par exemple. Eventuellement, le capillaire peut être chauffé
à l'aide de moyens connus en soi.
-4 - La figure 2 montre le fil relié à la plage de contact 2 sur l'élément semiconducteur 1. La boule est appliquée à l'aide du tube capillaire 3 contre la plage de contact 2 et fixée par thermocompression ou à l'aide d'ultrasons Ensuite, le tube capillaire 3 est déplacé latérale-
ment sur une petite distance. Cette position est représen-
tée sur la figure 3. Le capillaire est descendu (figure 4) de façon qu'il se forme un affaiblissement sous forme d'une entaille 7 dans le fil. Par suite de cet affaiblissement, le fil peut facilement être rompu. La figure 5 représente
le substrat 1 muni d'une surépaisseur de contact 8.
Au besoin, des surépaisseurs de contact peuvent être appliquées à d'autres plages de contact du substrat 1. Le
substrat, muni par voie mécanique de surépaisseurs de con-
tact peut être relié d'une façon connue en soi aux conduc-
teurs d'un support.
Il s'est avéré très avantageux, après la fixation de la boule sur le substrat, que le capillaire remonte sur une distance égale à 2 à 3 fois l'épaisseur de fil et effectue un déplacement latéral égal à 1,5 à 2 fois l'épaisseur de fil. L'affaiblissement réalisé dans le fil s'obtient ainsi
d'une façon avantageuse et à un endroit désiré.
L'affaiblissement du fil peut s'obtenir également d'une autre façon: on part d'un fil présentant une dureté relativement élevée et une structure cristalline à grains
fins. Après réalisation par chauffage de la boule 6 à l'ex-
trémité du fil (voir figure 1), il se forme une structure cristalline à gros grains au-dessus de la boule par suite de la recristallisation dans cette partie de fil, de sorte que le fil y présente un affaiblissement. Après la fixation du fil à la plage de contact 2, comme le montre la figure 2, on tire sur le fil de façon à provoquer sa rupture à l'endroit de l'affaiblissement. La surépaisseur de contact 8 ainsi obtenue est représentée à la figure 6. Il arrive qu'un très petit tronçon de fil demeure sur la surépaisseur de contact 8. Cela ne constitue pas d'inconvénient surtout lorsque le substrat avec les surépaisseurs de contact est fixé sur un -5-
support présentant des trous métallisés. Les courts tron-
çons de fil se logent alors dans les trous du support.
Il est évident que l'affaiblissement dans le fil
peut également être obtenu de toute autre façon appropriée.
-6-

Claims (4)

- REVENDICATIONS -
1. Procédé permettant d'appliquer des surépais-
seurs de contact à des plages de contact d'un microcircuit électronique, caractérisé en ce qu'à une extrémité d'un fil métallique est formée, par chauffage, une boule qui est appliquée contre une plage de contact du microcircuit électronique et reliée à cette plage, et en ce que le fil est rompu à l'endroit d'un affaiblissement réalisé dans le fil.
2. Procédé selon la revendication 1, caractérisé en ce que le fil traverse un tube capillaire et la boule est reliée à l'aide de la face inférieure du capillaire à la plage de contact du microcircuit électronique, après quoi le tube capillaire est déplacé par rapport au fil par un déplacement ascendant et latéral du capillaire sur une
faible distance, après quoi le tube capillaire est descen-
du de façon qu'une entaille soit réalisée dans le fil a
l'aide de la face inférieure dutube capillaire.
3. Procédé selon la revendication 2, caractérisé en ce que le tube capillaire est remonté sur une distance
pratiquement égale à 2 à 3 fois l'épaisseur du fil et dé-
placé latéralement sur une distance égale à 1,5 à 2 fois
l'épaisseur de fil.
4. Procédé selon la revendication 1, caractérisé par l'utilisation d'un fil présentant une dureté élevée et une structure cristalline à grains fins, l'affaiblissement
du fil étant formé, dans le tube capillaire, par recris-
tallisation après la formation par chauffage de la boule,
la partie de fil confinant à la boule acquérant une struc-
ture cristalline à gros grains.
FR8204519A 1981-03-20 1982-03-17 Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique Expired FR2502397B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Publications (2)

Publication Number Publication Date
FR2502397A1 true FR2502397A1 (fr) 1982-09-24
FR2502397B1 FR2502397B1 (fr) 1986-07-25

Family

ID=19837199

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8204519A Expired FR2502397B1 (fr) 1981-03-20 1982-03-17 Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique

Country Status (12)

Country Link
US (1) US4442967A (fr)
JP (1) JPS57163919A (fr)
KR (1) KR900007043B1 (fr)
AU (1) AU548433B2 (fr)
CA (1) CA1181534A (fr)
CH (1) CH658540A5 (fr)
DE (1) DE3209242C2 (fr)
FR (1) FR2502397B1 (fr)
GB (1) GB2095473B (fr)
IE (1) IE53371B1 (fr)
IT (1) IT1150472B (fr)
NL (1) NL184184C (fr)

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Also Published As

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JPH0441519B2 (fr) 1992-07-08
US4442967A (en) 1984-04-17
CH658540A5 (de) 1986-11-14
IE53371B1 (en) 1988-10-26
NL8101371A (nl) 1982-10-18
CA1181534A (fr) 1985-01-22
IE820631L (en) 1982-09-20
KR830009648A (ko) 1983-12-22
IT1150472B (it) 1986-12-10
IT8220237A0 (it) 1982-03-17
FR2502397B1 (fr) 1986-07-25
DE3209242C2 (de) 1985-04-11
AU548433B2 (en) 1985-12-12
NL184184C (nl) 1989-05-01
GB2095473A (en) 1982-09-29
AU8160382A (en) 1982-09-23
NL184184B (nl) 1988-12-01
KR900007043B1 (ko) 1990-09-27
DE3209242A1 (de) 1982-11-11
GB2095473B (en) 1984-09-19
JPS57163919A (en) 1982-10-08

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