IT8220237A0 - Metodo per la creazione di porzioni sollevate di contatto su aree di contatto di un microcircuito elettronico. - Google Patents

Metodo per la creazione di porzioni sollevate di contatto su aree di contatto di un microcircuito elettronico.

Info

Publication number
IT8220237A0
IT8220237A0 IT8220237A IT2023782A IT8220237A0 IT 8220237 A0 IT8220237 A0 IT 8220237A0 IT 8220237 A IT8220237 A IT 8220237A IT 2023782 A IT2023782 A IT 2023782A IT 8220237 A0 IT8220237 A0 IT 8220237A0
Authority
IT
Italy
Prior art keywords
contact
raised portions
electronic microcircuit
creating raised
contact areas
Prior art date
Application number
IT8220237A
Other languages
English (en)
Other versions
IT1150472B (it
Inventor
Hermanus Antonius
De Van Pas
Huibert Arnoldus Knobbout
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT8220237A0 publication Critical patent/IT8220237A0/it
Application granted granted Critical
Publication of IT1150472B publication Critical patent/IT1150472B/it

Links

Classifications

    • H10D64/011—
    • H10W72/012—
    • H10W72/01225—
    • H10W72/07141—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/20—
    • H10W72/252—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
IT2023782A 1981-03-20 1982-03-17 Metodo per la creazione di porzioni sollevate di contatto su arre di contatto di un microcircuiro eletronico IT1150472B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Publications (2)

Publication Number Publication Date
IT8220237A0 true IT8220237A0 (it) 1982-03-17
IT1150472B IT1150472B (it) 1986-12-10

Family

ID=19837199

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2023782A IT1150472B (it) 1981-03-20 1982-03-17 Metodo per la creazione di porzioni sollevate di contatto su arre di contatto di un microcircuiro eletronico

Country Status (12)

Country Link
US (1) US4442967A (it)
JP (1) JPS57163919A (it)
KR (1) KR900007043B1 (it)
AU (1) AU548433B2 (it)
CA (1) CA1181534A (it)
CH (1) CH658540A5 (it)
DE (1) DE3209242C2 (it)
FR (1) FR2502397B1 (it)
GB (1) GB2095473B (it)
IE (1) IE53371B1 (it)
IT (1) IT1150472B (it)
NL (1) NL184184C (it)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
JPS63173345A (ja) * 1987-01-12 1988-07-16 Nec Kansai Ltd バンプ電極形成方法
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
EP0376924A3 (en) * 1987-05-21 1990-08-22 RAYCHEM CORPORATION (a Delaware corporation) Gold compression bonding
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JP2506861B2 (ja) * 1987-12-08 1996-06-12 松下電器産業株式会社 電気的接続接点の形成方法
JPH0237735A (ja) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd 半導体チップの実装構造
DE3829538A1 (de) * 1988-08-31 1990-03-08 Siemens Ag Verfahren zum verbinden eines halbleiterchips mit einem substrat
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置
US4948030A (en) * 1989-01-30 1990-08-14 Motorola, Inc. Bond connection for components
JPH0749794Y2 (ja) * 1989-03-15 1995-11-13 三菱マテリアル株式会社 ワイヤレスボンデイング用金バンプ
JPH02250328A (ja) * 1989-03-24 1990-10-08 Toshiba Corp ワイヤボンダ、ワイヤボンダを用いたバンプ形成方法
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
JP2830109B2 (ja) * 1989-07-19 1998-12-02 日本電気株式会社 バンプ形成方法およびバンプ形成装置
JPH03208354A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
JP2555811B2 (ja) * 1991-09-10 1996-11-20 富士通株式会社 半導体チップのフリップチップ接合方法
DE4307162C2 (de) * 1993-03-06 2000-06-08 Amatech Advanced Micromechanic Verbindung, Verfahren und Vorrichtung zur Herstellung einer Verbindung auf einer Chipanschlußfläche
KR960000793B1 (ko) * 1993-04-07 1996-01-12 삼성전자주식회사 노운 굳 다이 어레이 및 그 제조방법
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5559054A (en) * 1994-12-23 1996-09-24 Motorola, Inc. Method for ball bumping a semiconductor device
JP3252153B2 (ja) * 1995-03-10 2002-01-28 エルク ザケル 隆起接点メタライゼーションを形成する方法及びボンディングツール
US5650667A (en) * 1995-10-30 1997-07-22 National Semiconductor Corporation Process of forming conductive bumps on the electrodes of semiconductor chips using lapping and the bumps thereby created
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
JP3349886B2 (ja) 1996-04-18 2002-11-25 松下電器産業株式会社 半導体素子の２段突起形状バンプの形成方法
JP3344235B2 (ja) * 1996-10-07 2002-11-11 株式会社デンソー ワイヤボンディング方法
JP2000133672A (ja) 1998-10-28 2000-05-12 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2000150560A (ja) 1998-11-13 2000-05-30 Seiko Epson Corp バンプ形成方法及びバンプ形成用ボンディングツール、半導体ウエーハ、半導体チップ及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
CN1184616C (zh) 1998-12-04 2005-01-12 阿尔卑斯电气株式会社 磁头和磁头的制造方法及其所用的连接用毛细管
US6227437B1 (en) 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
JP4000743B2 (ja) 2000-03-13 2007-10-31 株式会社デンソー 電子部品の実装方法
GB2362504A (en) * 2000-04-20 2001-11-21 Pixel Fusion Ltd Pin contacts
EP1275143B1 (en) 2000-04-20 2007-08-22 Elwyn Paul Michael Wakefield Process for forming electrical/mechanical connections
US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6350386B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
US6511865B1 (en) 2000-09-20 2003-01-28 Charles W. C. Lin Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US6492252B1 (en) 2000-10-13 2002-12-10 Bridge Semiconductor Corporation Method of connecting a bumped conductive trace to a semiconductor chip
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US6872591B1 (en) 2000-10-13 2005-03-29 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a conductive trace and a substrate
US7129113B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
US6984576B1 (en) 2000-10-13 2006-01-10 Bridge Semiconductor Corporation Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
US7319265B1 (en) 2000-10-13 2008-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with precision-formed metal pillar
US7132741B1 (en) 2000-10-13 2006-11-07 Bridge Semiconductor Corporation Semiconductor chip assembly with carved bumped terminal
US7414319B2 (en) * 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
US6548393B1 (en) 2000-10-13 2003-04-15 Charles W. C. Lin Semiconductor chip assembly with hardened connection joint
US6673710B1 (en) 2000-10-13 2004-01-06 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip
US6949408B1 (en) 2000-10-13 2005-09-27 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7262082B1 (en) 2000-10-13 2007-08-28 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US6576493B1 (en) 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US7129575B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped metal pillar
US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US6699780B1 (en) 2000-10-13 2004-03-02 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
US7094676B1 (en) 2000-10-13 2006-08-22 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US7264991B1 (en) 2000-10-13 2007-09-04 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
US6667229B1 (en) 2000-10-13 2003-12-23 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
US7075186B1 (en) 2000-10-13 2006-07-11 Bridge Semiconductor Corporation Semiconductor chip assembly with interlocked contact terminal
US7190080B1 (en) 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
JP3935370B2 (ja) * 2002-02-19 2007-06-20 セイコーエプソン株式会社 バンプ付き半導体素子の製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
US6622903B1 (en) * 2002-03-27 2003-09-23 Palomar Technologies, Inc. Production of a tailless ball bump
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
DE10325566A1 (de) * 2003-06-05 2005-01-13 Infineon Technologies Ag Chipkartenmodul
US7993983B1 (en) 2003-11-17 2011-08-09 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7538415B1 (en) 2003-11-20 2009-05-26 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal, filler and insulative base
US7425759B1 (en) 2003-11-20 2008-09-16 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal and filler
US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7268421B1 (en) * 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7446419B1 (en) 2004-11-10 2008-11-04 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar of stacked metal balls
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
DE102006033222B4 (de) * 2006-07-18 2014-04-30 Epcos Ag Modul mit flachem Aufbau und Verfahren zur Bestückung
DE102006038875B4 (de) * 2006-08-18 2013-02-28 Infineon Technologies Ag Herstellungsverfahre für ein elektronisches Bauelement und elektronisches Bauelement
US7811863B1 (en) 2006-10-26 2010-10-12 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
US7494843B1 (en) 2006-12-26 2009-02-24 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US8372741B1 (en) * 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3430835A (en) * 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3460238A (en) * 1967-04-20 1969-08-12 Motorola Inc Wire severing in wire bonding machines
DE7006122U (it) * 1969-04-26 1900-01-01
US3623649A (en) * 1969-06-09 1971-11-30 Gen Motors Corp Wedge bonding tool for the attachment of semiconductor leads
DE2006703A1 (de) * 1970-02-13 1971-08-26 Siemens Ag Isolationsschicht auf einem Halbleiter grundkorper
JPS50160773A (it) * 1974-06-18 1975-12-26
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
FR2412943A1 (fr) * 1977-12-20 1979-07-20 Thomson Csf Procede de realisation de connexions d'un dispositif semi-conducteur sur embase, appareil pour la mise en oeuvre du procede, et dispositif semi-conducteur obtenu par ce procede
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
JPS55118643A (en) * 1979-03-06 1980-09-11 Toshiba Corp Wire bonding process
JPS55158642A (en) * 1979-05-30 1980-12-10 Noge Denki Kogyo:Kk Bonding alloy wire for assembling semiconductor device

Also Published As

Publication number Publication date
IE820631L (en) 1982-09-20
IE53371B1 (en) 1988-10-26
GB2095473B (en) 1984-09-19
CH658540A5 (de) 1986-11-14
JPH0441519B2 (it) 1992-07-08
NL184184B (nl) 1988-12-01
DE3209242A1 (de) 1982-11-11
DE3209242C2 (de) 1985-04-11
US4442967A (en) 1984-04-17
KR830009648A (ko) 1983-12-22
NL8101371A (nl) 1982-10-18
CA1181534A (en) 1985-01-22
IT1150472B (it) 1986-12-10
AU548433B2 (en) 1985-12-12
FR2502397A1 (fr) 1982-09-24
KR900007043B1 (ko) 1990-09-27
JPS57163919A (en) 1982-10-08
NL184184C (nl) 1989-05-01
FR2502397B1 (fr) 1986-07-25
AU8160382A (en) 1982-09-23
GB2095473A (en) 1982-09-29

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