FR2502397B1 - Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique - Google Patents

Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique

Info

Publication number
FR2502397B1
FR2502397B1 FR8204519A FR8204519A FR2502397B1 FR 2502397 B1 FR2502397 B1 FR 2502397B1 FR 8204519 A FR8204519 A FR 8204519A FR 8204519 A FR8204519 A FR 8204519A FR 2502397 B1 FR2502397 B1 FR 2502397B1
Authority
FR
France
Prior art keywords
overdepths
applying
electronic microcircuit
contact ranges
ranges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8204519A
Other languages
English (en)
Other versions
FR2502397A1 (fr
Inventor
Hermanus Antonius Van De Pas
Huibert Arnoldus Knobbout
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2502397A1 publication Critical patent/FR2502397A1/fr
Application granted granted Critical
Publication of FR2502397B1 publication Critical patent/FR2502397B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR8204519A 1981-03-20 1982-03-17 Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique Expired FR2502397B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Publications (2)

Publication Number Publication Date
FR2502397A1 FR2502397A1 (fr) 1982-09-24
FR2502397B1 true FR2502397B1 (fr) 1986-07-25

Family

ID=19837199

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8204519A Expired FR2502397B1 (fr) 1981-03-20 1982-03-17 Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique

Country Status (12)

Country Link
US (1) US4442967A (fr)
JP (1) JPS57163919A (fr)
KR (1) KR900007043B1 (fr)
AU (1) AU548433B2 (fr)
CA (1) CA1181534A (fr)
CH (1) CH658540A5 (fr)
DE (1) DE3209242C2 (fr)
FR (1) FR2502397B1 (fr)
GB (1) GB2095473B (fr)
IE (1) IE53371B1 (fr)
IT (1) IT1150472B (fr)
NL (1) NL184184C (fr)

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FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
JPS63173345A (ja) * 1987-01-12 1988-07-16 Nec Kansai Ltd バンプ電極形成方法
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
EP0376924A3 (fr) * 1987-05-21 1990-08-22 RAYCHEM CORPORATION (a Delaware corporation) Liaison par compression à or
JP2506861B2 (ja) * 1987-12-08 1996-06-12 松下電器産業株式会社 電気的接続接点の形成方法
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JPH0237735A (ja) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd 半導体チップの実装構造
DE3829538A1 (de) * 1988-08-31 1990-03-08 Siemens Ag Verfahren zum verbinden eines halbleiterchips mit einem substrat
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JPH0441519B2 (fr) 1992-07-08
US4442967A (en) 1984-04-17
CH658540A5 (de) 1986-11-14
IE53371B1 (en) 1988-10-26
NL8101371A (nl) 1982-10-18
CA1181534A (fr) 1985-01-22
IE820631L (en) 1982-09-20
KR830009648A (ko) 1983-12-22
IT1150472B (it) 1986-12-10
IT8220237A0 (it) 1982-03-17
DE3209242C2 (de) 1985-04-11
AU548433B2 (en) 1985-12-12
NL184184C (nl) 1989-05-01
GB2095473A (en) 1982-09-29
FR2502397A1 (fr) 1982-09-24
AU8160382A (en) 1982-09-23
NL184184B (nl) 1988-12-01
KR900007043B1 (ko) 1990-09-27
DE3209242A1 (de) 1982-11-11
GB2095473B (en) 1984-09-19
JPS57163919A (en) 1982-10-08

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