IT1183375B - Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori - Google Patents

Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori

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Publication number
IT1183375B
IT1183375B IT19571/85A IT1957185A IT1183375B IT 1183375 B IT1183375 B IT 1183375B IT 19571/85 A IT19571/85 A IT 19571/85A IT 1957185 A IT1957185 A IT 1957185A IT 1183375 B IT1183375 B IT 1183375B
Authority
IT
Italy
Prior art keywords
ball
conducting
conducting wires
semiconductor device
device including
Prior art date
Application number
IT19571/85A
Other languages
English (en)
Other versions
IT8519571A0 (it
Inventor
Susumu Okikawa
Hiroshi Mikino
Hiromichi Suzuki
Wahei Kitamura
Daija Sakamoto
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59032434A external-priority patent/JPS60177637A/ja
Priority claimed from JP59032433A external-priority patent/JPS60177666A/ja
Priority claimed from JP59032435A external-priority patent/JPS60177667A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8519571A0 publication Critical patent/IT8519571A0/it
Application granted granted Critical
Publication of IT1183375B publication Critical patent/IT1183375B/it

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
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    • H01L2924/161—Cap
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    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
IT19571/85A 1984-02-24 1985-02-20 Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori IT1183375B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59032434A JPS60177637A (ja) 1984-02-24 1984-02-24 半導体装置
JP59032433A JPS60177666A (ja) 1984-02-24 1984-02-24 半導体装置
JP59032435A JPS60177667A (ja) 1984-02-24 1984-02-24 半導体装置

Publications (2)

Publication Number Publication Date
IT8519571A0 IT8519571A0 (it) 1985-02-20
IT1183375B true IT1183375B (it) 1987-10-22

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DE (1) DE3506264A1 (it)
FR (1) FR2561446B1 (it)
GB (3) GB2155036B (it)
HK (3) HK95090A (it)
IT (1) IT1183375B (it)
MY (1) MY101028A (it)
SG (1) SG82790G (it)

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Publication number Priority date Publication date Assignee Title
US8349462B2 (en) 2009-01-16 2013-01-08 Alcoa Inc. Aluminum alloys, aluminum alloy products and methods for making the same
EP4131349A4 (en) * 2020-03-25 2023-12-27 Nippon Micrometal Corporation ALUMINUM CONNECTION WIRE

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1297872B (de) * 1966-07-30 1969-06-19 Aluminium Giesserei Villingen Verwendung einer Aluminium-Gusslegierung fuer die Herstellung von elektrisch hochleitfaehigen Formgussteilen
CH524225A (fr) * 1968-05-21 1972-06-15 Southwire Co Fil ou barre en alliage d'aluminium
DE2029584A1 (de) * 1969-06-18 1970-12-23 Kaiser Aluminum & Chemical Corp., Oakland, Calif. (V.St.A.) Verfahren zur Herstellung eines elektrischen Leiters unter Verwendung von Aluminium
ZA723663B (en) * 1971-06-07 1973-03-28 Southwire Co Aluminum nickel alloy electrical conductor
DE2143808A1 (de) * 1971-09-01 1973-03-08 Siemens Ag Elektrisch leitfaehige verbindung zwischen den metallen gold und aluminium
BE791269R (fr) * 1971-11-11 1973-03-01 Southwire Co Produits trefiles en alliage d'aluminium et procede pour les
CA1037742A (en) * 1973-07-23 1978-09-05 Enrique C. Chia High iron aluminum alloy
NO146166C (no) * 1974-08-01 1982-08-11 Southwire Co Sammensatt elektrisk kraftledning
FR2289035A1 (fr) * 1974-08-29 1976-05-21 Trefimetaux Conducteurs electriques en alliages d'aluminium et procede d'obtention
JPS5251867A (en) * 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
GB1510940A (en) * 1975-12-09 1978-05-17 Southwire Co Aluminium-iron-nickel alloy electrical conductor
DE2625092A1 (de) * 1976-06-04 1977-12-15 Demetron Kontaktplatte, insbesondere fuer halbleiterbauelemente, und verfahren zu ihrer herstellung
DE2929623C2 (de) * 1979-07-21 1981-11-26 W.C. Heraeus Gmbh, 6450 Hanau Feinstdraht aus einer Aluminiumlegierung
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif

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HK94990A (en) 1990-11-23
FR2561446A1 (fr) 1985-09-20
GB2199846A (en) 1988-07-20
HK95090A (en) 1990-11-23
GB8803057D0 (en) 1988-03-09
GB8504656D0 (en) 1985-03-27
GB2200135A (en) 1988-07-27
MY101028A (en) 1991-06-29
FR2561446B1 (fr) 1987-02-06
HK95190A (en) 1990-11-23
IT8519571A0 (it) 1985-02-20
GB2200135B (en) 1988-11-30
GB8803056D0 (en) 1988-03-09
GB2155036B (en) 1988-11-09
DE3506264A1 (de) 1985-08-29
GB2155036A (en) 1985-09-18
GB2199846B (en) 1988-11-30
SG82790G (en) 1990-11-23

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