KR860004457A - 반도체 집적회로장치 및 그의 제조방법과 제조장치 - Google Patents

반도체 집적회로장치 및 그의 제조방법과 제조장치

Info

Publication number
KR860004457A
KR860004457A KR1019850008240A KR850008240A KR860004457A KR 860004457 A KR860004457 A KR 860004457A KR 1019850008240 A KR1019850008240 A KR 1019850008240A KR 850008240 A KR850008240 A KR 850008240A KR 860004457 A KR860004457 A KR 860004457A
Authority
KR
South Korea
Prior art keywords
manufacturing
integrated circuit
semiconductor integrated
circuit device
manufacturing device
Prior art date
Application number
KR1019850008240A
Other languages
English (en)
Other versions
KR920006093B1 (ko
Inventor
쯔또무 미마따
도시히데 우에마쯔
가쯔히로 다바따
Original Assignee
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가부시끼가이샤 히다찌세이사꾸쇼
Publication of KR860004457A publication Critical patent/KR860004457A/ko
Application granted granted Critical
Publication of KR920006093B1 publication Critical patent/KR920006093B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019850008240A 1984-11-22 1985-11-05 반도체 집적회로장치 및 그의 제조방법과 제조장치 KR920006093B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-246025 1984-11-22
JP59246025A JPH067542B2 (ja) 1984-11-22 1984-11-22 製造装置

Publications (2)

Publication Number Publication Date
KR860004457A true KR860004457A (ko) 1986-06-23
KR920006093B1 KR920006093B1 (ko) 1992-07-27

Family

ID=17142325

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850008240A KR920006093B1 (ko) 1984-11-22 1985-11-05 반도체 집적회로장치 및 그의 제조방법과 제조장치

Country Status (4)

Country Link
US (2) US4890780A (ko)
JP (1) JPH067542B2 (ko)
KR (1) KR920006093B1 (ko)
CN (1) CN1008576B (ko)

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US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
JPS63314839A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
JP3132269B2 (ja) * 1993-11-17 2001-02-05 松下電器産業株式会社 アウターリードボンディング装置
DE4422674C2 (de) * 1994-06-30 1996-10-31 Resilux Nv Verfahren zum Trocknen eines Werkzeugs
US6189195B1 (en) 1995-08-22 2001-02-20 Medrad, Inc. Manufacture of prefilled syringes
US5687542A (en) * 1995-08-22 1997-11-18 Medrad, Inc. Isolation module for molding and packaging articles substantially free from contaminants
US5759218A (en) * 1996-10-24 1998-06-02 Allergan Point of fill air system
JPH1140770A (ja) * 1997-07-18 1999-02-12 Nec Corp 半導体装置の製造方法および半導体製造装置
JP2001244279A (ja) * 2000-02-25 2001-09-07 Nec Niigata Ltd 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置
CN101396867B (zh) * 2000-10-26 2013-04-10 耶斯·图戈德·格拉姆 用于模制和装配组合物品的方法以及装置
US6749100B2 (en) * 2001-11-28 2004-06-15 Asm Technology Singapore Pte Ltd. Multiple-head wire-bonding system
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
DE10254762A1 (de) * 2002-11-22 2004-06-09 Transcoject Gesellschaft für medizinische Geräte mbH & Co. KG Verfahren zur Herstellung und/oder Handhabung eines hochreinen Gegenstandes
US7303109B2 (en) * 2003-07-01 2007-12-04 Asm Technology Singapore Pte Ltd. Stud bumping apparatus
US7951322B2 (en) * 2006-06-13 2011-05-31 Electroform Company Method and apparatus for molding and assembling plural-part plastic assemblies
US8673080B2 (en) 2007-10-16 2014-03-18 Novellus Systems, Inc. Temperature controlled showerhead
JP4889788B2 (ja) * 2007-10-26 2012-03-07 パナソニック株式会社 クリーンルーム
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
JP2011021874A (ja) * 2009-06-19 2011-02-03 Seiko Epson Corp チャンバー装置、これを備えたロボットセルおよびチャンバールームの換気方法
US9034142B2 (en) * 2009-12-18 2015-05-19 Novellus Systems, Inc. Temperature controlled showerhead for high temperature operations
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
DE102010048650B4 (de) * 2010-10-15 2015-11-19 Otto Männer Innovation GmbH Vorrichtung zum Entformen von Spritzlingen
KR101937115B1 (ko) 2011-03-04 2019-01-09 노벨러스 시스템즈, 인코포레이티드 하이브리드 세라믹 샤워헤드
US10741365B2 (en) 2014-05-05 2020-08-11 Lam Research Corporation Low volume showerhead with porous baffle
WO2016008928A1 (en) * 2014-07-17 2016-01-21 Sacmi Imola S.C. Device for unloading and storing preforms for the production of containers made of plastics
US10378107B2 (en) 2015-05-22 2019-08-13 Lam Research Corporation Low volume showerhead with faceplate holes for improved flow uniformity
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
CN105388644A (zh) * 2015-12-23 2016-03-09 武汉华星光电技术有限公司 一种偏光片拆装辅助装置及偏光片拆装系统

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US3102331A (en) * 1960-07-21 1963-09-03 Motorola Inc Feeding and positioning apparatus
US3128499A (en) * 1961-06-15 1964-04-14 Western Electric Co Molding apparatus
BE790708A (fr) * 1971-10-31 1973-04-30 Pielkenrood Vinitex Bv Samenstel voor het afscheiden van een gedeelte van een ruimte
US4016809A (en) * 1975-07-16 1977-04-12 Contamination Control Laboratories, Inc. Clean air workbench
JPS5222883A (en) * 1975-08-14 1977-02-21 Nippon Telegr & Teleph Corp <Ntt> Air cleaner unit for semiconductor unit
JPS5235965U (ko) * 1975-09-04 1977-03-14
JPS5329578A (en) * 1976-08-31 1978-03-18 Matsushita Electric Works Ltd Waterrproof type push button switch
US4297940A (en) * 1980-01-31 1981-11-03 Tellus Machinery Corporation Protective workplace and system
JPS56162335A (en) * 1980-05-16 1981-12-14 Hitachi Ltd Air conditioner
DE3108678A1 (de) * 1981-03-07 1983-01-20 Glatt Maschinen- Und Apparatebau Ag, Pratteln Reinraumkabine
JPS5812937A (ja) * 1981-07-16 1983-01-25 Takasago Thermal Eng Co Lts 省エネルギ−型クリ−ンル−ム
JPS58129125A (ja) * 1982-01-29 1983-08-02 Hitachi Ltd 清浄作業室
JPS5969919A (ja) * 1982-10-15 1984-04-20 Yamato Scient Co Ltd クリ−ンベンチの風速制御装置
JPS59183231A (ja) * 1983-04-01 1984-10-18 Shinwa Boeki Kk 室内空気清浄装置
JPH0649279B2 (ja) * 1983-08-24 1994-06-29 株式会社日立製作所 清浄作業台
US4534921A (en) * 1984-03-06 1985-08-13 Asm Fico Tooling, B.V. Method and apparatus for mold cleaning by reverse sputtering
US4723480A (en) * 1985-04-19 1988-02-09 Hitachi, Ltd. Manufacturing apparatus with air cleaning device

Also Published As

Publication number Publication date
KR920006093B1 (ko) 1992-07-27
US5015425A (en) 1991-05-14
JPH067542B2 (ja) 1994-01-26
JPS61125121A (ja) 1986-06-12
CN85108470A (zh) 1986-05-10
CN1008576B (zh) 1990-06-27
US4890780A (en) 1990-01-02

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A201 Request for examination
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Payment date: 19950713

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee