KR860000712A - 반도체 집적회로 및 그 회로 패턴 설계방법 - Google Patents
반도체 집적회로 및 그 회로 패턴 설계방법Info
- Publication number
- KR860000712A KR860000712A KR1019850004145A KR850004145A KR860000712A KR 860000712 A KR860000712 A KR 860000712A KR 1019850004145 A KR1019850004145 A KR 1019850004145A KR 850004145 A KR850004145 A KR 850004145A KR 860000712 A KR860000712 A KR 860000712A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor integrated
- design method
- pattern design
- circuit
- integrated circuit
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/923—Active solid-state devices, e.g. transistors, solid-state diodes with means to optimize electrical conductor current carrying capacity, e.g. particular conductor aspect ratio
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59-135410 | 1984-06-29 | ||
JP59135410A JPS6114734A (ja) | 1984-06-29 | 1984-06-29 | 半導体集積回路装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860000712A true KR860000712A (ko) | 1986-01-30 |
KR900000202B1 KR900000202B1 (ko) | 1990-01-23 |
Family
ID=15151074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850004145A KR900000202B1 (ko) | 1984-06-29 | 1985-06-12 | 반도체 집적회로 및 그 회로 패턴 설계방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4701778A (ko) |
EP (1) | EP0167365B1 (ko) |
JP (1) | JPS6114734A (ko) |
KR (1) | KR900000202B1 (ko) |
CA (1) | CA1219380A (ko) |
DE (1) | DE3571102D1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100475504B1 (ko) * | 2002-01-23 | 2005-03-10 | 미쓰비시덴키 가부시키가이샤 | 반도체 집적 회로 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61191047A (ja) * | 1985-02-20 | 1986-08-25 | Toshiba Corp | 半導体集積回路装置 |
JPH0785490B2 (ja) * | 1986-01-22 | 1995-09-13 | 日本電気株式会社 | 集積回路装置 |
US5150309A (en) * | 1987-08-04 | 1992-09-22 | Texas Instruments Incorporated | Comprehensive logic circuit layout system |
JPH01239871A (ja) * | 1988-03-19 | 1989-09-25 | Rohm Co Ltd | Lsiのレイアウト方法 |
JP2508206B2 (ja) * | 1988-07-28 | 1996-06-19 | 日本電気株式会社 | 集積回路装置 |
DE69031609T2 (de) * | 1989-04-19 | 1998-03-12 | Seiko Epson Corp | Halbleiteranordnung |
JP2573414B2 (ja) * | 1990-11-21 | 1997-01-22 | 株式会社東芝 | 半導体集積回路製造方法 |
JP2509755B2 (ja) * | 1990-11-22 | 1996-06-26 | 株式会社東芝 | 半導体集積回路製造方法 |
JP3027990B2 (ja) * | 1991-03-18 | 2000-04-04 | 富士通株式会社 | 半導体装置の製造方法 |
JP2742735B2 (ja) * | 1991-07-30 | 1998-04-22 | 三菱電機株式会社 | 半導体集積回路装置およびそのレイアウト設計方法 |
JP2757647B2 (ja) * | 1992-01-27 | 1998-05-25 | 日本電気株式会社 | メッキ膜厚均一化方式 |
US7068270B1 (en) * | 1994-12-02 | 2006-06-27 | Texas Instruments Incorporated | Design of integrated circuit package using parametric solids modeller |
US5798541A (en) * | 1994-12-02 | 1998-08-25 | Intel Corporation | Standard semiconductor cell with contoured cell boundary to increase device density |
US5682323A (en) | 1995-03-06 | 1997-10-28 | Lsi Logic Corporation | System and method for performing optical proximity correction on macrocell libraries |
US5768146A (en) * | 1995-03-28 | 1998-06-16 | Intel Corporation | Method of cell contouring to increase device density |
GB2300983A (en) * | 1995-05-13 | 1996-11-20 | Holtek Microelectronics Inc | Flexible CMOS IC layout method |
US5909376A (en) * | 1995-11-20 | 1999-06-01 | Lsi Logic Corporation | Physical design automation system and process for designing integrated circuit chips using highly parallel sieve optimization with multiple "jiggles" |
US6025616A (en) * | 1997-06-25 | 2000-02-15 | Honeywell Inc. | Power distribution system for semiconductor die |
JP2000068488A (ja) * | 1998-08-20 | 2000-03-03 | Oki Electric Ind Co Ltd | 半導体集積回路のレイアウト方法 |
JP3186715B2 (ja) * | 1998-10-29 | 2001-07-11 | 日本電気株式会社 | 半導体集積回路装置 |
US6838713B1 (en) | 1999-07-12 | 2005-01-04 | Virage Logic Corporation | Dual-height cell with variable width power rail architecture |
JP4521088B2 (ja) * | 2000-03-27 | 2010-08-11 | 株式会社東芝 | 半導体装置 |
JP2006156929A (ja) * | 2004-04-19 | 2006-06-15 | Fujitsu Ltd | 半導体集積回路及びその設計方法 |
US7149142B1 (en) | 2004-05-28 | 2006-12-12 | Virage Logic Corporation | Methods and apparatuses for memory array leakage reduction using internal voltage biasing circuitry |
US20060208317A1 (en) * | 2005-03-17 | 2006-09-21 | Tsuoe-Hsiang Liao | Layout structure of semiconductor cells |
US7616036B1 (en) | 2005-09-12 | 2009-11-10 | Virage Logic Corporation | Programmable strobe and clock generator |
JP2011242541A (ja) * | 2010-05-17 | 2011-12-01 | Panasonic Corp | 半導体集積回路装置、および標準セルの端子構造 |
US9238367B2 (en) * | 2013-03-15 | 2016-01-19 | Ricoh Company, Ltd. | Droplet discharging head and image forming apparatus |
US10490543B2 (en) * | 2017-12-05 | 2019-11-26 | Qualcomm Incorporated | Placement methodology to remove filler |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1440512A (en) * | 1973-04-30 | 1976-06-23 | Rca Corp | Universal array using complementary transistors |
US4161662A (en) * | 1976-01-22 | 1979-07-17 | Motorola, Inc. | Standardized digital logic chip |
US4125854A (en) * | 1976-12-02 | 1978-11-14 | Mostek Corporation | Symmetrical cell layout for static RAM |
US4240097A (en) * | 1977-05-31 | 1980-12-16 | Texas Instruments Incorporated | Field-effect transistor structure in multilevel polycrystalline silicon |
GB2018021B (en) * | 1978-04-01 | 1982-10-13 | Racal Microelect System | Uncommitted logic cells |
JPS58119649A (ja) * | 1982-01-08 | 1983-07-16 | Mitsubishi Electric Corp | 半導体集積回路装置 |
US4566022A (en) * | 1983-01-27 | 1986-01-21 | International Business Machines Corporation | Flexible/compressed array macro design |
-
1984
- 1984-06-29 JP JP59135410A patent/JPS6114734A/ja active Granted
-
1985
- 1985-06-12 KR KR1019850004145A patent/KR900000202B1/ko not_active IP Right Cessation
- 1985-06-25 US US06/748,599 patent/US4701778A/en not_active Expired - Lifetime
- 1985-06-27 CA CA000485482A patent/CA1219380A/en not_active Expired
- 1985-06-28 DE DE8585304629T patent/DE3571102D1/de not_active Expired
- 1985-06-28 EP EP85304629A patent/EP0167365B1/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100475504B1 (ko) * | 2002-01-23 | 2005-03-10 | 미쓰비시덴키 가부시키가이샤 | 반도체 집적 회로 |
Also Published As
Publication number | Publication date |
---|---|
JPH0527981B2 (ko) | 1993-04-22 |
EP0167365A3 (en) | 1986-03-26 |
US4701778A (en) | 1987-10-20 |
JPS6114734A (ja) | 1986-01-22 |
EP0167365B1 (en) | 1989-06-14 |
KR900000202B1 (ko) | 1990-01-23 |
DE3571102D1 (en) | 1989-07-20 |
EP0167365A2 (en) | 1986-01-08 |
CA1219380A (en) | 1987-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19921110 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |