KR860005443A - 반도체 메모리장치 및 그의 제조방법 - Google Patents

반도체 메모리장치 및 그의 제조방법

Info

Publication number
KR860005443A
KR860005443A KR1019850010028A KR850010028A KR860005443A KR 860005443 A KR860005443 A KR 860005443A KR 1019850010028 A KR1019850010028 A KR 1019850010028A KR 850010028 A KR850010028 A KR 850010028A KR 860005443 A KR860005443 A KR 860005443A
Authority
KR
South Korea
Prior art keywords
manufacturing
memory device
semiconductor memory
semiconductor
memory
Prior art date
Application number
KR1019850010028A
Other languages
English (en)
Other versions
KR900008649B1 (ko
Inventor
마사오 타구찌
Original Assignee
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤 filed Critical 후지쓰 가부시끼가이샤
Publication of KR860005443A publication Critical patent/KR860005443A/ko
Application granted granted Critical
Publication of KR900008649B1 publication Critical patent/KR900008649B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0387—Making the trench

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1019850010028A 1984-12-29 1985-12-28 반도체 메모리장치 및 그의 제조방법 KR900008649B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59279911A JPS61179568A (ja) 1984-12-29 1984-12-29 半導体記憶装置の製造方法
JP59-279911 1984-12-29

Publications (2)

Publication Number Publication Date
KR860005443A true KR860005443A (ko) 1986-07-23
KR900008649B1 KR900008649B1 (ko) 1990-11-26

Family

ID=17617629

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850010028A KR900008649B1 (ko) 1984-12-29 1985-12-28 반도체 메모리장치 및 그의 제조방법

Country Status (6)

Country Link
US (1) US5006910A (ko)
EP (1) EP0187596B1 (ko)
JP (1) JPS61179568A (ko)
KR (1) KR900008649B1 (ko)
CA (1) CA1261469A (ko)
DE (1) DE3588050T2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100268907B1 (ko) * 1998-03-13 2000-11-01 김영환 반도체소자의격리막및이의형성방법

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685427B2 (ja) * 1986-03-13 1994-10-26 三菱電機株式会社 半導体記憶装置
US5182227A (en) * 1986-04-25 1993-01-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
US6028346A (en) * 1986-04-25 2000-02-22 Mitsubishi Denki Kabushiki Kaisha Isolated trench semiconductor device
JPS63124454A (ja) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp 半導体記憶装置
JPH0810755B2 (ja) * 1986-10-22 1996-01-31 沖電気工業株式会社 半導体メモリの製造方法
US5250458A (en) * 1987-02-25 1993-10-05 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing semiconductor memory device having stacked memory capacitors
JPH0795568B2 (ja) * 1987-04-27 1995-10-11 日本電気株式会社 半導体記憶装置
JPH01287956A (ja) * 1987-07-10 1989-11-20 Toshiba Corp 半導体記憶装置およびその製造方法
JPH07105476B2 (ja) * 1987-09-29 1995-11-13 株式会社東芝 半導体記憶装置
US5258321A (en) * 1988-01-14 1993-11-02 Mitsubishi Denki Kabushiki Kaisha Manufacturing method for semiconductor memory device having stacked trench capacitors and improved intercell isolation
KR910000246B1 (ko) * 1988-02-15 1991-01-23 삼성전자 주식회사 반도체 메모리장치
US5701022A (en) * 1989-05-22 1997-12-23 Siemens Aktiengesellschaft Semiconductor memory device with trench capacitor
DE58909255D1 (de) * 1989-05-22 1995-06-29 Siemens Ag Halbleiterspeicheranordnung mit Kondensatoren mir zwei in einem Graben angeordneten Elektroden und Verfahren zu deren Herstellung.
US5111259A (en) * 1989-07-25 1992-05-05 Texas Instruments Incorporated Trench capacitor memory cell with curved capacitors
DE3932683A1 (de) * 1989-09-29 1991-04-11 Siemens Ag Verfahren zur herstellung eines grabenkondensators einer ein-transistor-speicherzelle in einem halbleitersubstrat mit einer selbstjustierten kondensator-gegenelektrode
JPH0449654A (ja) * 1990-06-19 1992-02-19 Nec Corp 半導体メモリ
US5295395A (en) * 1991-02-07 1994-03-22 Hocker G Benjamin Diaphragm-based-sensors
KR940006681B1 (ko) * 1991-10-12 1994-07-25 금성일렉트론 주식회사 스택트렌치 셀 및 그 제조방법
US5363327A (en) * 1993-01-19 1994-11-08 International Business Machines Corporation Buried-sidewall-strap two transistor one capacitor trench cell
US5998821A (en) * 1997-05-21 1999-12-07 Kabushiki Kaisha Toshiba Dynamic ram structure having a trench capacitor
US6440794B1 (en) 1999-05-28 2002-08-27 International Business Machines Corporation Method for forming an array of DRAM cells by employing a self-aligned adjacent node isolation technique
US20030052365A1 (en) * 2001-09-18 2003-03-20 Samir Chaudhry Structure and fabrication method for capacitors integratible with vertical replacement gate transistors
JP4969771B2 (ja) * 2004-07-12 2012-07-04 ソニー株式会社 固体撮像装置及びそのキャパシタ調整方法
JP6480300B2 (ja) 2015-10-16 2019-03-06 株式会社スギノマシン ノズル体を装着できる工作機械

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681968A (en) * 1979-12-07 1981-07-04 Toshiba Corp Manufacture of semiconductor device
JPS5797210A (en) * 1980-12-08 1982-06-16 Sanyo Electric Co Ltd Amplifier
JPS58220444A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 半導体装置の製造方法
JPS5963757A (ja) * 1982-10-04 1984-04-11 Nippon Telegr & Teleph Corp <Ntt> 半導体装置およびその製造方法
JPH0666436B2 (ja) * 1983-04-15 1994-08-24 株式会社日立製作所 半導体集積回路装置
JPH0665225B2 (ja) * 1984-01-13 1994-08-22 株式会社東芝 半導体記憶装置の製造方法
JPS60152058A (ja) * 1984-01-20 1985-08-10 Toshiba Corp 半導体記憶装置
US4688063A (en) * 1984-06-29 1987-08-18 International Business Machines Corporation Dynamic ram cell with MOS trench capacitor in CMOS
JPS6187358A (ja) * 1984-10-05 1986-05-02 Nec Corp 半導体記憶装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100268907B1 (ko) * 1998-03-13 2000-11-01 김영환 반도체소자의격리막및이의형성방법

Also Published As

Publication number Publication date
CA1261469A (en) 1989-09-26
JPS61179568A (ja) 1986-08-12
DE3588050T2 (de) 1996-01-18
US5006910A (en) 1991-04-09
DE3588050D1 (de) 1995-09-28
EP0187596A3 (en) 1987-01-07
EP0187596A2 (en) 1986-07-16
EP0187596B1 (en) 1995-08-23
KR900008649B1 (ko) 1990-11-26
JPH0365905B2 (ko) 1991-10-15

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