KR880004565A - 와이어본딩장치 - Google Patents

와이어본딩장치

Info

Publication number
KR880004565A
KR880004565A KR1019870009698A KR870009698A KR880004565A KR 880004565 A KR880004565 A KR 880004565A KR 1019870009698 A KR1019870009698 A KR 1019870009698A KR 870009698 A KR870009698 A KR 870009698A KR 880004565 A KR880004565 A KR 880004565A
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding device
wire
bonding
Prior art date
Application number
KR1019870009698A
Other languages
English (en)
Other versions
KR900007688B1 (ko
Inventor
가즈유키 야마나카
Original Assignee
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도시바 filed Critical 가부시키가이샤 도시바
Publication of KR880004565A publication Critical patent/KR880004565A/ko
Application granted granted Critical
Publication of KR900007688B1 publication Critical patent/KR900007688B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1019870009698A 1986-09-02 1987-09-02 와이어본딩장치 KR900007688B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-206555 1986-09-02
JP61206555A JPS6362242A (ja) 1986-09-02 1986-09-02 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
KR880004565A true KR880004565A (ko) 1988-06-07
KR900007688B1 KR900007688B1 (ko) 1990-10-18

Family

ID=16525330

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870009698A KR900007688B1 (ko) 1986-09-02 1987-09-02 와이어본딩장치

Country Status (5)

Country Link
US (1) US4855928A (ko)
EP (1) EP0262777B1 (ko)
JP (1) JPS6362242A (ko)
KR (1) KR900007688B1 (ko)
DE (1) DE3785129T2 (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708795C2 (de) * 1987-03-18 1995-08-03 Gsf Forschungszentrum Umwelt Verfahren zur Größenselektion in Videoechtzeit
EP0341944A3 (en) * 1988-05-10 1991-06-26 Gec Plessey Telecommunications Limited Improvements in or relating to methods of and apparatus for registration
US4972311A (en) * 1988-08-15 1990-11-20 Kulicke And Soffa Industries Inc. X-Y table error mapping apparatus and method
JP2534132B2 (ja) * 1989-05-15 1996-09-11 株式会社新川 ボンデイング方法
JPH039540A (ja) * 1989-06-07 1991-01-17 Shinkawa Ltd ワイヤボンデイング方法
JPH07111998B2 (ja) * 1989-08-18 1995-11-29 株式会社東芝 ワイヤボンディング検査装置
JP2668734B2 (ja) * 1989-10-23 1997-10-27 株式会社新川 ワイヤボンデイング方法
US5043589A (en) * 1990-05-18 1991-08-27 Trigon/Adcotech Semiconductor device inspection apparatus using a plurality of reflective elements
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
US5119436A (en) * 1990-09-24 1992-06-02 Kulicke And Soffa Industries, Inc Method of centering bond positions
JP2913565B2 (ja) * 1991-01-31 1999-06-28 株式会社新川 ワイヤループ曲がり検査方法及びその装置
US5216277A (en) * 1991-10-31 1993-06-01 National Semiconductor Corporation Lead frames with location eye point markings
JPH07144180A (ja) * 1992-08-21 1995-06-06 Supply Control:Kk 洗浄器
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
DE69311347T2 (de) * 1993-11-30 1997-09-18 Sgs Thomson Microelectronics Einrichtung für die elektrische Verbindung von integrierten Schaltungen
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US5702049A (en) * 1995-06-07 1997-12-30 West Bond Inc. Angled wire bonding tool and alignment method
US5951475A (en) * 1997-09-25 1999-09-14 International Business Machines Corporation Methods and apparatus for registering CT-scan data to multiple fluoroscopic images
US6299050B1 (en) 2000-02-24 2001-10-09 Hitachi, Ltd. Friction stir welding apparatus and method
US6381016B1 (en) * 2000-07-14 2002-04-30 Advanced Micro Devices, Inc. Lead width inspection system and methods
JP4547117B2 (ja) * 2001-09-25 2010-09-22 株式会社雄島試作研究所 位置決め機構の制御装置
EP1346793A1 (de) * 2002-03-19 2003-09-24 ESEC Trading S.A. Verfahren und Einrichtung für die Bestimmung der vektoriellen Distanz zwischen der Kapillare und dem Bilderkennungssystem eines Wire Bonders
TWI221648B (en) * 2002-03-19 2004-10-01 Esec Trading Sa Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
US12118726B2 (en) * 2021-01-15 2024-10-15 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070117A (en) * 1972-06-12 1978-01-24 Kasper Instruments, Inc. Apparatus for the automatic alignment of two superimposed objects, e.g. a semiconductor wafer and mask
JPS5080763A (ko) * 1973-11-14 1975-07-01
US4163212A (en) * 1977-09-08 1979-07-31 Excellon Industries Pattern recognition system
US4233625A (en) * 1978-11-03 1980-11-11 Teledyne, Inc. Television monitoring system for automatically aligning semiconductor devices during manufacture
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
EP0041870B1 (en) * 1980-06-10 1986-12-30 Fujitsu Limited Pattern position recognition apparatus
JPS57157378A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Setting method of binary-coded threshold level
JPS5951536A (ja) * 1982-09-14 1984-03-26 Fujitsu Ltd パタ−ン認識方法及びその装置
US4672557A (en) * 1983-03-26 1987-06-09 Disco Abrasive Systems, Ltd. Automatic accurate alignment system
JPS61102747A (ja) * 1984-10-26 1986-05-21 Marine Instr Co Ltd ワイヤ−ボンダ−の認識パタ−ン変更方法
JPS61190953A (ja) * 1985-02-20 1986-08-25 Hitachi Tokyo Electronics Co Ltd ワイヤボンダ
US4750836A (en) * 1986-09-18 1988-06-14 Rca Corporation Method of measuring misalignment between superimposed patterns

Also Published As

Publication number Publication date
EP0262777A2 (en) 1988-04-06
DE3785129D1 (de) 1993-05-06
EP0262777A3 (en) 1989-08-23
JPH0453094B2 (ko) 1992-08-25
KR900007688B1 (ko) 1990-10-18
EP0262777B1 (en) 1993-03-31
JPS6362242A (ja) 1988-03-18
DE3785129T2 (de) 1993-07-15
US4855928A (en) 1989-08-08

Similar Documents

Publication Publication Date Title
KR880004565A (ko) 와이어본딩장치
DK44687A (da) Kobberledermaterialer
ES2019580B3 (es) Dispositivo dador
ES2016810B3 (es) Dispositivo conexionador no torsionable
DK297187D0 (da) Regnbuedannende anordning
KR900005726U (ko) 전선접속장치
IT1211455B (it) Dispositivo di collegamento
KR900015298A (ko) 와이어 본딩방법
KR880701017A (ko) 반도체 장치
KR860007728A (ko) 반도체 장치용 본딍 와이어
DE3782162D1 (de) Bonddraht.
KR900702252A (ko) 접착장치
KR890004438A (ko) 반도체 장치
KR890005864A (ko) 반도체 장치
BR8703368A (pt) Dispositivo vibro-estimulador
DK360387A (da) Bestraalingsanordning
KR880701456A (ko) 반도체 소자
KR900702251A (ko) 접착장치
KR900700217A (ko) 반도체 소자용 접합 와이어
KR890702222A (ko) 전선
KR900010966A (ko) 다이 본딩 장치
KR880013695U (ko) 전선 접속 장치
KR880003791U (ko) 반도체장치
KR880014453U (ko) 리드선 고정장치
KR860002038U (ko) 리드선 고정 장치

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030930

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee