KR900015298A - 와이어 본딩방법 - Google Patents

와이어 본딩방법

Info

Publication number
KR900015298A
KR900015298A KR1019900002925A KR900002925A KR900015298A KR 900015298 A KR900015298 A KR 900015298A KR 1019900002925 A KR1019900002925 A KR 1019900002925A KR 900002925 A KR900002925 A KR 900002925A KR 900015298 A KR900015298 A KR 900015298A
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding method
wire
bonding
Prior art date
Application number
KR1019900002925A
Other languages
English (en)
Other versions
KR930002808B1 (ko
Inventor
유우지 오오바시
노부또 야마자끼
Original Assignee
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 신가와 filed Critical 가부시끼가이샤 신가와
Publication of KR900015298A publication Critical patent/KR900015298A/ko
Application granted granted Critical
Publication of KR930002808B1 publication Critical patent/KR930002808B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1019900002925A 1989-03-06 1990-03-06 와이어 본딩방법 KR930002808B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP51973/89 1989-03-06
JP1051973A JP2736914B2 (ja) 1989-03-06 1989-03-06 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
KR900015298A true KR900015298A (ko) 1990-10-26
KR930002808B1 KR930002808B1 (ko) 1993-04-10

Family

ID=12901817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900002925A KR930002808B1 (ko) 1989-03-06 1990-03-06 와이어 본딩방법

Country Status (3)

Country Link
US (1) US5078312A (ko)
JP (1) JP2736914B2 (ko)
KR (1) KR930002808B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2762526B2 (ja) * 1989-03-14 1998-06-04 日本電気株式会社 ワイヤボンディング方法
JPH05235077A (ja) * 1991-04-26 1993-09-10 Texas Instr Inc <Ti> 半導体デバイスボンディング用の極座標運動ボンディングヘッド
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
JPH0547860A (ja) * 1991-08-08 1993-02-26 Shinkawa Ltd ワイヤボンデイング方法
EP0540189B1 (en) * 1991-10-30 1997-01-15 F &amp; K Delvotec Bondtechnik GmbH Control system
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
JP3128715B2 (ja) * 1992-12-24 2001-01-29 株式会社新川 ボンデイング装置
US5586713A (en) * 1993-08-31 1996-12-24 Matsushita Electric Industrial Co., Ltd. Method for wire bonding
JP3504448B2 (ja) * 1996-10-17 2004-03-08 株式会社ルネサステクノロジ 半導体装置
JP2006303168A (ja) * 2005-04-20 2006-11-02 Sharp Takaya Denshi Kogyo Kk ワイヤボンディング方法及び装置
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
JPS5816539A (ja) * 1981-07-22 1983-01-31 Nec Corp ワイヤ−ボンデイング装置
JPS61166139A (ja) * 1985-01-18 1986-07-26 Hitachi Ltd テ−プキヤリアボンダ
JPH0618222B2 (ja) * 1985-09-02 1994-03-09 日立東京エレクトロニクス株式会社 ワイヤボンディング装置
JPS62247538A (ja) * 1987-01-09 1987-10-28 Hitachi Ltd ワイヤボンデイング装置
JPS63194343A (ja) * 1987-02-09 1988-08-11 Toshiba Corp ワイヤボンディング装置の制御方法
JPH01244626A (ja) * 1988-03-25 1989-09-29 Mitsubishi Electric Corp ワイヤボンデイング方法

Also Published As

Publication number Publication date
JP2736914B2 (ja) 1998-04-08
KR930002808B1 (ko) 1993-04-10
US5078312A (en) 1992-01-07
JPH02231736A (ja) 1990-09-13

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080303

Year of fee payment: 17

EXPY Expiration of term