KR900012341A - 와이어 본딩방법 및 그 장치 - Google Patents

와이어 본딩방법 및 그 장치

Info

Publication number
KR900012341A
KR900012341A KR1019890016284A KR890016284A KR900012341A KR 900012341 A KR900012341 A KR 900012341A KR 1019890016284 A KR1019890016284 A KR 1019890016284A KR 890016284 A KR890016284 A KR 890016284A KR 900012341 A KR900012341 A KR 900012341A
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding method
wire
bonding
Prior art date
Application number
KR1019890016284A
Other languages
English (en)
Other versions
KR930001264B1 (ko
Inventor
나오끼 미야사끼
가즈히로 가와베다
Original Assignee
미쓰비시뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰비시뎅끼 가부시끼가이샤 filed Critical 미쓰비시뎅끼 가부시끼가이샤
Publication of KR900012341A publication Critical patent/KR900012341A/ko
Application granted granted Critical
Publication of KR930001264B1 publication Critical patent/KR930001264B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1019890016284A 1989-01-07 1989-11-10 와이어 본딩방법 및 그 장치 KR930001264B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1001618A JPH06101491B2 (ja) 1989-01-07 1989-01-07 ワイヤボンデイング方法及びその装置
JP89-1618 1989-01-07

Publications (2)

Publication Number Publication Date
KR900012341A true KR900012341A (ko) 1990-08-03
KR930001264B1 KR930001264B1 (ko) 1993-02-22

Family

ID=11506512

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890016284A KR930001264B1 (ko) 1989-01-07 1989-11-10 와이어 본딩방법 및 그 장치

Country Status (4)

Country Link
US (1) US5212361A (ko)
JP (1) JPH06101491B2 (ko)
KR (1) KR930001264B1 (ko)
BR (1) BR9000031A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722456A (ja) * 1993-06-30 1995-01-24 Mitsubishi Electric Corp ワイヤボンディングにおけるボール形成装置、その制御方法及びワイヤボンディング装置
JP3286141B2 (ja) * 1995-12-27 2002-05-27 株式会社東芝 ワイヤボンディング装置
US6062462A (en) * 1997-08-12 2000-05-16 Kulicke And Soffa Investments, Inc. Apparatus and method for making predetermined fine wire ball sizes
US7271365B2 (en) 2005-04-11 2007-09-18 Lincoln Global, Inc. System and method for pulse welding
CN100335222C (zh) * 2005-07-14 2007-09-05 上海交通大学 熔化极气保护电弧焊连续脉冲回烧电压去球的控制方法
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
CN105728899B (zh) * 2016-03-31 2017-10-31 唐山松下产业机器有限公司 脉冲焊接设备及其控制方法
CN106695081B (zh) * 2017-03-21 2022-04-29 温州职业技术学院 一种全自动球体焊接设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4482794A (en) * 1983-11-28 1984-11-13 Fairchild Camera & Instrument Corporation Pulse-width control of bonding ball formation
US4687897A (en) * 1986-11-24 1987-08-18 Rockwell International Corporation Flame-off limited circuit for wire bonding ball forming apparatus
US4866247A (en) * 1986-12-11 1989-09-12 The Lincoln Electric Company Apparatus and method of short circuiting arc welding

Also Published As

Publication number Publication date
JPH02181943A (ja) 1990-07-16
JPH06101491B2 (ja) 1994-12-12
KR930001264B1 (ko) 1993-02-22
US5212361A (en) 1993-05-18
BR9000031A (pt) 1990-10-09

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A201 Request for examination
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Payment date: 20080205

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