DE69500635D1 - Einpunkt Bondverfahren - Google Patents

Einpunkt Bondverfahren

Info

Publication number
DE69500635D1
DE69500635D1 DE69500635T DE69500635T DE69500635D1 DE 69500635 D1 DE69500635 D1 DE 69500635D1 DE 69500635 T DE69500635 T DE 69500635T DE 69500635 T DE69500635 T DE 69500635T DE 69500635 D1 DE69500635 D1 DE 69500635D1
Authority
DE
Germany
Prior art keywords
single point
bond process
point bond
point
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69500635T
Other languages
English (en)
Other versions
DE69500635T2 (de
Inventor
Michitaka Urushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69500635D1 publication Critical patent/DE69500635D1/de
Application granted granted Critical
Publication of DE69500635T2 publication Critical patent/DE69500635T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE69500635T 1994-03-30 1995-03-30 Einpunkt Bondverfahren Expired - Fee Related DE69500635T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6061739A JP2674501B2 (ja) 1994-03-30 1994-03-30 シングル・ポイント・ボンディング方法

Publications (2)

Publication Number Publication Date
DE69500635D1 true DE69500635D1 (de) 1997-10-09
DE69500635T2 DE69500635T2 (de) 1998-04-02

Family

ID=13179869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500635T Expired - Fee Related DE69500635T2 (de) 1994-03-30 1995-03-30 Einpunkt Bondverfahren

Country Status (6)

Country Link
US (1) US5662263A (de)
EP (1) EP0675533B1 (de)
JP (1) JP2674501B2 (de)
KR (1) KR0149814B1 (de)
DE (1) DE69500635T2 (de)
TW (1) TW299489B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004644B1 (en) * 1999-06-29 2006-02-28 Finisar Corporation Hermetic chip-scale package for photonic devices
KR20020069884A (ko) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 반도체패키지의 와이어 본딩 방법
JP2003007773A (ja) * 2001-06-25 2003-01-10 Nec Corp ボンディングツールおよびボンディング方法
US7005729B2 (en) * 2002-04-24 2006-02-28 Intel Corporation Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
US20060021901A1 (en) * 2004-08-02 2006-02-02 Sven Dobler Removable sampler
US8912667B2 (en) * 2012-01-31 2014-12-16 Freescale Semiconductor, Inc. Packaged integrated circuit using wire bonds

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921055A (ja) * 1982-07-26 1984-02-02 Nec Corp 半導体装置
JPH0424933A (ja) * 1990-05-15 1992-01-28 Toshiba Corp シングルポイントｔａｂ方法
JPH0574875A (ja) * 1991-09-12 1993-03-26 Nec Corp Ｔａｂインナーリードの接合方法
JPH05183020A (ja) * 1991-12-27 1993-07-23 Nec Kansai Ltd Ｔａｂリード型半導体装置の製造方法
JPH06151512A (ja) * 1992-10-30 1994-05-31 Nec Corp Ｔａｂテープおよびｔａｂインナーリードの接合方法
US5269452A (en) * 1992-11-12 1993-12-14 Northern Telecom Limited Method and apparatus for wirebonding

Also Published As

Publication number Publication date
EP0675533B1 (de) 1997-09-03
KR950028594A (ko) 1995-10-18
EP0675533A1 (de) 1995-10-04
TW299489B (de) 1997-03-01
JPH07273144A (ja) 1995-10-20
DE69500635T2 (de) 1998-04-02
JP2674501B2 (ja) 1997-11-12
KR0149814B1 (ko) 1998-12-01
US5662263A (en) 1997-09-02

Similar Documents

Publication Publication Date Title
FI955927A (fi) Substituoidut 1H-imidatsolit
ATA163695A (de) 2-hydroxyphenyltriazine
DE69534718D1 (de) Substituierte 9-alkyladenine
BR9508318A (pt) Composição impadora concentrada
DE69520558D1 (de) Halogenierungsverfahren
DE69507032D1 (de) Chlorhydrin-verfahren
NO20003079D0 (no) Polymerisasjon-oppstartningsprosess
DE59600552D1 (de) Spannvorrichtung
ATA108995A (de) Differenzdruckakkumulator
DE69500635T2 (de) Einpunkt Bondverfahren
NO20003080D0 (no) Polymerisasjon-oppstartningsprosess
DE29503122U1 (de) Sonotrode
BR9509559A (pt) Azolilulsolfonilfeniluracilas substituídas
DE69501339D1 (de) Alkoxylierungsverfahren
DE59606760D1 (de) Spannvorrichtung
ATA42094A (de) Likör
DE29509364U1 (de) Spannvorrichtung
DE29518660U1 (de) Spannvorrichtung
DE19581745T1 (de) Verkapselungsverfahren
FI974067A0 (fi) Process foer cellulasbehandling
DE59510274D1 (de) Substituierte biphenyloxazoline
DE29504168U1 (de) Formularsatz
DE29513131U1 (de) Spannvorrichtung
DE29511543U1 (de) Spannvorrichtung
KR960003751U (ko) 양산

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee