KR900700217A - 반도체 소자용 접합 와이어 - Google Patents

반도체 소자용 접합 와이어

Info

Publication number
KR900700217A
KR900700217A KR1019890702503A KR890702503A KR900700217A KR 900700217 A KR900700217 A KR 900700217A KR 1019890702503 A KR1019890702503 A KR 1019890702503A KR 890702503 A KR890702503 A KR 890702503A KR 900700217 A KR900700217 A KR 900700217A
Authority
KR
South Korea
Prior art keywords
semiconductor devices
bonding wire
bonding
wire
semiconductor
Prior art date
Application number
KR1019890702503A
Other languages
English (en)
Other versions
KR930001265B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR900700217A publication Critical patent/KR900700217A/ko
Application granted granted Critical
Publication of KR930001265B1 publication Critical patent/KR930001265B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B23B5/08—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor for turning axles, bars, rods, tubes, rolls, i.e. shaft-turning lathes, roll lathes; Centreless turning
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1019890702503A 1988-05-02 1989-05-02 반도체 소자용 접합 와이어 KR930001265B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP88-109587 1988-05-02
JP10958788 1988-05-02
PCT/JP1989/000463 WO1989011161A1 (en) 1988-05-02 1989-05-02 Bonding wire for semiconductor elements

Publications (2)

Publication Number Publication Date
KR900700217A true KR900700217A (ko) 1990-08-11
KR930001265B1 KR930001265B1 (ko) 1993-02-22

Family

ID=14514045

Family Applications (1)

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KR1019890702503A KR930001265B1 (ko) 1988-05-02 1989-05-02 반도체 소자용 접합 와이어

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JP (1) JP2745065B2 (ko)
KR (1) KR930001265B1 (ko)
DE (1) DE3990432C1 (ko)
GB (1) GB2229859B (ko)
WO (1) WO1989011161A1 (ko)

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Publication number Priority date Publication date Assignee Title
JPH10233408A (ja) * 1997-02-21 1998-09-02 Nec Corp 金属接合構造及び半導体装置
JP3426473B2 (ja) * 1997-07-01 2003-07-14 新日本製鐵株式会社 半導体素子用金合金細線
DE19740004A1 (de) * 1997-09-11 1998-11-19 Siemens Ag Bonddraht
DE19753055B4 (de) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Feinstdraht aus einer Gold-Legierung, Verfahren zu seiner Herstellung und seine Verwendung

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US3769006A (en) * 1972-01-27 1973-10-30 Gold Refining W Co Bright cast alloy, and composition
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS55127041A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Resin-sealed semiconductor device
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
JPS5676556A (en) * 1979-11-28 1981-06-24 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
DE3153395C2 (en) * 1981-02-12 1987-11-19 W.C. Heraeus Gmbh, 6450 Hanau, De Use of a very fine wire made of a copper/tin alloy
DD201156A1 (de) * 1981-10-02 1983-07-06 Daut Hans Heiner Edelmetallegierungen fuer mikrodrahtwerkstoffe
US4490504A (en) * 1983-08-15 1984-12-25 General Electric Company Flame retardant non-dripping polycarbonate compositions
JPS6049534A (ja) * 1983-08-26 1985-03-18 三菱電機株式会社 回路しや断器
EP0288776A3 (en) * 1987-04-28 1989-03-22 Texas Instruments Incorporated Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
JPH0221201A (ja) * 1988-08-25 1990-01-24 Amada Co Ltd 加工機械用距離検出装置

Also Published As

Publication number Publication date
KR930001265B1 (ko) 1993-02-22
GB2229859B (en) 1993-01-06
JP2745065B2 (ja) 1998-04-28
WO1989011161A1 (en) 1989-11-16
GB2229859A (en) 1990-10-03
GB8928848D0 (en) 1990-06-13
DE3990432C1 (de) 1994-06-23
JPH02119148A (ja) 1990-05-07

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