DK44687A - Kobberledermaterialer - Google Patents

Kobberledermaterialer

Info

Publication number
DK44687A
DK44687A DK044687A DK44687A DK44687A DK 44687 A DK44687 A DK 44687A DK 044687 A DK044687 A DK 044687A DK 44687 A DK44687 A DK 44687A DK 44687 A DK44687 A DK 44687A
Authority
DK
Denmark
Prior art keywords
copper wire
wire materials
materials
copper
wire
Prior art date
Application number
DK044687A
Other languages
English (en)
Other versions
DK44687D0 (da
Inventor
Vincent Paul Siuta
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of DK44687D0 publication Critical patent/DK44687D0/da
Publication of DK44687A publication Critical patent/DK44687A/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Glass Compositions (AREA)
DK044687A 1986-01-29 1987-01-28 Kobberledermaterialer DK44687A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/823,657 US4687597A (en) 1986-01-29 1986-01-29 Copper conductor compositions

Publications (2)

Publication Number Publication Date
DK44687D0 DK44687D0 (da) 1987-01-28
DK44687A true DK44687A (da) 1987-07-30

Family

ID=25239342

Family Applications (1)

Application Number Title Priority Date Filing Date
DK044687A DK44687A (da) 1986-01-29 1987-01-28 Kobberledermaterialer

Country Status (9)

Country Link
US (1) US4687597A (da)
EP (1) EP0240654B1 (da)
JP (1) JPH0727727B2 (da)
KR (1) KR900006510B1 (da)
CA (1) CA1278912C (da)
DE (1) DE3770309D1 (da)
DK (1) DK44687A (da)
GR (1) GR3002071T3 (da)
IE (1) IE59654B1 (da)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167702A (ja) * 1984-09-07 1986-04-07 Mitsui Mining & Smelting Co Ltd 導電性粉末及びこれを用いた導電性組成物
JPS6355807A (ja) * 1986-08-27 1988-03-10 古河電気工業株式会社 導電性ペ−スト
US4871608A (en) * 1986-12-10 1989-10-03 Ngk Spark Plug Co., Ltd. High-density wiring multilayered substrate
US4877555A (en) * 1987-04-13 1989-10-31 Matsushita Electric Industrial Co., Ltd. Conductor composition and method of manufacturing a ceramic multilayer structure using the same
JPH0753625B2 (ja) * 1987-10-12 1995-06-07 日本特殊陶業株式会社 セラミック用メタライズ組成物
JPH075410B2 (ja) * 1987-12-24 1995-01-25 日本特殊陶業株式会社 セラミック用メタライズ組成物
JPH0812801B2 (ja) * 1988-01-11 1996-02-07 株式会社日立製作所 ハイブリットｉｃ用基板とそれを用いたハイブリットｉｃ及びその装置
JPH01192781A (ja) * 1988-01-26 1989-08-02 Dai Ichi Kogyo Seiyaku Co Ltd 銅厚膜導体組成物
US4814107A (en) * 1988-02-12 1989-03-21 Heraeus Incorporated Cermalloy Division Nitrogen fireable resistor compositions
US4859364A (en) * 1988-05-25 1989-08-22 E. I. Du Pont De Nemours And Company Conductive paste composition
US4937016A (en) * 1989-02-01 1990-06-26 Dai-Ichi Kogyo Seiyaku Co., Ltd. Copper conductor composition
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP2657008B2 (ja) * 1991-06-26 1997-09-24 日本特殊陶業株式会社 セラミックス用メタライズ組成物
US5182926A (en) * 1991-09-16 1993-02-02 Nestec S.A. Recovery of aroma gases
US5336444A (en) * 1992-05-29 1994-08-09 International Business Machines Corporation Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
US6468448B1 (en) * 1999-10-22 2002-10-22 Matsushita Electric Industrial Co., Ltd. Conductive composition, conductive adhesive, and their mounting structure
US6663799B2 (en) 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
US6583201B2 (en) 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
EP2706538A3 (en) * 2012-09-10 2014-04-23 Heraeus Precious Metals North America Conshohocken LLC Low firing temperature copper composition
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
KR102360657B1 (ko) 2016-07-28 2022-02-08 내셔날 리서치 카운실 오브 캐나다 구리 잉크 및 이로부터 제조되는 전도성 납땜가능한 구리 트레이스
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨
TW201842088A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 可印刷分子油墨
TW201842087A (zh) 2017-02-08 2018-12-01 加拿大國家研究委員會 具改良之熱穩定性的分子油墨

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794518A (en) * 1972-05-01 1974-02-26 Trw Inc Electrical resistance material and method of making the same
DE2240493C3 (de) * 1972-08-17 1978-04-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Durchdringungsverbundmetall als Kontaktwerkstoff für Vakuumschalter und Verfahren zu seiner Herstellung
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
GB2085339A (en) * 1980-10-14 1982-04-28 Standard Telephones Cables Ltd Solderable paint
US4521329A (en) * 1983-06-20 1985-06-04 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS61411A (ja) * 1984-06-12 1986-01-06 Mitsubishi Plastics Ind Ltd 油水分離器

Also Published As

Publication number Publication date
CA1278912C (en) 1991-01-15
EP0240654B1 (en) 1991-05-29
JPS62184704A (ja) 1987-08-13
US4687597A (en) 1987-08-18
EP0240654A1 (en) 1987-10-14
KR900006510B1 (ko) 1990-09-03
KR870007533A (ko) 1987-08-20
DE3770309D1 (de) 1991-07-04
GR3002071T3 (en) 1992-12-30
JPH0727727B2 (ja) 1995-03-29
IE59654B1 (en) 1994-03-09
IE870216L (en) 1987-07-29
DK44687D0 (da) 1987-01-28

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